Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: The present invention further provides a motor control system, which controls a motor through a power line. The motor control system includes a control apparatus and an actuation apparatus. The control apparatus includes a controller and a first communication module electrically connected to the controller. The controller receives a command and converts the command into electrical control signals. The first communication module receives the electrical control signals from the controller and transmits the electrical control signals to the power line. The actuation apparatus includes a second communication module and a motor actuator electrically connected to the second communication module. The second communication module is connected to the power line to receive the electrical control signals from the control apparatus and convert the electrical control signals into a command. The motor actuator receives the command from the second communication module to change the power supplying to the motor.

Abstract: The present invention further provides a motor control system, which controls a motor through a power line. The motor control system includes a control apparatus and an actuation apparatus. The control apparatus includes a controller and a first communication module electrically connected to the controller. The controller receives a command and converts the command into electrical control signals. The first communication module receives the electrical control signals from the controller and transmits the electrical control signals to the power line. The actuation apparatus includes a second communication module and a motor actuator electrically connected to the second communication module. The second communication module is connected to the power line to receive the electrical control signals from the control apparatus and convert the electrical control signals into a command. The motor actuator receives the command from the second communication module to change the power supplying to the motor.