Patents by Inventor Chun-An Tang

Chun-An Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRIC MACHINE WITH COMPRESSIBLE LAYER
    Publication number: 20200144882
    Abstract: An electric machine includes a stator core, a cylindrical housing circumscribing the core, and an annular compressible layer. The annular compressible layer is received on the core and has an outer surface disposed against the housing. A diameter of the outer surface is larger than a diameter of an inner surface of the core to form an interference fit between the housing and the compressible layer.
    Type: Application
    Filed: November 2, 2018
    Publication date: May 7, 2020
    Inventors: Chun TANG, Joel HETRICK, Shailesh Shrikant KOZAREKAR
  • Packaged Semiconductor Devices and Packaging Methods
    Publication number: 20200118971
    Abstract: Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a first molding material disposed around the integrated circuit die, and a through-via disposed within the first molding material. A first side of a redistribution layer (RDL) is coupled to the integrated circuit die, the through-via, and the first molding material. A second molding material is over a second side of the RDL, the second side of the RDL being opposite the first side of the RDL. The packaged semiconductor device includes an antenna over the second molding material.
    Type: Application
    Filed: December 16, 2019
    Publication date: April 16, 2020
    Inventors: Tzu-Chun Tang, Chuei-Tang Wang, Chun-Lin Lu, Wei-Ting Chen, Vincent Chen, Shou-Zen Chang, Kai-Chiang Wu
  • SEMICONDUCTOR DEVICE
    Publication number: 20200111753
    Abstract: A semiconductor device includes a semiconductor die having an insulative layer and a conductive feature in the insulative layer, and a shield in contact with a lateral surface of the conductive feature. In some embodiments, the lateral surface of the conductive feature is aligned with an edge of the insulating material.
    Type: Application
    Filed: December 4, 2019
    Publication date: April 9, 2020
    Inventors: CHUEI-TANG WANG, VINCENT CHEN, TZU-CHUN TANG, CHEN-HUA YU, CHING-FENG YANG, MING-KAI LIU, YEN-PING WANG, KAI-CHIANG WU, SHOU ZEN CHANG, WEI-TING LIN, CHUN-LIN LU
  • ELECTRIC MACHINE WITH REDUCED HOUSING RESONANCE
    Publication number: 20200112226
    Abstract: An electric machine includes a cylindrical stator core and a cylindrical housing having an inner diameter. The core has an outer surface and a plurality of projections extending therefrom. An outer diameter of the core measured between tips of diametrically opposing projections is greater than the inner diameter. The core is disposed in the housing with the tips engaging the inner diameter to create an interference fit between the core and housing to reduce housing resonance.
    Type: Application
    Filed: October 9, 2018
    Publication date: April 9, 2020
    Inventors: Shailesh Shrikant KOZAREKAR, Chun TANG, Joel HETRICK
  • INTEGRATED FAN-OUT PACKAGE
    Publication number: 20200105687
    Abstract: An integrated fan-out (InFO) package includes a first redistribution structure, a plurality of dies, a plurality of first conductive structures, an encapsulant, a second redistribution structure, and insulating layer, a plurality of second conductive structures, an antenna confinement structure, and a slot antenna. The dies and the first conductive structures are disposed on the first redistribution structure. The first conductive structures surround the dies. The encapsulant encapsulates the dies and the first conductive structures. The second redistribution structure is disposed on the dies, the first conductive structures, and the encapsulant. The insulating layer is over the second redistribution structure. The second conductive structures and the antenna confinement structure are embedded in the insulating layer. The slot antenna is disposed on the insulating layer.
    Type: Application
    Filed: November 22, 2018
    Publication date: April 2, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chuei-Tang Wang, Tzu-Chun Tang, Chieh-Yen Chen, Che-Wei Hsu
  • ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20200106156
    Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a chip package, an antenna pattern, and an insulating layer. The chip package includes a semiconductor die and an insulating encapsulation enclosing the semiconductor die. The antenna pattern is electrically coupled to the chip package, where a material of the antenna pattern comprises a conductive powder having fused metal particles. The insulating layer disposed between the chip package and the antenna pattern, where the antenna pattern includes a first surface in contact with the insulating layer, and a second surface opposite to the first surface, and a surface roughness of the second surface is greater than a surface roughness of the first surface.
