Patents by Inventor Chun-An Hsieh
Chun-An Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250093104Abstract: A furnace tube positioning seat includes a base and at least one shock-absorbing structure. The base has at least one round groove that extends in a groove-extending direction for allowing at least a portion of the furnace tube to be received therein. The at least one shock-absorbing structure includes a connecting member and a shock-absorbing member. The connecting member protrudes outwardly from a groove defining wall of the base which defines the round groove. The shock-absorbing member includes a shock-absorbing strip that is adapted for allowing the furnace tube to lean thereagainst, and two clamping strips that extend respectively from two opposite sides of the shock-absorbing strip in the groove-extending direction. The shock-absorbing strip and the clamping strips cooperatively define an insertion groove that allows the connecting member to be removably inserted therein.Type: ApplicationFiled: July 26, 2024Publication date: March 20, 2025Inventors: Yung-Ching HSIEH, Ming-Chun HSIEH
-
Publication number: 20250087571Abstract: A package structure includes a carrier substrate and a die. The carrier substrate includes through carrier vias (TCV). The die is disposed over the carrier substrate. The die includes a semiconductor substrate and conductive posts disposed over the semiconductor substrate. The semiconductor substrate is located between the conductive posts and the carrier substrate.Type: ApplicationFiled: November 21, 2024Publication date: March 13, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sung-Yueh Wu, Chien-Ling Hwang, Jen-Chun Liao, Ching-Hua Hsieh, Pei-Hsuan Lee, Chia-Hung Liu
-
Patent number: 12249979Abstract: A signal converting circuit includes a phase interpolator circuit and a bias voltage generation circuit. The phase interpolator circuit is configured to convert a plurality of input clock signals into an output clock signal according to a digital signal. The bias voltage generation circuit is electrically coupled to the phase interpolator circuit, is configured to generate a bias voltage according to a reference information and is configured to output the bias voltage to the phase interpolator circuit, so that the output clock signal has a predetermined phase corresponding to one of a plurality of bit configurations of the digital signal, wherein the reference information is relevant to a change of the phase interpolator circuit due to a temperature variation.Type: GrantFiled: February 24, 2023Date of Patent: March 11, 2025Assignee: Realtek Semiconductor CorporationInventors: Chien-Tsu Yeh, Hsi-En Liu, Yi-Chun Hsieh
-
Patent number: 12245834Abstract: A medical device is provided. The medical device includes a shaft motor, a parallel manipulator, a receiving yoke, a runner and a transmission yoke. The shaft motor is configured to generate a mechanical force for manipulating a surgical tool. The parallel manipulator includes an end platform used to support the surgical tool, a base platform used to support the shaft motor and a plurality of limbs coupled between the end platform and the base platform. The limbs are configured to control movement of the end platform. The receiving yoke is coupled to the surgical tool. The runner is slidingly engaged to the shaft motor and configured to receive the mechanical force. The transmission yoke is coupled to the runner and the receiving yoke, and the transmission yoke is configured to transfer the mechanical force to the receiving yoke.Type: GrantFiled: August 16, 2023Date of Patent: March 11, 2025Assignee: POINT ROBOTICS (SINGAPORE) PTE. LTD.Inventors: Kun-Pin Huang, Chih-Hsiang Hsieh, Chao-Wei Wu, Ming-Chun Ho
-
Patent number: 12249493Abstract: A method includes loading a wafer over a wafer chuck in a process chamber; performing a deposition process on the loaded wafer; supplying a fluid medium to a fluid guiding structure in the wafer chuck from a fluid inlet port on the wafer chuck, the fluid guiding structure comprising a plurality of arc-shaped channels fluidly communicated with each other; guiding the fluid medium from a first one of the arc-shaped channels of the fluid guiding structure to a second one of the arc-shaped channels of the fluid guiding structure. The second one of the arc-shaped channels of the fluid guiding structure is concentric with the first one of the arc-shaped channels of the fluid guiding structure from a top view.Type: GrantFiled: February 22, 2023Date of Patent: March 11, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Sheng-Chun Yang, Yi-Ming Lin, Po-Wei Liang, Chu-Han Hsieh, Chih-Lung Cheng, Po-Chih Huang
