Abstract: A light module includes a lighting unit, a heat-dissipation plate and an insulative plate. The lighting unit has a leading contact. The heat-dissipation plate contacts the lighting module closely and has a channel corresponding to the leading contact. The insulative plate is disposed under the heat-dissipation plate, and has a predetermined conductive pattern arranged thereon and a through hole corresponding to the channel. The leading contact of the lighting unit penetrates through the channel of the heat-dissipation plate and the through hole of the insulative plate to electrically connect with the predetermined conductive pattern of the insulative plate.

Abstract: A light module includes a lighting unit, a heat-dissipation plate and an insulative plate. The lighting unit has a leading contact. The heat-dissipation plate contacts the lighting module closely and has a channel corresponding to the leading contact. The insulative plate is disposed under the heat-dissipation plate, and has a predetermined conductive pattern arranged thereon and a through hole corresponding to the channel. The leading contact of the lighting unit penetrates through the channel of the heat-dissipation plate and the through hole of the insulative plate to electrically connect with the predetermined conductive pattern of the insulative plate.

Abstract: A package structure for an optical-electrical semiconductor is described. The package structure has a thermal conductive structure for heat transfer and is integrally formed in one piece to improve the structural strength thereof, while the thermal conductive structure prevent over-heating of the LED device for greater longevity. The package structure reduces the failure rate in production and has improved quality. When the present invention is applied in light-emitting diode packages, the special requirement can be reached and has better properties than the prior art.

Abstract: An LED lamp uses a plurality of LEDs as a light source. The LED lamp has a casing, a conduction layer, a PCB, a plurality of LED and a drive electronics. The conduction layer is placed in an inner of the casing. The conduction layer is metal, copper or aluminum, or nonmetal, silica gel or mica, for conducting the heat of the PCB caused by the current heating effects. The PCB placed on an upper surface of the conduction layer is for mounting the LED. Each LED is electrically connected to the PCB by way of shunt winding or in series for providing a light source. The drive electronics is electrically connected to the PCB for driving color rendering.

Abstract: An LED lamp is enabled to evenly emit lights, and is provided with a single set of indicators to provide different colors of light, and as least comprises a tubular case, a circuit board and at least an LED. The inner wall of the tubular case has a rough, light-homogenizing layer disposed thereon. The circuit board is provided together with a control unit on the bottom of the tubular case. The color mixing LED is provided on the circuit board.