Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.

Abstract: Provided is a LED light board including a substrate, a plurality of LEDs, and a colloid layer. The substrate has a plurality of adjacent light emission areas. These LEDs are respectively disposed on these light emission areas. The colloid layer is disposed on these light emission areas. These LEDs are disposed between the substrate and the colloid layer, and are covered by the colloid layer. The colloid layer has a plurality of recesses on each light emission area, and these recesses expose an upper surface of the substrate corresponding to these recesses. At least a portion of the recesses on each light emission area are disposed around the corresponding LED.

Abstract: A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.

Abstract: Provided is a LED light board including a substrate, a plurality of LEDs, and a colloid layer. The substrate has a plurality of adjacent light emission areas. These LEDs are respectively disposed on these light emission areas. The colloid layer is disposed on these light emission areas. These LEDs are disposed between the substrate and the colloid layer, and are covered by the colloid layer. The colloid layer has a plurality of recesses on each light emission area, and these recesses expose an upper surface of the substrate corresponding to these recesses. At least a portion of the recesses on each light emission area are disposed around the corresponding LED.

Abstract: A light source module includes a substrate, a light-emitting element, an optical adhesive layer and a reflective structure. The light-emitting element is disposed on the substrate. The optical adhesive layer is disposed on the substrate and covers the light-emitting element. The reflective structure is disposed in the optical adhesive layer and located above the light-emitting element. A display device using the aforementioned light source module is also provided. The light source module provided by the invention has the function of protecting the light-emitting element and improves the problem of the large thickness of the direct-type backlight module in prior art.

Abstract: A light guide device having a first surface and a second surface opposite to each other is provided. The first surface includes a plurality of light guide microstructures arranged in a first direction. Cross sections of at least one part of the light guide microstructures in the first direction are non-isosceles triangles. Herein, a distribution position of the light guide microstructures whose cross sections are non-isosceles triangles are symmetrical to a central axis of the light guide device in the first direction, and a maximum base angle of the cross section of each of the light guide microstructures is away from the central axis. A display apparatus including the light guide device is also provided. Through the light guide device and the display apparatus provided by the disclosure, light emission intensity of the display apparatus at a large viewing angle is improved.

Abstract: A light-emitting diode circuit substrate including multiple light-emitting diode chips, a redistribution structure, and multiple bonding pads is provided. The light-emitting diode chips include multiple contacts. The redistribution structure is disposed on the light-emitting diode chips and in direct contact with the plurality of contacts. The plurality of bonding pads are disposed on the redistribution structure and electrically connected to the plurality of contacts of the light-emitting diode chips via the redistribution structure. A manufacturing method of the light-emitting diode circuit substrate is also provided.

Abstract: A driving device and a driving method for a backlight module are provided. The driving device includes a current-to-voltage converter, a first LED driver, a second LED driver, and a switch. The current-to-voltage converter generates a control voltage corresponding to a control current of a first driving channel of the first LED driver. A control terminal of the switch is coupled to the current-to-voltage converter to receive the control voltage. A first terminal of the switch is configured to be coupled to a voltage source. A second terminal of the switch is configured to be coupled to a first terminal of a first light-emitting element of a backlight module. A second driving channel of the second LED driver is configured to be coupled to a second terminal of the first light-emitting element of the backlight module.

Abstract: A light guide device having a first surface and a second surface opposite to each other is provided. The first surface includes a plurality of light guide microstructures arranged in a first direction. Cross sections of at least one part of the light guide microstructures in the first direction are non-isosceles triangles. Herein, a distribution position of the light guide microstructures whose cross sections are non-isosceles triangles are symmetrical to a central axis of the light guide device in the first direction, and a maximum base angle of the cross section of each of the light guide microstructures is away from the central axis. A display apparatus including the light guide device is also provided. Through the light guide device and the display apparatus provided by the disclosure, light emission intensity of the display apparatus at a large viewing angle is improved.

Abstract: A system is provided to be disposed between a solar power module and a power inverter. The solar power module outputs a solar power signal to the power inverter. The system includes a circuit protecting unit and a processor. The processor obtains an amount of electrical current outputted by the power inverter and an amount of electrical current flowing through a current detector of the circuit protecting unit. When it is determined that the amount of electrical current outputted by the power inverter is zero and the amount of the electrical current flowing through the current detector is non-zero, the processor controls a power switch of the circuit protecting unit to switch to an open circuit state.

