Patents by Inventor Chun-Chieh Tseng

Chun-Chieh Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240363668
    Abstract: In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes at least one device on a front side of a semiconductor substrate. A plurality of grating layers are under the at least one device. The plurality of grating layers include at least a first material having a first refractive index alternating with a second material having a second refractive index. Contacts extend through an interlevel dielectric material, and further extend through the semiconductor substrate, to directly contact at least one of the first material and the second material below the at least one device and below the semiconductor substrate underlying the interlevel dielectric material.
    Type: Application
    Filed: July 11, 2024
    Publication date: October 31, 2024
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu
  • Patent number: 12104696
    Abstract: A waterproof click pad device includes a click pad, a frame and a waterproof unit. The frame surrounds the click pad and surrounds an axis passing through the click pad. The waterproof unit is transverse to the axis and is in sheet form. The waterproof unit includes a frame adhesive member surrounding the axis and adhered to the frame, a first non-adhesive member surrounding the axis, connected to an inner periphery of the frame adhesive member and spaced apart from and located above the frame, a second non-adhesive member surrounding the axis, connected to an inner periphery of the first non-adhesive member and spaced apart from and located above the click pad and the frame, and an plate adhesive member connected to an inner periphery of the second non-adhesive member and adhered to the click pad.
    Type: Grant
    Filed: January 4, 2023
    Date of Patent: October 1, 2024
    Assignee: Sunrex Technology Corp.
    Inventors: Yu-Xiang Geng, Chun-Chieh Chen, Ling-Cheng Tseng, Yi-Wen Tsai, Ching-Yao Huang
  • Publication number: 20240321765
    Abstract: A package structure including a first semiconductor die, a second semiconductor die, first conductive pillars and a first insulating encapsulation is provided. The first semiconductor die includes a semiconductor substrate, an interconnect structure and a first redistribution circuit structure. The semiconductor substrate includes a first portion and a second portion disposed on the first portion. The interconnect structure is disposed on the second portion, the first redistribution circuit structure is disposed on the interconnect structure, and the lateral dimension of the first portion is greater than the lateral dimension of the second portion. The second semiconductor die is disposed on the first semiconductor die. The first conductive pillars are disposed on the first redistribution circuit structure of the first semiconductor die. The first insulating encapsulation is disposed on the first portion.
    Type: Application
    Filed: June 6, 2024
    Publication date: September 26, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai, Ming-Hung Tseng, Yen-Liang Lin, Chun-Ti Lu, Chung-Ming Weng
  • Publication number: 20240274555
    Abstract: Embodiments provide a method and resulting structure that includes forming an opening in a dielectric layer to expose a metal feature, selectively depositing a metal cap on the metal feature, depositing a barrier layer over the metal cap, and depositing a conductive fill on the barrier layer.
    Type: Application
    Filed: May 8, 2023
    Publication date: August 15, 2024
    Inventors: Wei-Jen Lo, Syun-Ming Jang, Ming-Hsing Tsai, Chun-Chieh Lin, Hung-Wen Su, Ya-Lien Lee, Chih-Han Tseng, Chih-Cheng Kuo, Yi-An Lai, Kevin Huang, Kuan-Hung Ho
  • Publication number: 20240264405
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Application
    Filed: April 16, 2024
    Publication date: August 8, 2024
    Inventors: Chao-Chang HU, Liang-Ting HO, Chen-Er HSU, Yi-Liang CHAN, Fu-Lai TSENG, Fu-Yuan WU, Chen-Chi KUO, Ying-Jen WANG, Wei-Han HSIA, Yi-Hsin TSENG, Wen-Chang LIN, Chun-Chia LIAO, Shou-Jen LIU, Chao-Chun CHANG, Yi-Chieh LIN, Shang-Yu HSU, Yu-Huai LIAO, Shih-Wei HUNG, Sin-Hong LIN, Kun-Shih LIN, Yu-Cheng LIN, Wen-Yen HUANG, Wei-Jhe SHEN, Chih-Shiang WU, Sin-Jhong SONG, Che-Hsiang CHIU, Sheng-Chang LIN
  • Patent number: 12040283
    Abstract: A package structure including a first semiconductor die, a second semiconductor die, first conductive pillars and a first insulating encapsulation is provided. The first semiconductor die includes a semiconductor substrate, an interconnect structure and a first redistribution circuit structure. The semiconductor substrate includes a first portion and a second portion disposed on the first portion. The interconnect structure is disposed on the second portion, the first redistribution circuit structure is disposed on the interconnect structure, and the lateral dimension of the first portion is greater than the lateral dimension of the second portion. The second semiconductor die is disposed on the first semiconductor die. The first conductive pillars are disposed on the first redistribution circuit structure of the first semiconductor die. The first insulating encapsulation is disposed on the first portion.
