Patents by Inventor Chun-chen Wu

Chun-chen Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7932728
    Abstract: A method of fabricating a MEMS device includes conditioning of an insulating layer by applying a voltage across the insulating layer via a conductive sacrificial layer for a period of time, prior to removal of the conductive sacrificial layer. This conditioning process may be used to saturate or stabilize charge accumulated within the insulating layer. The resistance across the insulating layer may also be measured to detect possible defects in the insulating layer.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: April 26, 2011
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Chen-Jean Chou, Chun-chen Wu, Patrick F. Brinkley
  • Publication number: 20090315567
    Abstract: A method of fabricating a MEMS device includes conditioning of an insulating layer by applying a voltage across the insulating layer via a conductive sacrificial layer for a period of time, prior to removal of the conductive sacrificial layer. This conditioning process may be used to saturate or stabilize charge accumulated within the insulating layer. The resistance across the insulating layer may also be measured to detect possible defects in the insulating layer.
    Type: Application
    Filed: June 16, 2009
    Publication date: December 24, 2009
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Chen-Jean Chou, Chun-chen Wu, Patrick F. Brinkley
  • Patent number: 7547568
    Abstract: A method of fabricating a MEMS device includes conditioning of an insulating layer by applying a voltage across the insulating layer via a conductive sacrificial layer for a period of time, prior to removal of the conductive sacrificial layer. This conditioning process may be used to saturate or stabilize charge accumulated within the insulating layer. The resistance across the insulating layer may also be measured to detect possible defects in the insulating layer.
    Type: Grant
    Filed: February 22, 2006
    Date of Patent: June 16, 2009
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Chen-Jean Chou, Chun-chen Wu, Patrick F. Brinkley
  • Publication number: 20070196944
    Abstract: A method of fabricating a MEMS device includes conditioning of an insulating layer by applying a voltage across the insulating layer via a conductive sacrificial layer for a period of time, prior to removal of the conductive sacrificial layer. This conditioning process may be used to saturate or stabilize charge accumulated within the insulating layer. The resistance across the insulating layer may also be measured to detect possible defects in the insulating layer.
    Type: Application
    Filed: February 22, 2006
    Publication date: August 23, 2007
    Inventors: Chen-Jean Chou, Chun-chen Wu, Patrick Brinkley