Patents by Inventor Chun-Chieh CHIN

Chun-Chieh CHIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND SYSTEM FOR SCANNING WAFER
    Publication number: 20230386013
    Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 30, 2023
    Inventors: PEI-HSUAN LEE, CHIEN-HSIANG HUANG, KUANG-SHING CHEN, KUAN-HSIN CHEN, CHUN-CHIEH CHIN
  • Method and system for scanning wafer
    Patent number: 11783469
    Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: October 10, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Pei-Hsuan Lee, Chien-Hsiang Huang, Kuang-Shing Chen, Kuan-Hsin Chen, Chun-Chieh Chin
  • METHOD AND SYSTEM FOR SCANNING WAFER
    Publication number: 20210304397
    Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.
    Type: Application
    Filed: June 11, 2021
    Publication date: September 30, 2021
    Inventors: PEI-HSUAN LEE, CHIEN-HSIANG HUANG, KUANG-SHING CHEN, KUAN-HSIN CHEN, CHUN-CHIEH CHIN
  • Method and system for scanning wafer
    Patent number: 11037289
    Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: June 15, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Pei-Hsuan Lee, Chien-Hsiang Huang, Kuang-Shing Chen, Kuan-Hsin Chen, Chun-Chieh Chin
  • METHOD AND SYSTEM FOR SCANNING WAFER
    Publication number: 20200134810
    Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.
    Type: Application
    Filed: February 26, 2019
    Publication date: April 30, 2020
    Inventors: PEI-HSUAN LEE, CHIEN-HSIANG HUANG, KUANG-SHING CHEN, KUAN-HSIN CHEN, CHUN-CHIEH CHIN
  • Method of manufacturing package component for light emitting diode and package structure thereof
    Patent number: 9123872
    Abstract: A method of manufacturing package component for light emitting diode (LED) is disclosed. At least one LED is disposed on a substrate inside a photocuring resin, wherein the LED is covered completely by the substrate and the photocuring resin. Power is provided to the LED to make the LED emit plural light beams such that a portion of the photocuring resin is cured by the light beams to obtain a male mold. A separation process is performed to separate the male mold and the other portion of the photocuring resin, the LED and the substrate. A rollover process is performed to manufacture the female mold by the male mold, wherein the female mold has at least one accommodation space with a shape identical to that of the male mold. A forming process is performed to form a package component with a shape identical to that of the male mold.
    Type: Grant
    Filed: October 9, 2014
    Date of Patent: September 1, 2015
    Assignee: GENESIS PHOTONICS INC.
    Inventors: Cheng-Yen Chen, Chun-Chieh Chin, Yun-Li Li
  • METHOD OF MANUFACTURING PACKAGE COMPONENT FOR LIGHT EMITTING DIODE AND PACKAGE STRUCTURE THEREOF
    Publication number: 20150097206
    Abstract: A method of manufacturing package component for light emitting diode (LED) is disclosed. At least one LED is disposed on a substrate inside a photocuring resin, wherein the LED is covered completely by the substrate and the photocuring resin. Power is provided to the LED to make the LED emit plural light beams such that a portion of the photocuring resin is cured by the light beams to obtain a male mold. A separation process is performed to separate the male mold and the other portion of the photocuring resin, the LED and the substrate. A rollover process is performed to manufacture the female mold by the male mold, wherein the female mold has at least one accommodation space with a shape identical to that of the male mold. A forming process is performed to form a package component with a shape identical to that of the male mold.
    Type: Application
    Filed: October 9, 2014
    Publication date: April 9, 2015
    Inventors: Cheng-Yen CHEN, Chun-Chieh CHIN, Yun-Li LI