Patents by Inventor Chun-Chiang Wei

Chun-Chiang Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190392322
    Abstract: An electronic component packaging type classification system using artificial neural network to execute classification; the electronic component packaging system includes a service database, an external database, a feature selection module, a data-integration module and a classification processing module. The service database receives electronic component patterns externally inputted. The external database stores the packaging type data of electronic components. The feature selection module records the packaging type features of the electronic components. The data-integration module performs the data-processing and the normalization for the selected features to obtain the data to be processed. The classification processing module receives the data to be processed and shows the classification result on the service database.
    Type: Application
    Filed: June 22, 2018
    Publication date: December 26, 2019
    Inventors: Jiun-Huei Ho, Mong-Fong Horng, Yan-Jhih Wang, Chun-Chiang Wei, Yi-Ting Chen