Patents by Inventor Chun-Chieh Wong
Chun-Chieh Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11515231Abstract: A coating method applied to perform coating with liquid metal thermal grease and a heat dissipation module are provided. The coating method includes: providing liquid metal thermal grease on a surface of an electronic element, and scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease. A surface of the scraper is roughened. According to the coating method, the surface of the electronic element is evenly coated with the liquid metal thermal grease effectively.Type: GrantFiled: July 17, 2020Date of Patent: November 29, 2022Assignee: ASUSTEK COMPUTER INC.Inventors: Chia-Chang Lee, Chun-Chieh Wong, Cheng-Yu Wang, Tai-Min Hsu, Yao-Jen Chang
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Patent number: 11452232Abstract: Provided is an electronic device. The electronic device includes a housing, a heat generating element, a plurality of fans, and a guide structure. The housing includes a first outlet. The heat generating element is disposed in the housing. The fans are disposed in the housing. Each fan includes a second outlet. The second outlets at least partially face the interior of the housing. The guide structure is disposed in the housing, and is at least partially located between the fans. The guide structure at least partially extends toward the first outlet.Type: GrantFiled: December 23, 2020Date of Patent: September 20, 2022Assignee: ASUSTEK COMPUTER INC.Inventors: Chun-Chieh Wong, Cheng-Yu Wang
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Patent number: 11172594Abstract: A heat dissipation structure applied to a substrate with a heat generating element is provided. The heat dissipation structure includes a heat dissipation body and an elastomer. The heat dissipation body includes a connecting portion, where the connecting portion includes a central area and a peripheral area, and the central area is configured to contact with the heat generating element. The elastomer is disposed between the peripheral area and the heat generating element, to form a sealed space, and the sealed space is configured to accommodate a heat-conducting medium.Type: GrantFiled: February 18, 2020Date of Patent: November 9, 2021Assignee: ASUSTEK COMPUTER INC.Inventors: Chun-Chieh Wong, Cheng-Yu Wang
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Publication number: 20210219457Abstract: Provided is an electronic device. The electronic device includes a housing, a heat generating element, a plurality of fans, and a guide structure. The housing includes a first outlet. The heat generating element is disposed in the housing. The fans are disposed in the housing. Each fan includes a second outlet. The second outlets at least partially face the interior of the housing. The guide structure is disposed in the housing, and is at least partially located between the fans. The guide structure at least partially extends toward the first outlet.Type: ApplicationFiled: December 23, 2020Publication date: July 15, 2021Inventors: Chun-Chieh WONG, Cheng-Yu WANG
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Publication number: 20210066160Abstract: A coating method applied to perform coating with liquid metal thermal grease and a heat dissipation module are provided. The coating method includes: providing liquid metal thermal grease on a surface of an electronic element, and scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease. A surface of the scraper is roughened. According to the coating method, the surface of the electronic element is evenly coated with the liquid metal thermal grease effectively.Type: ApplicationFiled: July 17, 2020Publication date: March 4, 2021Inventors: Chia-Chang LEE, Chun-Chieh WONG, Cheng-Yu WANG, Tai-Min HSU, Yao-Jen CHANG
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Publication number: 20200288604Abstract: A heat dissipation structure applied to a substrate with a heat generating element is provided. The heat dissipation structure includes a heat dissipation body and an elastomer. The heat dissipation body includes a connecting portion, where the connecting portion includes a central area and a peripheral area, and the central area is configured to contact with the heat generating element. The elastomer is disposed between the peripheral area and the heat generating element, to form a sealed space, and the sealed space is configured to accommodate a heat-conducting medium.Type: ApplicationFiled: February 18, 2020Publication date: September 10, 2020Inventors: Chun-Chieh WONG, Cheng-Yu WANG
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Patent number: 9342110Abstract: A heat dissipating device includes a supporting part, a plurality of first fins and a plurality of second fins. The first fins are disposed in a vertical array at the supporting part. The second fins are disposed in an inclined array at the supporting part. The first fins and the second fins are staggeredly disposed and adjacent to each other correspondingly. The heat exchange efficiency of the fins is improved so as to increase the heat dissipating efficiency of the heat dissipating device.Type: GrantFiled: November 18, 2011Date of Patent: May 17, 2016Assignee: ASUSTEK COMPUTER INC.Inventors: Chun-Chieh Wong, Cheng-Yu Wang
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Patent number: 9210820Abstract: An electronic device includes an accommodating space, a fan, a cover, and a three dimensional dust extraction mesh. The fan is disposed in the accommodating space. The fan includes a first fixing portion. The cover detachably covers the accommodating space, and the cover includes a second fixing portion in accommodating space. The three dimensional dust extraction mesh includes a body, a third fixing portion, and a fourth fixing portion, and the third fixing portion and the fourth fixing portion are located at periphery of the body. The third fixing portion of the three dimensional dust extraction mesh cooperates with the first fixing portion of the fan, and the fourth fixing portion of the three dimensional dust extraction mesh cooperates with the second fixing portion of the cover to detachably fix the three dimensional dust extraction mesh between the cover and the fan.Type: GrantFiled: December 14, 2012Date of Patent: December 8, 2015Assignee: ASUSTeK COMPUTER INC.Inventors: Chun-Chieh Wong, Cheng-Yu Wang