    Type: Application
    Filed: April 18, 2019
    Publication date: April 2, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Lin Lu, Hsiu-Jen Lin, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho, Wei-Yu Chen, Yu-Peng Tsai, Chia-Lun Chang, Chia-Shen Cheng, Chih-Chiang Tsao, Tzu-Chun Tang, Ching-Hua Hsieh, Tuan-Yu Hung, Cheng-Shiuan Wong
  • Housing assembly and electronic device
    Patent number: 10602641
    Abstract: A housing assembly has an insertion opening adapted for insertion of an electronic unit and includes a first housing, a second housing, a thermal pad, and a guide structure. The second housing is opposite to the first housing, a space is formed between the first housing and the second housing, and the space is in communication with the insertion opening. The thermal pad is disposed on one side of the first housing facing the second housing. The guide structure is disposed inside the space and is adapted to guide the electronic unit to move towards the first housing when the electronic unit is inserted into the space through the insertion opening and moves, so that the electronic unit comes into contact with the thermal pad.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: March 24, 2020
    Assignee: PEGATRON CORPORATION
    Inventors: Kai-Ming Chang, Chou-Hsiung Chuang, Chun-Tang Hsu, Yu-Juei Chang
  • METHOD OF MANUFACTURING SUBSTRATE STRUCTURE WITH FILLING MATERIAL FORMED IN CONCAVE PORTION
    Publication number: 20200091059
    Abstract: Provided is a substrate structure including a substrate body, electrical contact pads and an insulating protection layer disposed on the substrate body, wherein the insulating protection layer has openings exposing the electrical contact pads, and at least one of the electrical contact pads has at least a concave portion filled with a filling material to prevent solder material from permeating along surfaces of the insulating protection layer and the electric contact pads, thereby eliminating the phenomenon of solder extrusion. Thus, bridging in the substrate structure can be eliminated even when the bump pitch between two adjacent electrical contact pads is small. As a result, short circuits can be prevented, and production yield can be increased.
    Type: Application
    Filed: November 21, 2019
    Publication date: March 19, 2020
    Inventors: Chang-Fu Lin, Chin-Tsai Yao, Chun-Tang Lin, Fu-Tang Huang
  • Stacked Coil for Wireless Charging Structure on InFO Package
    Publication number: 20200090855
    Abstract: A structure includes a first encapsulating layer, and a first coil in the first encapsulating layer. A top surface of the first encapsulating layer is coplanar with a top surface of the first coil, and a bottom surface of the first encapsulating layer is coplanar with a bottom surface of the first coil. A second encapsulating layer is over the first encapsulating layer. A conductive via is in the second encapsulating layer, and the first conductive via is electrically coupled to the first coil. A third encapsulating layer is over the second encapsulating layer. A second coil is in the third encapsulating layer. A top surface of the third encapsulating layer is coplanar with a top surface of the second coil, and a bottom surface of the third encapsulating layer is coplanar with a bottom surface of the second coil.
    Type: Application
    Filed: November 25, 2019
    Publication date: March 19, 2020
    Inventors: Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen, Hung-Yi Kuo
  • Electric Machine Winding Assembly
    Publication number: 20200044507
    Abstract: An electric machine winding assembly including a stator and windings is provided. The stator may define a central axis. The windings may extend from the stator and each may include a pair of conductor ends. Each conductor end may include a minor side and a major side. The windings are arranged with the stator such that each of the major sides are aligned along a circumferential conductor axis relative to the central axis to facilitate welding adjacent conductor ends to one another. Each of the windings may further include two portions defining a U shape. Each of the two portions may include a lower portion, a mid-portion, and an upper portion. One of the mid-portions may include a first bend defining a twist shape to orient the major sides of one of the pair of conductor ends along the circumferential conductor axis.
    Type: Application
    Filed: August 3, 2018
    Publication date: February 6, 2020
    Applicant: Ford Global Technologies, LLC
    Inventors: Chun Tang, Huifen Qiu
  • ELECTRIC MACHINE WITH SLOT CLOSERS
    Publication number: 20200021159
    Abstract: An electric machine includes a stator having teeth that define open slots and slot closers disposed in the slots. Each slot closers includes a flux bridge surrounded by a nonmagnetic case. The slot closer is disposed between adjacent ones of the teeth with the case engaging and spanning the adjacent teeth. The case forms nonmagnetic gaps between the flux bridge and the adjacent teeth, respectively, to reduce potential for torque ripple.
    Type: Application
    Filed: July 11, 2018
    Publication date: January 16, 2020
    Inventors: Andrew KASHA, Jacob KRIZAN, Chun TANG
  • Substrate structure with filling material formed in concave portion
    Patent number: 10522453
    Abstract: Provided is a substrate structure including a substrate body, electrical contact pads and an insulating protection layer disposed on the substrate body, wherein the insulating protection layer has openings exposing the electrical contact pads, and at least one of the electrical contact pads has at least a concave portion filled with a filling material to prevent solder material from permeating along surfaces of the insulating protection layer and the electric contact pads, thereby eliminating the phenomenon of solder extrusion. Thus, bridging in the substrate structure can be eliminated even when the bump pitch between two adjacent electrical contact pads is small. As a result, short circuits can be prevented, and production yield can be increased.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: December 31, 2019
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chang-Fu Lin, Chin-Tsai Yao, Chun-Tang Lin, Fu-Tang Huang
  • Electric machine rotor
    Patent number: 10523072
    Abstract: An electric machine may include a plurality of sections, each defining a permanent magnet pocket and a field formation chamber. The sections may be stacked to form a rotor such that when walls of the permanent magnet pockets are aligned from end to end, walls of the chambers of at least some of the sections are offset. An adjacent pair of the sections may have different chamber to pocket relative positions to define different pole arc angles. A difference between the first pole arc angle and the second pole arc angle may be equal to a slot pitch of a stator of the electric machine. The slot pitch may be 7.5 mechanical degrees. The chamber may be defined on a radially outward edge of the pocket. The chamber may taper in a radially outward direction.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: December 31, 2019
    Assignee: Ford Global Technologies, LLC
    Inventors: Chun Tang, Wei Wu, Joel Hetrick
  • ELECTRIC MACHINE ROTOR
    Publication number: 20190393747
    Abstract: An electric machine rotor includes a core, a first end plate, a second end plate, and a shaft. The core defines an internal cavity. The first and second end plates each define a central orifice and are respectively secured to opposing axial ends of the core. The shaft is disposed within the cavity and engages the first and second end plates within the central orifices to facilitate synchronized rotation of and torque transfer between the core and shaft.