    Type: Grant
    Filed: April 19, 2023
    Date of Patent: July 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai, Ming-Hung Tseng, Yen-Liang Lin, Chun-Ti Lu, Chung-Ming Weng
  • Publication number: 20240181127
    Abstract: A bone substitute composition includes a bone substitute matrix and a conditioning solution. The bone substitute matrix includes 85% to 98% by weight of alkaline calcium phosphate powder, 1% to 10% by weight of a polymer, and 1% to 5% by weight of a crosslinker. The conditioning solution includes 90% to 97% by weight of water, 1% to 5% by weight of a phosphate, and 1% to 5% by weight of a water-soluble acidic compound.
    Type: Application
    Filed: March 20, 2023
    Publication date: June 6, 2024
    Inventors: Kuan-Yu CHIU, Yen-Hao CHANG, Chun-Chieh TSENG, Tung-Lin TSAI, Chun-Ming CHEN, Yue-Jun WANG, Tzyy-Ker SUE
  • Publication number: 20240180492
    Abstract: A signal transmitting element is used to solve the problem that an additional surgery is required to remove the conventional vascular monitoring element after completing the detecting task. The signal transmitting element comprises a body made of a specific biodegradable material. The body includes a signal sensing portion including a structure configured to sense a blood flow information of a blood vessel surrounded and contacted by the body, thereby generating a blood vessel signal; and a signal transmitting portion coupled with the signal sensing portion for receiving the blood vessel signal and including a specific structure configured to convert the blood vessel signal into a transmission signal.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 6, 2024
    Inventors: Chun-Chieh Tseng, Chun-Ming Chen, Tung-Lin Tsai, Yen-Hao Chang, Shu-Hung Huang, Sheng-Hua Wu, Yen-Hsin Kuo, Ping-Ruey Chou
  • Publication number: 20240164795
    Abstract: A surgical instrument includes a rod and a push portion. The push portion includes a first end connected to an end of the rod and a second end having a blade portion. The push portion includes a plurality of grooves. The plurality of grooves is recessed in a surface of the push portion and is spaced from each other. Each two adjacent grooves has a rib formed therebetween. A top face of a cross section of each rib is the surface of the push portion. Each rib has a guiding face on the cross section of the push portion. The guiding face is connected to the surface of the push portion. The guiding face faces a rotating direction of the rod. An angle between the guiding face and the surface of the push portion in the cross section is greater than 90°.
    Type: Application
    Filed: November 22, 2022
    Publication date: May 23, 2024
    Inventors: Tung-Lin TSAI, Chun-Chieh TSENG, Chun-Ming CHEN, Yue-Jun WANG, Pei-Hua WANG
  • Patent number: 11707551
    Abstract: An implant shredder includes a base and a cutting member. The base includes a first chamber and a second chamber intercommunicating with the first chamber. The first chamber includes an inlet. The second chamber includes an outlet. The cutting member is received in the second chamber. The cutting member is driven by a driving member to rotate. The cutting member includes a plurality of cutting edges located on a circumference of a same radius. The plurality of cutting edges is rotatably disposed adjacent to a location intercommunicating with the first chamber. An implant forming method includes creating data of an outline of an implant; producing a shaping mold based on the data; and cutting a to-be-processed object with the implant shredder, then mixing the to-be-proceed object with a biological tissue glue to obtain a raw material, and filling the raw material into the shaping mold to form the implant.
