Abstract: A semiconductor device is provided. The semiconductor device includes a plurality of channel layers stacked over a semiconductor substrate and spaced apart from one another, a source/drain structure adjoining the plurality of channel layers, a gate structure wrapping around the plurality of channel layers, and a first inner spacer between the gate structure and the source/drain structure and between the plurality of channel layers. The first inner spacer is made of an oxide of a semiconductor material.

Abstract: A device includes an active region, a gate structure, a source/drain epitaxial structure, an epitaxial layer, a metal alloy layer, a contact, and a contact etch stop layer. The gate structure is across the active region. The source/drain epitaxial structure is over the active region and adjacent the gate structure. The epitaxial layer is over the source/drain epitaxial structure. The metal alloy layer is over the epitaxial layer. The contact is over the metal alloy layer. The contact etch stop layer lines sidewalls of the source/drain epitaxial structure. The metal alloy layer is spaced apart from the contact etch stop layer.

Abstract: An integrated circuit is provided, including a first transistor of a first conductivity type comprising first and second active regions, a second transistor of a second conductivity type comprising third and fourth active regions and arranged under the first transistor along a first direction, a first gate structure extending in the first direction and shared by the first and second transistors, an isolation layer sandwiched between the first and second transistors and extending along a second direction to pass through the first gate structure, and a connection layer surrounded by the isolation layer and extending along the second direction to pass through the first gate structure. The isolation layer has a first surface contacting the first and second active regions and a second surface contacting the third and fourth active regions. The connection layer comprises first and second portions are electrically coupled to the first and fourth active regions.

Abstract: A lock device adapted for a first object and a second object movable relative to the first object includes a slider, a driving module, a latch and a power module. The driving module can drive the slider to move between a locking position and an unlocking position. The latch is movable relative to the slider. The power module can provide electricity to the driving module. When the second object is located at a retracted position relative to the first object, the driving module can drive the slider to move to the locking position, so that the latch blocks the second object. When the driving module is not driven by the power module, the latch is driven by the second object moving in an opening direction to move from an original state to a non-original state for driving the slider to move from the locking position to the unlocking position.

Abstract: A corner reflecting device has at least one corner reflector. The reflector has a first right triangle plate, a second right triangle plate and a first isosceles right triangle plate, and a shape of the first right triangle plate is the same as a shape of the second right triangle plate, and is not an isosceles right triangle plate. A long leg of the second right triangle plate is connected with a long leg of the first right triangle plate. Two legs of the first isosceles right triangle plate are connected with a short leg of the first right triangle plate and a short leg of the second right triangle plate respectively. An intersection of the first right triangle plate, the second right triangle plate, and the first isosceles right triangle plate forms a leak hole.

Abstract: An electrical connector assembly including a first connector and a second connector to be mated with each other is provided. The first connector includes a first body, and at least one first terminal and multiple second terminals disposed therein. The second terminals are symmetrically arranged at opposite sides of the first terminal. The second connector includes a second body, at least one third terminal movably disposed in the second body, multiple fourth terminals disposed in the second body and symmetrically arranged at opposite sides of the third terminal, and a driving module electrically connected to at least one of the fourth terminals and structurally connected to the third terminal. In the mating process of the first and second connector, the second terminals and the fourth terminals are electrically connected firstly, to trigger the driving module to move the third terminal to be structurally and electrically connected to the first terminal.

Abstract: A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein the plurality of dies is electrically connected to the circuit substrate through the interposer structure. The insulating encapsulant is disposed on the circuit substrate, wherein the insulating encapsulant surrounds the plurality of dies and the interposer structure and encapsulates at least the interposer structure, the insulating encapsulant has a groove that surrounds the interposer structure and the plurality of dies, and the interposer structure and the plurality of dies are confined to be located within the groove.

Abstract: A flexible orientation rack cabinet includes a top panel, a bottom panel, first and second edge panels, a first and second flexible mounting flanges. The top panel includes a first U-space adjustment portion. The bottom panel includes a second U-space adjustment portion. The first flexible mounting flange is in physical communication with the first edge panel and includes a third U-space adjustment portion. The second flexible mounting flange is in physical communication with the second edge panel and includes a fourth U-space adjustment portion. The flexible orientation rack cabinet is in a first orientation when multiple first server rails are attached to the first and second U-space adjustment portions.

Abstract: A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein the plurality of dies is electrically connected to the circuit substrate through the interposer structure. The insulating encapsulant is disposed on the circuit substrate, wherein the insulating encapsulant surrounds the plurality of dies and the interposer structure and encapsulates at least the interposer structure, the insulating encapsulant has a groove that surrounds the interposer structure and the plurality of dies, and the interposer structure and the plurality of dies are confined to be located within the groove.

Abstract: A carrier assembly for mounting equipment into a carrier slot includes an electro-magnetic interference (EMI) shield and an EMI finger. The EMI shield protects the mounted equipment from EMI. The EMI shield is formed in a first plane of the carrier assembly. The EMI finger protrudes from the EMI shield and is coupled to the EMI shield. The EMI finger is formed in a second plane perpendicular to the first plane. The EMI finger operates, when the carrier assembly is installed into the carrier slot, to couple the EMI shield to the carrier slot. The EMI finger, when viewed from a first direction that is perpendicular to both the first plane and the second plane, is formed in a tear-drop shape.

