Patents by Inventor Chun-Chieh Wong

Chun-Chieh Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11515231
    Abstract: A coating method applied to perform coating with liquid metal thermal grease and a heat dissipation module are provided. The coating method includes: providing liquid metal thermal grease on a surface of an electronic element, and scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease. A surface of the scraper is roughened. According to the coating method, the surface of the electronic element is evenly coated with the liquid metal thermal grease effectively.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: November 29, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chia-Chang Lee, Chun-Chieh Wong, Cheng-Yu Wang, Tai-Min Hsu, Yao-Jen Chang
  • Patent number: 11452232
    Abstract: Provided is an electronic device. The electronic device includes a housing, a heat generating element, a plurality of fans, and a guide structure. The housing includes a first outlet. The heat generating element is disposed in the housing. The fans are disposed in the housing. Each fan includes a second outlet. The second outlets at least partially face the interior of the housing. The guide structure is disposed in the housing, and is at least partially located between the fans. The guide structure at least partially extends toward the first outlet.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: September 20, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chun-Chieh Wong, Cheng-Yu Wang
  • Patent number: 11172594
    Abstract: A heat dissipation structure applied to a substrate with a heat generating element is provided. The heat dissipation structure includes a heat dissipation body and an elastomer. The heat dissipation body includes a connecting portion, where the connecting portion includes a central area and a peripheral area, and the central area is configured to contact with the heat generating element. The elastomer is disposed between the peripheral area and the heat generating element, to form a sealed space, and the sealed space is configured to accommodate a heat-conducting medium.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: November 9, 2021
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chun-Chieh Wong, Cheng-Yu Wang
  • Publication number: 20210219457
    Abstract: Provided is an electronic device. The electronic device includes a housing, a heat generating element, a plurality of fans, and a guide structure. The housing includes a first outlet. The heat generating element is disposed in the housing. The fans are disposed in the housing. Each fan includes a second outlet. The second outlets at least partially face the interior of the housing. The guide structure is disposed in the housing, and is at least partially located between the fans. The guide structure at least partially extends toward the first outlet.
    Type: Application
    Filed: December 23, 2020
    Publication date: July 15, 2021
    Inventors: Chun-Chieh WONG, Cheng-Yu WANG
  • Publication number: 20210066160
    Abstract: A coating method applied to perform coating with liquid metal thermal grease and a heat dissipation module are provided. The coating method includes: providing liquid metal thermal grease on a surface of an electronic element, and scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease. A surface of the scraper is roughened. According to the coating method, the surface of the electronic element is evenly coated with the liquid metal thermal grease effectively.
    Type: Application
    Filed: July 17, 2020
    Publication date: March 4, 2021
    Inventors: Chia-Chang LEE, Chun-Chieh WONG, Cheng-Yu WANG, Tai-Min HSU, Yao-Jen CHANG
  • Publication number: 20200288604
    Abstract: A heat dissipation structure applied to a substrate with a heat generating element is provided. The heat dissipation structure includes a heat dissipation body and an elastomer. The heat dissipation body includes a connecting portion, where the connecting portion includes a central area and a peripheral area, and the central area is configured to contact with the heat generating element. The elastomer is disposed between the peripheral area and the heat generating element, to form a sealed space, and the sealed space is configured to accommodate a heat-conducting medium.
    Type: Application
    Filed: February 18, 2020
    Publication date: September 10, 2020
    Inventors: Chun-Chieh WONG, Cheng-Yu WANG
  • Patent number: 9342110
    Abstract: A heat dissipating device includes a supporting part, a plurality of first fins and a plurality of second fins. The first fins are disposed in a vertical array at the supporting part. The second fins are disposed in an inclined array at the supporting part. The first fins and the second fins are staggeredly disposed and adjacent to each other correspondingly. The heat exchange efficiency of the fins is improved so as to increase the heat dissipating efficiency of the heat dissipating device.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: May 17, 2016
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chun-Chieh Wong, Cheng-Yu Wang
  • Patent number: 9210820
    Abstract: An electronic device includes an accommodating space, a fan, a cover, and a three dimensional dust extraction mesh. The fan is disposed in the accommodating space. The fan includes a first fixing portion. The cover detachably covers the accommodating space, and the cover includes a second fixing portion in accommodating space. The three dimensional dust extraction mesh includes a body, a third fixing portion, and a fourth fixing portion, and the third fixing portion and the fourth fixing portion are located at periphery of the body. The third fixing portion of the three dimensional dust extraction mesh cooperates with the first fixing portion of the fan, and the fourth fixing portion of the three dimensional dust extraction mesh cooperates with the second fixing portion of the cover to detachably fix the three dimensional dust extraction mesh between the cover and the fan.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: December 8, 2015
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Chun-Chieh Wong, Cheng-Yu Wang
  • Publication number: 20150289415
    Abstract: A cooling fin, applied in a heat dissipation module, includes a fin body, a penetration portion, and at least one bending portion. The penetration portion is formed on the fin body and includes a slot, a first bending wall, and a second bending wall. The first bending wall and the second bending wall are formed at the opposite sides of the slot. The bending portion is formed on the fin body and adjacent to one end of the slot.