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Publication number: 20150289415Abstract: A cooling fin, applied in a heat dissipation module, includes a fin body, a penetration portion, and at least one bending portion. The penetration portion is formed on the fin body and includes a slot, a first bending wall, and a second bending wall. The first bending wall and the second bending wall are formed at the opposite sides of the slot. The bending portion is formed on the fin body and adjacent to one end of the slot.Type: ApplicationFiled: April 1, 2015Publication date: October 8, 2015Inventors: Chun-Chieh Wong, Cheng-Yu Wang, Ing-Jer Chiou
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Patent number: 9087804Abstract: A heat dissipating module disposed between a plurality of heating elements is provided. The heat dissipating module includes a plurality of heat conducting units, a set of heat dissipating fins, a plurality of fans, a plurality of sensing units and a control unit. The heat conducting units are connected to the set of the heat dissipating fins and the heating elements. A gap exists between the heat conducting units. The fans are disposed at the same side of the set of the heat dissipating fins. The sensing units are coupled to the heating elements, respectively, to detect the heat generated by the heating elements. The control unit is electrically connected to the fans and the sensing units. The heat generated by the heating elements is different from each other, and the control unit adjusts the speed of the fans according to the heat generated by the heating elements.Type: GrantFiled: May 4, 2012Date of Patent: July 21, 2015Assignee: ASUSTeK COMPUTER INC.Inventors: Chun-Chieh Wong, Cheng-Yu Wang
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Publication number: 20140025224Abstract: An electronic device with a plurality of touch sensing modules and a heat dissipating control method thereof are provided. The heat dissipating control method includes following steps: detecting whether an object approaches the electronic device or the electronic device is touched to generate a sensing result; recognizing an executable scenario solution according to the sensing result, and cooling the electronic device according to the executable scenario solution.Type: ApplicationFiled: June 20, 2013Publication date: January 23, 2014Applicant: ASUSTeK COMPUTER INC.Inventors: Chun-Chieh Wong, Cheng-Yu Wang
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Publication number: 20130259666Abstract: A slim fan includes a casing, a fan module and a ring cover. The casing includes an upper casing which has an opening, and a lower casing. The fan module includes a plurality of fans annularly disposed in the opening, and each of the fans has a first side and a second side opposite to each other. The ring cover is connected to the first side of the fans and exposed out of the opening. The height of the fans is equal to that between the upper casing and the lower casing.Type: ApplicationFiled: March 8, 2013Publication date: October 3, 2013Applicant: ASUSTeK COMPUTER INC.Inventors: Chun-Chieh Wong, Cheng-Yu Wang, Ming-Hsiu Wu
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Publication number: 20130215564Abstract: An electronic device includes an accommodating space, a fan, a cover, and a stereoscopic dust extraction mesh. The fan is disposed in the accommodating space. The fan includes a first fixing portion. The cover detachably covers the accommodating space, and the cover includes a second fixing portion in accommodating space. The stereoscopic dust extraction mesh includes a body, a third fixing portion, and a fourth fixing portion, and the third fixing portion and the fourth fixing portion are located at periphery of the body. The third fixing portion of the stereoscopic dust extraction mesh cooperates with the first fixing portion of the fan, and the fourth fixing portion of the stereoscopic dust extraction mesh cooperates with the second fixing portion of the cover to detachably fix the stereoscopic dust extraction mesh between the cover and the fan.Type: ApplicationFiled: December 14, 2012Publication date: August 22, 2013Inventors: Chun-Chieh Wong, Cheng-Yu Wang
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Publication number: 20120279688Abstract: A heat dissipating module disposed between a plurality of heating elements is provided. The heat dissipating module includes a plurality of heat conducting units, a set of heat dissipating fins, a plurality of fans, a plurality of sensing units and a control unit. The heat conducting units are connected to the set of the heat dissipating fins and the heating elements. A gap exists between the heat conducting units. The fans are disposed at the same side of the set of the heat dissipating fins. The sensing units are coupled to the heating elements, respectively, to detect the heat generated by the heating elements. The control unit is electrically connected to the fans and the sensing units. The heat generated by the heating elements is different from each other, and the control unit adjusts the speed of the fans according to the heat generated by the heating elements.Type: ApplicationFiled: May 4, 2012Publication date: November 8, 2012Applicant: ASUSTEK COMPUTER INC.Inventors: Chun-Chieh Wong, Cheng-Yu Wang
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Publication number: 20120138284Abstract: A heat dissipating device includes a supporting part, a plurality of first fins and a plurality of second fins. The first fins are disposed in a vertical array at the supporting part. The second fins are disposed in an inclined array at the supporting part. The first fins and the second fins are staggeredly disposed and adjacent to each other correspondingly. The heat exchange efficiency of the fins is improved so as to increase the heat dissipating efficiency of the heat dissipating device.Type: ApplicationFiled: November 18, 2011Publication date: June 7, 2012Inventors: Chun-Chieh WONG, Cheng-Yu Wang
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Publication number: 20120114476Abstract: A ventilator includes a first casing, a second casing, a fan blade and a flow guider. The second casing is connected to the first casing and forms a flow channel between the first casing and the second casing. The fan blade is disposed between the first casing and the second casing. When the fan blade rotates, an air-flow compression zone and an air-flow decompression zone are formed in the flow channel. The flow guider is formed along a boundary line to the air-flow decompression zone, wherein the boundary line is adjacent to the air-flow compression zone and the air-flow decompression zone. With the ventilator, the air pressure of the ventilator is increased and noise can be controlled.Type: ApplicationFiled: September 23, 2011Publication date: May 10, 2012Inventors: Chun-Chieh Wong, Chen-Yu Wang