-
Publication number: 20250079237Abstract: A metal interconnect structure includes a first metal interconnection in an inter-metal dielectric (IMD) layer on a substrate, a second metal interconnection on the first metal interconnection, and a cap layer between the first metal interconnection and the second metal interconnection. Preferably, a top surface of the first metal interconnection is even with a top surface of the IMD layer and the cap layer is made of conductive material.Type: ApplicationFiled: November 18, 2024Publication date: March 6, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Yi-How Chou, Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Shih-Chun Tsai, Kun-Chen Ho, Yang-Chou Lin
-
Patent number: 12243805Abstract: An integrated circuit (IC) with through-circuit vias (TCVs) and methods of forming the same are disclosed. The IC includes a semiconductor device, first and second interconnect structures disposed on first and second surfaces of the semiconductor device, respectively, first and second inter-layer dielectric (ILD) layers disposed on front and back surfaces of the substrate, respectively, and a TCV disposed within the first and second interconnect structures, the first and second ILD layers, and the substrate. The TCV is spaced apart from the semiconductor device by a portion of the substrate and portions of the first and second ILD layers. A first end of the TCV, disposed over the front surface of the substrate, is connected to a conductive line of the first interconnect structure and a second end of the TCV, disposed over the back surface of the substrate, is connected to a conductive line of the second interconnect structure.Type: GrantFiled: July 29, 2022Date of Patent: March 4, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Jian-Hong Lin, Hsin-Chun Chang, Ming-Hong Hsieh, Ming-Yih Wang, Yinlung Lu
-
Patent number: 12242488Abstract: A user preference hierarchy is determined from user response to images. Images may be tagged using machine learning models trained to determine values for images. Products are clustered according to product vectors. Images of products within a cluster are clustered according to composition and groups of images are selected from image clusters for soliciting feedback regarding user preference for products of a cluster. Feedback is used to train a user preference model to estimate affinity for a product vector. A user may provide feedback regarding a price point and products are weighted according to a distribution about the price point. The distribution may be asymmetrical according to direction of movement of the price point. Filters may be dynamically defined and presented to a user based on popularity and frequency of occurrence of attribute-value pairs of search results and based on feedback regarding the search results.Type: GrantFiled: June 26, 2023Date of Patent: March 4, 2025Assignee: Pinterest, Inc.Inventors: Navin Agarwal, Judy Yi-Chun Hsieh, Debbie Ayano Limongan, Lianghao Chen, Amit Aggarwal, Julie Bornstein
-
Publication number: 20250072007Abstract: A MRAM layout structure with multiple unit cells, including a first word line, a second word line and a third word line extending through active areas, wherein two ends of a first MTJ are connected respectively to a second active area and one end of a second MTJ, and two ends of a third MTJ are connected respectively to a third active area and one end of a fourth MTJ, and a first bit line and a second bit line connected respectively to the other end of the second MTJ and the other end of the fourth MTJ.Type: ApplicationFiled: November 13, 2024Publication date: February 27, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Yi-Ting Wu, Cheng-Tung Huang, Jen-Yu Wang, Yung-Ching Hsieh, Po-Chun Yang, Jian-Jhong Chen, Bo-Chang Li
-