    Type: Grant
    Filed: October 21, 2021
    Date of Patent: July 25, 2023
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Yue-Jun Wang, Chun-Chieh Tseng, Tung-Lin Tsai
  • Publication number: 20230131187
    Abstract: An implant shredder includes a base and a cutting member. The base includes a first chamber and a second chamber intercommunicating with the first chamber. The first chamber includes an inlet. The second chamber includes an outlet. The cutting member is received in the second chamber. The cutting member is driven by a driving member to rotate. The cutting member includes a plurality of cutting edges located on a circumference of a same radius. The plurality of cutting edges is rotatably disposed adjacent to a location intercommunicating with the first chamber. An implant forming method includes creating data of an outline of an implant; producing a shaping mold based on the data; and cutting a to-be-processed object with the implant shredder, mixing the cut to-be-proceed object with a biological tissue glue to obtain a raw material, and filling the raw material into the shaping mold to form the implant.
    Type: Application
    Filed: October 21, 2021
    Publication date: April 27, 2023
    Inventors: Yue-Jun Wang, Chun-Chieh Tseng, Tung-Lin Tsai
  • Patent number: 11628005
    Abstract: A tool for a bone implant includes a rod and an adaptor. The rod includes a coupling portion having a through-hole. The rod further includes a measuring arm connected to the coupling portion and a force applying arm connected to the coupling portion. The measuring arm includes a first extension section having a first indicator portion, and the force applying arm includes a second extension section having a second indicator portion. The force applying arm is elastically deformable away from the measuring arm to displace the second extension section relative to the first extension section. The adaptor is coupled in the through-hole and includes an outer ring and an inner ring. The outer ring is rotatable relative to the inner ring in a single direction.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: April 18, 2023
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Tung-Lin Tsai, Chun-Chieh Tseng, Chun-Ming Chen, Yue-Jun Wang, Hsin-Fei Wang, Pei-Hua Wang
  • Patent number: 11426181
    Abstract: A tool for a bone implant includes a sleeve and a transmission rod including a transmission member disposed on an end of a shaft. Another end of the shaft is located outside of the sleeve. The transmission member is received in the sleeve and includes a first compartment and a plurality of first teeth surrounding the first compartment. A drilling rod includes a second compartment and a plurality of second teeth surrounding the second compartment. A coupling portion is disposed between the second compartment and a bit. The coupling portion is coupled with the sleeve. The bit is located outside of the sleeve. Two magnets are disposed in the first and second compartments, respectively. Two same poles respectively of the two magnets face each other.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: August 30, 2022
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Tung-Lin Tsai, Chun-Chieh Tseng, Yue-Jun Wang, Chun-Ming Chen, Li-Wen Weng, Pei-Hua Wang
  • Patent number: 11369362
    Abstract: A fibrocartilage suturing device is provided to solve the problem where the conventional procedure of the surgery is inconvenient. The fibrocartilage suturing device includes a tube assembly, a tubular member, and an anchor. The tube assembly extends through the tube assembly and includes an insertion section. The movement member is coupled with the tube assembly and includes a thrust rod extending through the tubular member. The anchor is located at one end of the thrust rod and includes a body and at least two wings connected to the body is able to be folded and unfolded relative to the body. The body of the anchor is connected to an end of a thread. Another end of the thread is connected to the tubular member.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: June 28, 2022
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Chen-Chie Wang, Po-Chih Chow, Yue-Jun Wang, Shih-Hua Huang, Chih-Lung Lin, Tung-Lin Tsai, Chun-Chieh Tseng, Li-Wen Weng
  • Publication number: 20220175437
    Abstract: A tool for a bone implant includes a rod and an adaptor. The rod includes a coupling portion having a through-hole. The rod further includes a measuring arm connected to the coupling portion and a force applying arm connected to the coupling portion. The measuring arm includes a first extension section having a first indicator portion, and the force applying arm includes a second extension section having a second indicator portion. The force applying arm is elastically deformable away from the measuring arm to displace the second extension section relative to the first extension section. The adaptor is coupled in the through-hole and includes an outer ring and an inner ring. The outer ring is rotatable relative to the inner ring in a single direction.