    Type: Application
    Filed: April 1, 2015
    Publication date: October 8, 2015
    Inventors: Chun-Chieh Wong, Cheng-Yu Wang, Ing-Jer Chiou
  • Patent number: 9087804
    Abstract: A heat dissipating module disposed between a plurality of heating elements is provided. The heat dissipating module includes a plurality of heat conducting units, a set of heat dissipating fins, a plurality of fans, a plurality of sensing units and a control unit. The heat conducting units are connected to the set of the heat dissipating fins and the heating elements. A gap exists between the heat conducting units. The fans are disposed at the same side of the set of the heat dissipating fins. The sensing units are coupled to the heating elements, respectively, to detect the heat generated by the heating elements. The control unit is electrically connected to the fans and the sensing units. The heat generated by the heating elements is different from each other, and the control unit adjusts the speed of the fans according to the heat generated by the heating elements.
    Type: Grant
    Filed: May 4, 2012
    Date of Patent: July 21, 2015
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Chun-Chieh Wong, Cheng-Yu Wang
  • Publication number: 20140025224
    Abstract: An electronic device with a plurality of touch sensing modules and a heat dissipating control method thereof are provided. The heat dissipating control method includes following steps: detecting whether an object approaches the electronic device or the electronic device is touched to generate a sensing result; recognizing an executable scenario solution according to the sensing result, and cooling the electronic device according to the executable scenario solution.
    Type: Application
    Filed: June 20, 2013
    Publication date: January 23, 2014
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chun-Chieh Wong, Cheng-Yu Wang
  • Publication number: 20130259666
    Abstract: A slim fan includes a casing, a fan module and a ring cover. The casing includes an upper casing which has an opening, and a lower casing. The fan module includes a plurality of fans annularly disposed in the opening, and each of the fans has a first side and a second side opposite to each other. The ring cover is connected to the first side of the fans and exposed out of the opening. The height of the fans is equal to that between the upper casing and the lower casing.
    Type: Application
    Filed: March 8, 2013
    Publication date: October 3, 2013
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chun-Chieh Wong, Cheng-Yu Wang, Ming-Hsiu Wu
  • Publication number: 20130215564
    Abstract: An electronic device includes an accommodating space, a fan, a cover, and a stereoscopic dust extraction mesh. The fan is disposed in the accommodating space. The fan includes a first fixing portion. The cover detachably covers the accommodating space, and the cover includes a second fixing portion in accommodating space. The stereoscopic dust extraction mesh includes a body, a third fixing portion, and a fourth fixing portion, and the third fixing portion and the fourth fixing portion are located at periphery of the body. The third fixing portion of the stereoscopic dust extraction mesh cooperates with the first fixing portion of the fan, and the fourth fixing portion of the stereoscopic dust extraction mesh cooperates with the second fixing portion of the cover to detachably fix the stereoscopic dust extraction mesh between the cover and the fan.
    Type: Application
    Filed: December 14, 2012
    Publication date: August 22, 2013
    Inventors: Chun-Chieh Wong, Cheng-Yu Wang
  • Publication number: 20120279688
    Abstract: A heat dissipating module disposed between a plurality of heating elements is provided. The heat dissipating module includes a plurality of heat conducting units, a set of heat dissipating fins, a plurality of fans, a plurality of sensing units and a control unit. The heat conducting units are connected to the set of the heat dissipating fins and the heating elements. A gap exists between the heat conducting units. The fans are disposed at the same side of the set of the heat dissipating fins. The sensing units are coupled to the heating elements, respectively, to detect the heat generated by the heating elements. The control unit is electrically connected to the fans and the sensing units. The heat generated by the heating elements is different from each other, and the control unit adjusts the speed of the fans according to the heat generated by the heating elements.
    Type: Application
    Filed: May 4, 2012
    Publication date: November 8, 2012
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Chun-Chieh Wong, Cheng-Yu Wang
  • Publication number: 20120138284
    Abstract: A heat dissipating device includes a supporting part, a plurality of first fins and a plurality of second fins. The first fins are disposed in a vertical array at the supporting part. The second fins are disposed in an inclined array at the supporting part. The first fins and the second fins are staggeredly disposed and adjacent to each other correspondingly. The heat exchange efficiency of the fins is improved so as to increase the heat dissipating efficiency of the heat dissipating device.
    Type: Application
    Filed: November 18, 2011
    Publication date: June 7, 2012
    Inventors: Chun-Chieh WONG, Cheng-Yu Wang
  • Publication number: 20120114476
    Abstract: A ventilator includes a first casing, a second casing, a fan blade and a flow guider. The second casing is connected to the first casing and forms a flow channel between the first casing and the second casing. The fan blade is disposed between the first casing and the second casing. When the fan blade rotates, an air-flow compression zone and an air-flow decompression zone are formed in the flow channel. The flow guider is formed along a boundary line to the air-flow decompression zone, wherein the boundary line is adjacent to the air-flow compression zone and the air-flow decompression zone. With the ventilator, the air pressure of the ventilator is increased and noise can be controlled.
    Type: Application
    Filed: September 23, 2011
    Publication date: May 10, 2012
    Inventors: Chun-Chieh Wong, Chen-Yu Wang