Abstract: A protection tape includes a base film, an antistatic layer and an adhesive layer. The antistatic layer is located on the base film. The surface impedance of the antistatic layer is less than 1E+9?, and the antistatic layer includes a first resin and conductive materials dispersed in the first resin. The conductive materials include at least one of metal ions and carbon. The adhesive layer is located on a corona treated surface of the base film. The protection tape provided by the present disclosure has the advantage of having resistant to corona treatment.

Abstract: An image conversion device includes: a lens module configured to allow passing of image light beams of an object, an optical waveguide element configured to transmit the image light beams to a light processing component, and an image sensor configured to convert the image light beams into digital image signals. By changing image capturing and image forming methods, higher image quality may be achieved and expanding flexibility may be maintained.

Abstract: A quantum dot oil-based ink is provided. The quantum dot oil-based ink includes a quantum dot material, a dispersing solvent, a viscosity modifier, and a surface tension modifying solution. The dispersing solvent includes a linear alkane having 6 to 14 carbon atoms. The viscosity modifier includes an aromatic hydrocarbon having 10 to 18 carbon atoms or a linear olefin having 16 to 20 carbon atoms. The surface tension modifying solution includes a hydrophobic polymer material and a nonpolar solvent.

Abstract: An optical photographing lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The second lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof. The third lens element has two surfaces being both aspheric. The fourth lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof, wherein two surfaces thereof are aspheric. The fifth lens element has an image-side surface being convex in a paraxial region thereof, wherein two surfaces thereof are aspheric.

Abstract: This disclosure provides an image capturing optical lens assembly including, in order from an object side to an image side: a first lens element with refractive power having an object-side surface being convex in a paraxial region thereof a second lens element having positive refractive power; a third lens element with refractive power having an image-side surface being concave in a paraxial region thereof a fourth lens element with refractive power having an image-side surface being concave in a paraxial region thereof, wherein both surfaces thereof being aspheric; a fifth lens element with refractive power having an object-side surface being concave in a paraxial region thereof and a sixth lens element with refractive power having an image-side surface being concave in a paraxial region thereof, wherein both surfaces thereof being aspheric, and the image-side surface having at least one convex shape in an off-axis region thereof.

Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.

Abstract: An interposer substrate is manufactured with a scribe line between adjacent regions. In an embodiment a separate exposure reticle is utilized to pattern the scribe line. The exposure reticle to pattern the scribe line will create an exposure region which overlaps and overhangs the exposure regions utilized to form adjacent regions.

Abstract: An interposer substrate is manufactured with a scribe line between adjacent regions. In an embodiment a separate exposure reticle is utilized to pattern the scribe line. The exposure reticle to pattern the scribe line will create an exposure region which overlaps and overhangs the exposure regions utilized to form adjacent regions.

Abstract: An interposer substrate is manufactured with a scribe line between adjacent regions. In an embodiment a separate exposure reticle is utilized to pattern the scribe line. The exposure reticle to pattern the scribe line will create an exposure region which overlaps and overhangs the exposure regions utilized to form adjacent regions.

Abstract: An interposer substrate is manufactured with a scribe line between adjacent regions. In an embodiment a separate exposure reticle is utilized to pattern the scribe line. The exposure reticle to pattern the scribe line will create an exposure region which overlaps and overhangs the exposure regions utilized to form adjacent regions.

Abstract: A foldable stand includes two stand legs pivotally connected together. A positioning unit is set between the two stand legs and includes a first link pivotally connected to a second link, a locating plate mounted in the first link and a locking pin mounted in the second link. The foldable stand also includes a control unit having a first pedal mounted at the second link and pressable to move the first and second links toward each other into a folded position. In the folded position, the locking pin is forced into engagement with the locating plate. A second pedal is pivotally connected to the second link and pressable to pull the locking pin out of the locating plate for enabling the two stand legs to be biased from the folded position to an extended position.

Abstract: A foldable stand includes two stand legs pivotally connected together. A positioning unit is set between the two stand legs and includes a first link pivotally connected to a second link, a locating plate mounted in the first link and a locking pin mounted in the second link. The foldable stand also includes a control unit having a first pedal mounted at the second link and pressable to move the first and second links toward each other into a folded position. In the folded position, the locking pin is forced into engagement with the locating plate. A second pedal is pivotally connected to the second link and pressable to pull the locking pin out of the locating plate for enabling the two stand legs to be biased from the folded position to an extended position.

