Abstract: A chip provided to be flip bonded to a circuit board includes at least one bump and at least one supportive element which protrudes from an active surface of the chip and is located between the bump and a first side of the active surface. The supportive element is provided to support a lead on the circuit board to prevent the lead from contacting a metal burr protruding from the active surface or a metal cut surface exposed on a side wall of the chip. The supportive element can protect the chip and the lead from short circuit or electrical abnormality.

Abstract: A semiconductor package includes a flexible circuit board and a chip which includes a first bump group and a second bump group. First bumps of the first bump group and second bumps of the second bump group are provided to be bonded to leads on the flexible circuit board. The second bumps are designed to be longer than the first bumps in length so as to increase bonding strength of the second bumps to the leads, prevent the leads from being shifted and separated from the first and second bumps and prevent lead bonding misalignment.

Abstract: A wet coating method is described, which includes the following steps. A film coating is applied to at least one surface of a substrate using a wet process. A plasma-assisted filling treatment is performed on the film coating to crystallize the film coating into a film. The plasma-assisted filling treatment includes using a filling coating.

Abstract: A wet coating method is described, which includes the following steps. A film coating is applied to at least one surface of a substrate using a wet process. A plasma-assisted filling treatment is performed on the film coating to crystallize the film coating into a film. The plasma-assisted filling treatment includes using a filling coating.

Abstract: An atmospheric film-coating method is described, which includes the following steps. A substrate is provided. A gasification step is performed on a film coating solution to form a plurality of film coating vapor molecules. The film coating vapor molecules are deposited on a surface of the substrate to form the film.

Abstract: An atmospheric film-coating device and a film-manufacturing apparatus are described. The atmospheric film-coating device includes a delivery device and a nebulization device. The delivery device is suitable for delivering at least one substrate. The nebulization device is used to gasify a film coating solution toward a direction indirectly to the at least one substrate into a plurality of film coating vapor molecules to deposit on a surface of the at least one substrate.