    Type: Application
    Filed: December 3, 2020
    Publication date: June 9, 2022
    Inventors: Tung-Lin TSAI, Chun-Chieh TSENG, Chun-Ming CHEN, Yue-Jun WANG, Hsin-Fei WANG, Pei-Hua WANG
  • Publication number: 20220133336
    Abstract: A tool for a bone implant includes a sleeve and a transmission rod including a transmission member disposed on an end of a shaft. Another end of the shaft is located outside of the sleeve. The transmission member is received in the sleeve and includes a first compartment and a plurality of first teeth surrounding the first compartment. A drilling rod includes a second compartment and a plurality of second teeth surrounding the second compartment. A coupling portion is disposed between the second compartment and a bit. The coupling portion is coupled with the sleeve. The bit is located outside of the sleeve. Two magnets are disposed in the first and second compartments, respectively. Two same poles respectively of the two magnets face each other.
    Type: Application
    Filed: February 2, 2021
    Publication date: May 5, 2022
    Inventors: Tung-Lin Tsai, Chun-Chieh Tseng, Yue-Jun Wang, Chun-Ming Chen, Li-Wen Weng, Pei-Hua Wang
  • Publication number: 20210198152
    Abstract: A ceramic particle includes a core and a modification layer. The core is made of magnesium or a magnesium alloy. The core has a diameter of 30-100 ?m. The modification layer covers an outer surface of the core. The modification layer includes calcium and phosphorus. A method for producing a ceramic particle includes providing a core made of magnesium or a magnesium alloy and having a diameter of 30-100 ?m. A calcium salt and a phosphorus salt are dissolved in a solvent. A chelating agent is added into the solvent to form a modifying solution. The core is added into the modifying solution to form a modification layer on an outer surface of the core in a temperature range of 5-40° C. The modification layer includes calcium and phosphorus.
    Type: Application
    Filed: December 26, 2019
    Publication date: July 1, 2021
    Inventors: Chun-Chieh Tseng, Yen-Hao Chang, Yue-Jun Wang, Tung-Lin Tsai, Ying-Cheng Lu, Chiu-Feng Lin
  • Patent number: 10939945
    Abstract: A minimally invasive bone fracture positioning device includes a sleeve, a movable unit, and a support. The sleeve includes an alignment portion located on a longitudinal axis of the sleeve. The movable unit includes a positioning portion. The positioning portion is located on the longitudinal axis and is spaced from the alignment portion. The movable unit is mounted in a radial direction of the sleeve. The movable unit is slideable relative to the sleeve along the longitudinal axis. A support is coupled to the sleeve and the movable unit. The movable unit is spaced from the sleeve by the support.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: March 9, 2021
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Yue-Jun Wang, Chih-Hao Chang, Shih-Hua Huang, Chih-Lung Lin, Tung-Lin Tsai, Chun-Chieh Tseng, Li-Wen Weng
  • Publication number: 20200199759
    Abstract: The present invention relates to a slowly degraded alloy and a method for producing the same. The slowly degraded alloy comprises a degradable metal and a cladding layer. The degradable metal is completely covered with the cladding layer, such that a degradation rate of the degradable metal is decreased. Furthermore, because the cladding layer is made from polymer materials, the cladding layer does not be broken easily when a stress is applied to the slowly degraded alloy, thereby efficiently covering the degradable metal therein, and lowering the degradation rate of the degradable metal.
    Type: Application
    Filed: December 21, 2018
    Publication date: June 25, 2020
    Inventors: Chung-Yu HUNG, Chun-Chieh TSENG, Ying-Cheng LU, Chiu-Feng LIN, Yen-Hao CHANG
  • Patent number: D1044812
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: October 1, 2024
    Assignee: Sunrex Technology Corp.
    Inventors: Shih-Pin Lin, Chun-Chieh Chen, Yi-Wen Tsai, Ling-Cheng Tseng, Ching-Yao Huang, Yu-Shuo Yang, Yu-Xiang Geng, Cheng-Yu Chuang, Chi-Shu Hsu