Abstract: A computer input device includes a body and a trace-detecting module coupled to the body. The body has a micro control unit (MCU), and the trace-detecting module has a light pervious area, and a trace-detecting unit. The trace-detecting unit further includes a light source and a sensor. The sensor senses a reflected light beam for a user's digit movement on the light pervious area at a velocity which can be sensed by the sensor. If an automatically scrolling mode is activated and the velocity exceeds a threshold stored in the MCU, then the MCU executes automatic scrolling at a predetermined scrolling speed.

Abstract: A method of forming a contact opening is provided. First, a substrate having a plurality of conductive structures formed thereon is provided. An ion implantation is performed. Thereafter, a thermal treatment is carried out to form a liner layer on the sidewall of the conductive structure and the exposed substrate. The liner layer on the sidewall of the conductive structure has a thickness smaller than the liner layer on the substrate surface. A spacer is formed on each side of the conductive structure and then an insulation layer is formed over the substrate. The insulation layer is patterned to form a contact opening between two neighboring conductive structures. Since the liner layer on the sidewall of the conductive structures is already quite thin, there is no need to reduce thickness through an etching operation and uniformity of the liner layer on the substrate can be ensured.

Abstract: A method of forming a contact opening is provided. First, a substrate having a plurality of conductive structures formed thereon is provided. An ion implantation is performed. Thereafter, a thermal treatment is carried out to form a liner layer on the sidewall of the conductive structure and the exposed substrate. The liner layer on the sidewall of the conductive structure has a thickness smaller than the liner layer on the substrate surface. A spacer is formed on each side of the conductive structure and then an insulation layer is formed over the substrate. The insulation layer is patterned to form a contact opening between two neighboring conductive structures. Since the liner layer on the sidewall of the conductive structures is already quite thin, there is no need to reduce thickness through an etching operation and uniformity of the liner layer on the substrate can be ensured.

Abstract: A method for manufacturing a semiconductor device includes providing a dielectric layer over a substrate, providing a first photoresist layer over the dielectric layer, patterning and defining the first photoresist layer, etching the first photoresist layer and the dielectric layer to form a plurality of vertical openings, removing the first photoresist layer, depositing a second photoresist layer over the dielectric layer, wherein the second photoresist layer fills the plurality of vertical openings, removing only a portion of the second photoresist layer deposited over the dielectric layer, wherein the second photoresist layer has a first substantially uniform thickness over the dielectric layer, depositing an anti-reflection coating layer over the second photoresist layer, providing a third photoresist layer over the anti-reflection coating layer, patterning and defining the third photoresist layer, and etching the anti-reflection coating layer and the second photoresist layer to form a plurality of trench

Abstract: A method for manufacturing a semiconductor device includes providing a dielectric layer over a substrate, providing a first photoresist layer over the dielectric layer, patterning and defining the first photoresist layer, etching the first photoresist layer and the dielectric layer to form a plurality of vertical openings, removing the first photoresist layer, depositing a second photoresist layer over the dielectric layer, wherein the second photoresist layer fills the plurality of vertical openings, removing only a portion of the second photoresist layer deposited over the dielectric layer, wherein the second photoresist layer has a first substantially uniform thickness over the dielectric layer, depositing an anti-reflection coating layer over the second photoresist layer, providing a third photoresist layer over the anti-reflection coating layer, patterning and defining the third photoresist layer, and etching the anti-reflection coating layer and the second photoresist layer to form a plurality of trench

Abstract: A method for forming contacts in a semiconductor device including a plurality of active devices formed over a substrate that includes depositing a first layer of dielectric material over the substrate and plurality of active devices, forming a first opening in the first layer of dielectric material, depositing a second layer of dielectric material over the first layer of dielectric material and in the first opening, providing a mask over the second layer of dielectric material, wherein the mask material is distinguishable over silicon oxides, and forming a second opening and a third opening in the second layer of dielectric material, wherein the second opening is aligned with the first opening and exposes a first silicide of a first active device, and the third opening exposes one of diffused regions of a second active device.