Abstract: A light source module includes a substrate, a light-emitting element, an optical adhesive layer and a reflective structure. The light-emitting element is disposed on the substrate. The optical adhesive layer is disposed on the substrate and covers the light-emitting element. The reflective structure is disposed in the optical adhesive layer and located above the light-emitting element. A display device using the aforementioned light source module is also provided. The light source module provided by the invention has the function of protecting the light-emitting element and improves the problem of the large thickness of the direct-type backlight module in prior art.

Abstract: A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.

Abstract: A backlight module includes first and second backlight units. The first backlight unit includes a first cover, a first light guide plate, a first light source and at least one first optical film. The first cover has a first surface and a second surface opposite to each other. The first light guide plate is disposed on the first surface. The first light source is disposed on the first surface and located on a side of the first light guide plate. The first optical film is disposed between the first surface and the first light guide plate. The second backlight unit is detachably disposed with the first backlight unit and has a structure similar to the first backlight unit. A display device having the backlight module is also provided.

Abstract: A display device including a frame, a glass light guide plate, an optical film set, a display panel, a reflector, a back plate and an electronic element is provided. The frame has a first connecting surface and a second connecting surface. The glass light guide plate has a first glass surface and a second glass surface opposite to the first glass surface. The first glass surface is connected to the first connecting surface. The optical film set is disposed on the first glass surface. The display panel is disposed on the optical film set. The reflector is disposed under the second glass surface. The back plate is connected to the second connecting surface. The back plate constructs an accommodating space with the frame and the glass light guide plate. The electronic element is connected to the back plate and located in the accommodating space.

Abstract: A backlight module includes first and second backlight units. The first backlight unit includes a first cover, a first light guide plate, a first light source and at least one first optical film. The first cover has a first surface and a second surface opposite to each other. The first light guide plate is disposed on the first surface. The first light source is disposed on the first surface and located on a side of the first light guide plate. The first optical film is disposed between the first surface and the first light guide plate. The second backlight unit is detachably disposed with the first backlight unit and has a structure similar to the first backlight unit. A display device having the backlight module is also provided.

Abstract: A display device including a back cover, a frame, a display panel, a backlight module and a first polarizer is provided. The frame is disposed on the back cover and has an opening. The display panel is disposed in the opening and has a first surface and a second surface opposite to each other. The backlight module is disposed between the back cover and the display panel, where the first surface faces the backlight module. The first polarizer is disposed on the second surface, where a periphery of the first polarizer extends to the outside of the second surface and is carried by the frame, and the frame surrounds the periphery of the first polarizer. The display device avoids a light leakage phenomenon occurred at an edge of the display panel, achieves a full plane design at the display panel, and decreases a whole thickness.

Abstract: A display device including a back cover, a frame, a display panel, a backlight module and a first polarizer is provided. The frame is disposed on the back cover and has an opening. The display panel is disposed in the opening and has a first surface and a second surface opposite to each other. The backlight module is disposed between the back cover and the display panel, where the first surface faces the backlight module. The first polarizer is disposed on the second surface, where a periphery of the first polarizer extends to the outside of the second surface and is carried by the frame, and the frame surrounds the periphery of the first polarizer. The display device avoids a light leakage phenomenon occurred at an edge of the display panel, achieves a full plane design at the display panel, and decreases a whole thickness.

Abstract: A display device including a frame, a glass light guide plate, an optical film set, a display panel, a reflector, a back plate and an electronic element is provided. The frame has a first connecting surface and a second connecting surface. The glass light guide plate has a first glass surface and a second glass surface opposite to the first glass surface. The first glass surface is connected to the first connecting surface. The optical film set is disposed on the first glass surface. The display panel is disposed on the optical film set. The reflector is disposed under the second glass surface. The back plate is connected to the second connecting surface. The back plate constructs an accommodating space with the frame and the glass light guide plate. The electronic element is connected to the back plate and located in the accommodating space.