Abstract: Example methods are provided to improve placement of an adaptor (210,220) to a mobile computing device (100) to measure a test strip (221) coupled to the adaptor (220) with a camera (104) and a screen (108) on a face of the mobile computing device (100). The method may include displaying a light area on a first portion of the screen (108). The first portion may be adjacent to the camera (104). The light area and the camera (104) may be aligned with a key area of the test strip (221) so that the camera (104) is configured to capture an image of the key area. The method may further include providing first guiding information for a user to place the adaptor (210,220) to the mobile computing device (100) according to a position of the light area on the screen (108).

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: A semiconductor package and a manufacturing method thereof are described. The semiconductor package includes a package having dies encapsulated by an encapsulant, a redistribution circuit structure, first and second modules and affixing blocks. The redistribution circuit structure is disposed on the package. The first and second modules are disposed on and respectively electrically connected to the redistribution circuit structure by first and second connectors disposed there-between. The first and second modules are adjacent to each other and disposed side by side on the redistribution circuit structure. The affixing blocks are disposed on the redistribution circuit structure and between the first and second modules and the redistribution circuit structure. The affixing blocks include first footing portions located below the first module, second footing portions located below the second module, and exposed portions exposed from the first and second modules.

Abstract: A semiconductor structure includes a semiconductor wafer, a first surface mount component, a second surface mount component and a first barrier structure. The first surface mount component is disposed on the semiconductor wafer, and electrically connected to the semiconductor wafer through a plurality of first electrical connectors. The second surface mount component is disposed on the semiconductor wafer, and electrically connected to the semiconductor wafer through a plurality of second electrical connectors, wherein an edge of the second surface mount component is overhanging a periphery of the semiconductor wafer. The first barrier structure is disposed on the semiconductor wafer in between the second electrical connectors and the edge of the second surface mount component, wherein a first surface of the first barrier structure is facing the second electrical connectors, and a second surface of the first barrier structure is facing away from the second electrical connectors.

Abstract: The present invention provides a method for OSA (Obstructive Sleep Apnea) severity detection using recording-based electrocardiography (ECG) Signal. The major feature of the present invention emphasizes on using a recording-based ECG Signal as an input, which is different from the deep learning-based prior art of using segment-based signals as an input to a model, and the segment-based signals has only two classification results, i.e. normal or apnea. The present invention provides a method for a model to detect and output directly a value of apnea-hypopnea index (AHI) for the OSA Severity.

Abstract: The present invention provides a method for OSA (Obstructive Sleep Apnea) severity classification by using recording-based Peripheral Oxygen Saturation Signal. The major feature of the present invention emphasizes on using a recording-based Peripheral Oxygen Saturation Signal (SpO2 signal) as an input, which is different from the deep learning-based prior art of using segment-based signals as an input to a model, and the segment-based signals has only two classification results, i.e. normal or apnea.

Abstract: A carrier assembly for mounting equipment into a carrier slot includes an electro-magnetic interference (EMI) shield and an EMI finger. The EMI shield protects the mounted equipment from EMI. The EMI shield is formed in a first plane of the carrier assembly. The EMI finger protrudes from the EMI shield and is coupled to the EMI shield. The EMI finger is formed in a second plane perpendicular to the first plane. The EMI finger operates, when the carrier assembly is installed into the carrier slot, to couple the EMI shield to the carrier slot. The EMI finger, when viewed from a first direction that is perpendicular to both the first plane and the second plane, is formed in a tear-drop shape.

Abstract: An automatic evolution method used for a brainwave database which collects physiological information of brainwaves about healthy and clinical groups, the automatic evolution method includes: classifying the physiological information of brainwaves collected by the brainwave database according to data characteristics; establishing a feedback algorithm model based on a neural network architecture according to the physiological information of brainwaves classified by the parameters; using the feedback algorithm model to input a subject's physiological information of brainwaves; measuring an accuracy of the subsequent performance data calculated by the feedback algorithm model; and incorporating the physiological information of brainwaves of the subject into the brainwave database, establishing an updated feedback algorithm model based on an updated neural network architecture, and feeding a comparison result generated by the updated feedback algorithm model back to the subject.

Abstract: A method for transmitting compressed brainwave physiological signals is provided and including detecting a plurality of brainwave physiological signals of a subject, and generating an electroencephalography based on a time sequence of the plurality of brainwave physiological signals; splitting the electroencephalography into a plurality of sub-images based on the time sequence; using a plurality of static feature tags and a plurality of dynamic displacement tags stored in a brainwave database to identify at least one static feature tag and a plurality of associated dynamic displacement tags based on the time sequence according to the plurality of sub-images; generating at least one superimposed group tag, the superposed group tag is used to integrate the identified static feature tag and the associated dynamic displacement tag according to the time sequence; and transmitting the identified static feature tag, the associated dynamic displacement tag, and the superimposed group tag to a remote cloud system acco

Abstract: Provided is a method for long-distance transmission of physiological signals in a closed loop system, including generating a signal at a user terminal of the closed loop system, compressing the signal to generate a compressed signal, transmitting the compressed signal from the user terminal to a computing terminal of the closed loop system, receiving and comparing the compressed signal with a database at the computing terminal to generate a comparison result and a feedback signal, and transmitting the feedback signal from the computing terminal to the user terminal. A time interval between generating the signal and receiving the feedback signal at the user terminal is less than a threshold.