Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: Example methods are provided to improve placement of an adaptor (210,220) to a mobile computing device (100) to measure a test strip (221) coupled to the adaptor (220) with a camera (104) and a screen (108) on a face of the mobile computing device (100). The method may include displaying a light area on a first portion of the screen (108). The first portion may be adjacent to the camera (104). The light area and the camera (104) may be aligned with a key area of the test strip (221) so that the camera (104) is configured to capture an image of the key area. The method may further include providing first guiding information for a user to place the adaptor (210,220) to the mobile computing device (100) according to a position of the light area on the screen (108).

Abstract: A method is provided. The method includes determining a first bump map indicative of a first set of positions of bumps. The method includes determining, based upon the first bump map, a first plurality of bump densities associated with a plurality of regions of the first bump map. The method includes smoothing the first plurality of bump densities to determine a second plurality of bump densities associated with the plurality of regions of the first bump map. The method includes determining, based upon the second plurality of bump densities, a second bump map indicative of the first set of positions of the bumps and a set of sizes of the bumps.

Abstract: A power supply assembly includes a power supply unit disposed within a housing and an adjustable plate module movably disposed on a floor thereof. The adjustable plate module includes a plate, a shaft, a stopper panel, and a compressible device. The plate has two planar surfaces positioned at different heights with respect to the floor. The shaft is fixedly coupled to and extends outwardly from the plate. The shaft is configured to move between a first position and a second position to transition a connector between the planar surfaces. The stopper panel is disposed adjacent to a distal end of the shaft and has an opening therein for accommodating the shaft. The compressible device is disposed around the shaft such that a displacement of the plate causes the compressible device to compress against the stopper panel and facilitate movement of the shaft from the first position to the second position.

Abstract: A power supply unit (PSU) housing configured to receive a PSU is disclosed. The PSU housing includes a top panel, a bottom panel opposite to the top panel, a first side panel, a second side panel opposite to the first side panel, and a PSU cover. The first side panel and the second side panel define a width of the PSU housing. The PSU cover extends along the width of the PSU housing. The PSU cover includes a first elongated plate and a second elongated plate, which are perpendicular to each other. The PSU cover is rotatable relative to the top panel, such that (i) in a first orientation, the first elongated plate of the PSU cover is above and parallel to the top panel, and (ii) in a second orientation, the second elongated plate of the PSU cover is about flush and parallel to the top panel.

Abstract: A die-cast cooling device for protecting a computer assembly is disclosed. The die-cast cooling device includes a cooling plate, a plurality of die-cast fins, an opening formed on the cooling plate, and a cover coupled to the cooling plate. The cooling plate extends between two side walls, and the cooling plate and the side walls are arranged to form a protective space for computing components. The plurality of die-cast fins are formed on the cooling plate, extending away from the protective space. The opening provides access to the protective space. The cover is movable between a closed position and an open position, the cover preventing access to the protective space in the closed position, and the cover providing access to the protective space in the open position.

Abstract: A power supply assembly includes a power supply unit disposed within a housing and an adjustable plate module movably disposed on a floor thereof. The adjustable plate module includes a plate, a shaft, a stopper panel, and a compressible device. The plate has two planar surfaces positioned at different heights with respect to the floor. The shaft is fixedly coupled to and extends outwardly from the plate. The shaft is configured to move between a first position and a second position to transition a connector between the planar surfaces. The stopper panel is disposed adjacent to a distal end of the shaft and has an opening therein for accommodating the shaft. The compressible device is disposed around the shaft such that a displacement of the plate causes the compressible device to compress against the stopper panel and facilitate movement of the shaft from the first position to the second position.

Abstract: A system is disclosed that is configured to secure a connection between a component and at least one wire, such as an antenna, within a computer. The system includes a retainer configured to move between a first position and a second position. The retainer in the first position is configured to secure a connection between at least one connector of the component and the at least one wire within the computer. The retainer in the second position is configured to permit release of the connection between the at least one connector of the component and the at least one wire within the computer, such as by providing access to the connection.

