Patents by Inventor Chun Che

Chun Che has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Barrier Layer and Structure Method
    Publication number: 20150235954
    Abstract: A method for forming a multilayer barrier comprises forming a conductive line over a substrate, depositing a dielectric layer over the conductive line, forming a plug opening in the dielectric layer, forming a multilayer barrier through a plurality of deposition processes and corresponding plasma treatment processes.
    Type: Application
    Filed: February 14, 2014
    Publication date: August 20, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chung Chang, Jung-Chih Tsao, Chun Che, Yu-Ming Huang, Tain-Shang Chang, Jian-Shin Tsai