Patent number: 12235513Abstract: An optical element driving system is provided. The optical element driving system includes an optical element driving mechanism and a control assembly. The optical element driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is used for connecting to an optical element. The movable portion is movable relative to the fixed portion. The movable portion is in an accommodating space in the fixed portion. The driving assembly is used for driving the movable portion to move relative to the fixed portion. The control assembly provides a driving signal to the driving assembly to control the driving assembly. The driving assembly includes a first driving element, and the material of the first driving element includes shape memory alloy.Type: GrantFiled: May 9, 2023Date of Patent: February 25, 2025Assignee: TDK TAIWAN CORP.Inventors: Shun-Chieh Tang, Chen-Chi Kuo, Yi-Chun Cheng, Ming-Chun Hsieh, Ya-Hsiu Wu, Ying-Jen Wang, Sin-Jhong Song
-
Patent number: 12237341Abstract: A display panel includes a substrate, first, second, and third data lines, scan lines, a first active device, a second active device, and pixel electrodes. The first and the third data lines have a first polarity. The second data line has a second polarity. The first polarity is different from the second polarity. A source electrode of the first active device disposed between the first data line and the second data line is electrically connected to the first data line. An extension region of the semiconductor pattern of the first active device extends toward and overlaps the second data line. A source electrode of the second active device disposed between the second data line and the third data line is electrically connected to the second data line. An extension region of the semiconductor pattern of the second active device extends toward and overlaps the third data line.Type: GrantFiled: December 27, 2022Date of Patent: February 25, 2025Assignee: AUO CorporationInventors: Hsiu-Chun Hsieh, Shu-Hui Huang, Yi-Wei Chen
-
Patent number: 12229466Abstract: An image displaying device includes a planar display panel and a light penetrating unit. The planar display panel displays a plane image. The planar display panel at least includes a first pixel group, a second pixel group and a third pixel group. The second pixel group is located between the first pixel group and the third pixel group. When vision passes through the light penetrating unit toward the planar display panel, the vision acquires a second distance of a second imaging position within the plane image relevant to the second pixel group relative to the planar display panel being greater than a first distance of a first imaging position within the plane image relevant to the first pixel group relative to the planar display panel and a third distance of a third imaging position within the plane image relevant to the third pixel group relative to the planar display panel.Type: GrantFiled: January 10, 2022Date of Patent: February 18, 2025Assignee: Qisda CorporationInventors: Hao-Chun Tung, Hsin-Che Hsieh, Wei-Jou Chen, Po-Fu Wu, Yu-Fu Fan, Chih-Ming Chang
-
Publication number: 20250053039Abstract: An E-paper display panel including an E-paper display layer, a first substrate, a pixel array layer, a common electrode layer, and a driving circuit is provided. The first substrate is disposed at a first side of the E-paper display layer. The pixel array substrate is disposed between the first substrate and the E-paper display layer and includes touch electrodes and driving pixels arranged in an array. Each driving pixel includes a first pixel electrode and a second pixel electrode. The touch electrodes, the first pixel electrode, and the second pixel electrode are overlapped with each other. The common electrode layer is disposed at a second side of the E-paper display layer. The first side is opposite to the second side. The driving circuit is in signal communication with the common electrode layer and the pixel array layer. The touch electrodes are individually in signal communication with the driving circuit.Type: ApplicationFiled: July 11, 2024Publication date: February 13, 2025Applicant: E Ink Holdings Inc.Inventors: Chia-Ming Hsieh, Chi-Mao Hung, Sung-Hui Huang, Chuen-Jen Liu, Liang-Yu Yan, Pei Ju Wu, Po-Chun Chuang, Che-Sheng Chang, Wen-Chung Yang
-
Patent number: 12224836Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a device. The device applies Nso sensing beam vectors to Nso received signals at Nant antennas to obtain Nso measurements, respectively, Nso and Nant each being an integer greater than or equal to 1. The device determines a beam vector based on the Nso measurements and the Nso sensing beam vectors.Type: GrantFiled: December 19, 2022Date of Patent: February 11, 2025Assignee: MEDIATEK INC.Inventors: Chong-You Lee, Jiaxian Pan, Yabo Li, Wei-Jen Chen, Wei-Hsuan Hsieh, Feng Chiu, Da-chun Hsing, Sung-Chiao Li
