Patents by Inventor Chun-Chieh CHOU

Chun-Chieh CHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113143
    Abstract: Various embodiments of the present disclosure are directed towards an imaging device including a first image sensor element and a second image sensor element respectively comprising a pixel unit disposed within a semiconductor substrate. The first image sensor element is adjacent to the second image sensor element. A first micro-lens overlies the first image sensor element and is laterally shifted from a center of the pixel unit of the first image sensor element by a first lens shift amount. A second micro-lens overlies the second image sensor element and is laterally shifted from a center of the pixel unit of the second image sensor element by a second lens shift amount different from the first lens shift amount.
    Type: Application
    Filed: January 6, 2023
    Publication date: April 4, 2024
    Inventors: Cheng Yu Huang, Wen-Hau Wu, Chun-Hao Chuang, Keng-Yu Chou, Wei-Chieh Chiang, Chih-Kung Chang
  • Publication number: 20240088182
    Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Chien Yu, Ting-Cheng Chang, Wen-Hau Wu, Chih-Kung Chang
  • Patent number: 11926266
    Abstract: An installing module includes a seat bracket, a plurality of lower gaskets, a device bracket and an upper gasket. The seat bracket includes a first locking plate and a second locking plate locked to each other. The first locking plate includes a first concave and the second locking plate includes a second concave corresponding to the first concave. The lower gaskets are respectively disposed on the first concave and the second concave. The lower gaskets face each other and jointly define a lower assembly hole and are disposed on a lower side of a head-support fixer of a car seat. The device bracket is locked to the seat bracket and an electronic device is pivotally coupled to the device bracket. The upper gasket is disposed between the device bracket and the head-support fixer, and the head-support fixer is clamped between the upper gasket and the lower gaskets.
    Type: Grant
    Filed: August 26, 2022
    Date of Patent: March 12, 2024
    Assignee: PEGATRON CORPORATION
    Inventors: Shih-Wei Yeh, Chien-Chih Lin, Yi-Ming Chou, Chun-Chieh Chang
  • Patent number: 11923386
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a first photodetector disposed in a first pixel region of a semiconductor substrate and a second photodetector disposed in a second pixel region of the semiconductor substrate. The second photodetector is laterally separated from the first photodetector. A first diffuser is disposed along a back-side of the semiconductor substrate and over the first photodetector. A second diffuser is disposed along the back-side of the semiconductor substrate and over the second photodetector. A first midline of the first pixel region and a second midline of the second pixel region are both disposed laterally between the first diffuser and the second diffuser.
    Type: Grant
    Filed: April 24, 2023
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Keng-Yu Chou, Chun-Hao Chuang, Kazuaki Hashimoto, Wei-Chieh Chiang, Cheng Yu Huang, Wen-Hau Wu, Chih-Kung Chang
  • Patent number: 11923392
    Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. A gate structure is disposed along a front-side of the substrate. A back-side of the substrate includes one or more first angled surfaces defining a central diffuser disposed over the image sensing element. The back-side of the substrate further includes second angled surfaces defining a plurality of peripheral diffusers laterally surrounding the central diffuser. The plurality of peripheral diffusers are a smaller size than the central diffuser.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Keng-Yu Chou, Chun-Hao Chuang, Jen-Cheng Liu, Kazuaki Hashimoto, Ming-En Chen, Shyh-Fann Ting, Shuang-Ji Tsai, Wei-Chieh Chiang
  • Patent number: 10518296
    Abstract: A piping system is provided, connecting a plurality of scrubbers which are disposed on a supporting structure, including a collecting pipe and a drain pipe. The collecting pipe has a main body and a plurality of protrusions, wherein the main body has an outer surface and a first central axis. The protrusions are protruding from the outer surface, and the first central axis is perpendicular to the supporting structure. The collecting pipe communicates with the scrubbers via the protrusions. The drain pipe is disposed under the supporting structure and has a second central axis, wherein the collecting pipe is extended through the supporting structure and connects to the drain pipe, and the first central axis is perpendicular to the second central axis.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: December 31, 2019
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Peng-Tan Lu, Chun-Chieh Chou, Chun-Pin Huang, Liang-Chih Chang, Chih-Nan Lin
  • Publication number: 20180345329
    Abstract: A piping system is provided, connecting a plurality of scrubbers which are disposed on a supporting structure, including a collecting pipe and a drain pipe. The collecting pipe has a main body and a plurality of protrusions, wherein the main body has an outer surface and a first central axis. The protrusions are protruding from the outer surface, and the first central axis is perpendicular to the supporting structure. The collecting pipe communicates with the scrubbers via the protrusions. The drain pipe is disposed under the supporting structure and has a second central axis, wherein the collecting pipe is extended through the supporting structure and connects to the drain pipe, and the first central axis is perpendicular to the second central axis.
    Type: Application
    Filed: November 27, 2017
    Publication date: December 6, 2018
    Inventors: Peng-Tan LU, Chun-Chieh CHOU, Chun-Pin HUANG, Liang-Chih CHANG, Chih-Nan LIN