Abstract: An expansion card support device includes an arm configured to rotate between a closed position and an open position relative to an interior surface of a computer housing opposite from one or more interface buses. The arm is substantially parallel to the interior surface in the closed position and substantially perpendicular to the interior surface in the open position. The arm is sized so as to abut edges of one or more expansion cards retained in the one or more interface buses with the arm in the open position. The device further includes a first spring configured to rotate the arm from the closed position to the open position. The device further includes a latch configured to maintain the arm in the closed position with the latch in a latched state.

Abstract: A power supply unit (PSU) housing configured to receive a PSU is disclosed. The PSU housing includes a top panel, a bottom panel opposite to the top panel, a first side panel, a second side panel opposite to the first side panel, and a PSU cover. The first side panel and the second side panel define a width of the PSU housing. The PSU cover extends along the width of the PSU housing. The PSU cover includes a first elongated plate and a second elongated plate, which are perpendicular to each other. The PSU cover is rotatable relative to the top panel, such that (i) in a first orientation, the first elongated plate of the PSU cover is above and parallel to the top panel, and (ii) in a second orientation, the second elongated plate of the PSU cover is about flush and parallel to the top panel.

Abstract: A system is disclosed that is configured to secure a connection between a component and at least one wire, such as an antenna, within a computer. The system includes a retainer configured to move between a first position and a second position. The retainer in the first position is configured to secure a connection between at least one connector of the component and the at least one wire within the computer. The retainer in the second position is configured to permit release of the connection between the at least one connector of the component and the at least one wire within the computer, such as by providing access to the connection.

Abstract: A method of fabricating a semiconductor device includes forming a bottom electrode material layer containing aluminum and copper over the substrate. An insulating material layer and a top electrode material layer are sequentially formed on the surface of the bottom electrode material layer. A photoresist pattern is formed on the top electrode material layer, and then the top electrode material layer is patterned to form a top electrode by using the photoresist pattern as mask. The photoresist pattern is removed by plasma ash and then an alloy process is performed to the bottom electrode material layer. Thereafter, the insulating material layer, and the bottom electrode material layer are patterned to form a patterned insulating layer and a patterned bottom electrode layer.

Abstract: A method of fabricating a semiconductor device includes forming a bottom electrode material layer containing aluminum and cupper over the substrate. An insulating material layer and a top electrode material layer are sequentially formed on the surface of the bottom electrode material layer. A photoresist pattern is formed on the top electrode material layer, and then the top electrode material layer is patterned to form a top electrode by using the photoresist pattern as mask. The photoresist pattern is removed by plasma ash and then an alloy process is performed to the bottom electrode material layer. Thereafter, the insulating material layer, and the bottom electrode material layer are patterned to form a patterned insulating layer and a patterned bottom electrode layer.

Abstract: A capacitor, comprising a substrate, a first electrode and a second electrode is provided. The first electrode is located over a substrate. The second electrode is located over the first electrode and overlapping with a portion of the first electrode. The dielectric layer is located between the first electrode and the second electrode and a portion of the first electrode, a portion of the dielectric layer and a portion of the second electrode, which overlap each other, are together form the capacitor. The first electrode is electrically connected to a first metal interconnects, the second electrode is electrically connected to a second metal interconnects underneath the second electrode and no via for being electrically connected to the second electrode is located over the second electrode.

Abstract: A method of fabricating a semiconductor device is provided. The method includes forming a bottom electrode material layer containing aluminum and cupper over the substrate. An insulating material layer and a top electrode material layer are sequentially formed on the surface of the bottom electrode material layer. A photoresist pattern is formed on the top electrode material layer, and then the top electrode material layer is patterned to form a top electrode by using the photoresist pattern as mask. The photoresist pattern is removed by plasma ash and then an alloy process is performed to the bottom electrode material layer. Thereafter, the insulating material layer, and the bottom electrode material layer are patterned to form a patterned insulating layer and a patterned bottom electrode layer.