-
Publication number: 20250046734Abstract: A package includes a first package component; a second package component bonded to the first package component by a first plurality of solder connectors; and a first plurality of spacer connectors extending from the first package component to the second package component. A diameter of a spacer connector the first plurality of spacer connectors is larger than a height of a solder connector of the first plurality of solder connectors, and the first plurality of spacer connectors comprises a different material than the first plurality of solder connectors.Type: ApplicationFiled: October 19, 2023Publication date: February 6, 2025Inventors: Wei-Hung Lin, Chi-Chun Hsieh, Ming-Hua Lo, Chung-Chih Chen, Hsin-Hsien Wu
-
Publication number: 20250043045Abstract: A method for preparing a long-chain branched polypropylene includes subjecting a T-reagent to a polymerization reaction with propylene in the presence of a catalyst composition. The catalyst composition includes an alkylaluminoxane and a metallocene-based catalyst. The metallocene-based catalyst contains a metal selected from the group consisting of titanium (Ti), zirconium (Zr), and hafnium (Hf). The T-reagent having an alkenyl silyl functional group is selected from the group consisting of 1,2-bis[dimethyl(vinyl)silyl]ethane, dimethyldivinylsilane, 7-octenyldimethyl(vinyl)silane, 7-octenyldimethyl(allyl)silane, 4-(but-3-enyl)phenyldimethyl(vinyl)silane, 4-(but-3-enyl)phenyldimethyl(allyl)silane, and combinations thereof.Type: ApplicationFiled: July 30, 2024Publication date: February 6, 2025Inventors: Jing-Cherng Tsai, Kwang-Ming Chen, Jung-Hung Kao, Kun-Pei Hsieh, Chao-Shun Chang, Hsing-Chun Chen, Chun-Wei Chiu, Cheng-Hung Chiang, Yu-Chuan Sung, Shang-Lin Tsai, Yu-Sheng Lin
-
Patent number: 12216413Abstract: A method includes irradiating debris deposited in an extreme ultraviolet (EUV) lithography system with laser, controlling one or more of a wavelength of the laser or power of the laser to selectively vaporize the debris and limit damage to the EUV) lithography system, and removing the vaporized debris.Type: GrantFiled: August 7, 2023Date of Patent: February 4, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chun-Han Lin, Chieh Hsieh, Sheng-Kang Yu, Shang-Chieh Chien, Heng-Hsin Liu, Li-Jui Chen
-
Patent number: 12216326Abstract: An optical member driving mechanism for connecting an optical member is provided, including a fixed portion and a first adhesive member. The fixed portion includes a first member and a second member, wherein the first member is fixedly connected to the second member via the first adhesive member.Type: GrantFiled: March 26, 2021Date of Patent: February 4, 2025Assignee: TDK TAIWAN CORP.Inventors: Hsiang-Chin Lin, Shou-Jen Liu, Guan-Bo Wang, Kai-Po Fan, Chan-Jung Hsu, Shao-Chung Chang, Shih-Wei Hung, Ming-Chun Hsieh, Wei-Pin Chin, Sheng-Zong Chen, Yu-Huai Liao, Sin-Hong Lin, Wei-Jhe Shen, Tzu-Yu Chang, Kun-Shih Lin, Che-Hsiang Chiu, Sin-Jhong Song
-
Patent number: 12216824Abstract: A mute-able input device with keystroke tactile feedback includes: a plurality of keys, each including a tactile structure and a sound-generating structure for respectively generating operational tactile feedback and operating sounds; a plurality of adjusting mechanisms, each including an adjusting portion corresponding to one of the keys; at least one switching unit including an operating portion and a switch member, the operating portion connecting the switch member and the adjusting mechanism, the switch member generating a switching signal involving a mode switching between different tactile modes or different sound modes for one or more keys. When the operating portion moves in response to a force, the switch member is triggered to achieve the mode switching; meanwhile, the adjusting portion moves to interfere with at least one of the tactile structure or the sound-generating structure along with the movement of the operating portion.Type: GrantFiled: August 15, 2022Date of Patent: February 4, 2025Assignee: DARFON ELECTRONICS CORP.Inventors: Yu-Chun Hsieh, Chen Yang, Shao-Lun Hsiao, Po-Yueh Chou
-
Patent number: D1064248Type: GrantFiled: January 31, 2023Date of Patent: February 25, 2025Assignee: Delta Electronics, Inc.Inventors: Ming-Kai Hsieh, Ching-Hsiang Huang, Po-Chun Wang, Kuan-Ting Shen, Hao-Cheng Wang