    Type: Application
    Filed: June 26, 2018
    Publication date: December 26, 2019
    Inventors: Chun TANG, Cyrille GOLDSTEIN, Jacob KRIZAN
  • SLOT MODULE AND ELECTRONIC DEVICE USING THE SLOT MODULE
    Publication number: 20190384365
    Abstract: A slot module and an electronic device using the same are provided. The slot module includes a base, a slot member, a heat sink and a position limiting member. One end of the slot member is pivotally connected to the base, such that the slot member is adapted to rotate relative to the base, and a functional element is adapted to be inserted into the slot member. The heat sink and the position limiting member are all disposed on the base, wherein the position limiting member is adapted to be rotated from a first position to a second position to buckle the slot member, such that the functional component inserted into the slot member contacts the heat sink.
    Type: Application
    Filed: June 18, 2019
    Publication date: December 19, 2019
    Applicant: PEGATRON CORPORATION
    Inventor: Chun-Tang Hsu
  • Semiconductor device
    Patent number: 10510681
    Abstract: A semiconductor device includes a semiconductor die, an insulative layer, a plurality of conductive features, a dummy redistribution layer (RDL), and an Electromagnetic Interference (EMI) shield. The insulative layer covers the semiconductor die. The conductive features substantially surround the insulative layer. The dummy RDL is over the insulative layer and electrically disconnected from the semiconductor die. The EMI shield is in contact with the plurality of conductive features and the dummy RDL.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: December 17, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang, Ming-Kai Liu, Yen-Ping Wang, Kai-Chiang Wu, Shou Zen Chang, Wei-Ting Lin, Chun-Lin Lu
  • Packaged semiconductor devices and packaging methods
    Patent number: 10510714
    Abstract: Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a first molding material disposed around the integrated circuit die, and a through-via disposed within the first molding material. A first side of a redistribution layer (RDL) is coupled to the integrated circuit die, the through-via, and the first molding material. A second molding material is over a second side of the RDL, the second side of the RDL being opposite the first side of the RDL. The packaged semiconductor device includes an antenna over the second molding material.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Chun Tang, Chuei-Tang Wang, Chun-Lin Lu, Wei-Ting Chen, Vincent Chen, Shou-Zen Chang, Kai-Chiang Wu
  • Stacked coil for wireless charging structure on InFO package
    Patent number: 10510478
    Abstract: A structure includes a first encapsulating layer, and a first coil in the first encapsulating layer. A top surface of the first encapsulating layer is coplanar with a top surface of the first coil, and a bottom surface of the first encapsulating layer is coplanar with a bottom surface of the first coil. A second encapsulating layer is over the first encapsulating layer. A conductive via is in the second encapsulating layer, and the first conductive via is electrically coupled to the first coil. A third encapsulating layer is over the second encapsulating layer. A second coil is in the third encapsulating layer. A top surface of the third encapsulating layer is coplanar with a top surface of the second coil, and a bottom surface of the third encapsulating layer is coplanar with a bottom surface of the second coil.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen, Hung-Yi Kuo
  • Acid-relief agent and method of preparation
    Publication number: 20190374594
    Abstract: An acid-relief agent comprising a fermented vegetable extract obtained from a mixture of banana leaves, sweet potato roots, potato skin, seaweed, grape leaves, tendrils leaves, fig roots, emperor bean roots, and deep sea water; and nanocalcium mineral powder obtained from the thermal decomposition and grinding of a mixture of mica ore, mother of pearl, oyster shells. and oyster bay.
    Type: Application
    Filed: August 10, 2018
    Publication date: December 12, 2019
    Inventor: Tieh-Chun Tang
  • Electric machine rotor including nested V-shaped inner and outer pockets
    Patent number: 10491064
    Abstract: A rotor includes nested V-shaped inner and outer pockets defining corresponding pole arc angles relative to a common center bridge axis and vertex, respective inner and outer top bridges, and respective inner and outer center bridges. A ratio of corresponding pole arc angle dependent functions and a ratio of a sum of the inner top bridges and center bridge widths to a sum of the outer top bridges and center bridge widths are same.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: November 26, 2019
    Assignee: Ford Global Technologies, LLC
    Inventor: Chun Tang