Abstract: A method of reducing the amount of black in an image is disclosed. The method is using a computer to reduce the amount of or eliminate the black in an original digital image. The major procedure is to increase the pixels of the original digital image (by four or nine times) and then change the color information of the pixels.

Abstract: A method for fabricating a semiconductor device with improved bonding ability is disclosed. The method comprises providing a substrate having a front surface and a back surface; forming one or more sensor elements on the front surface of the substrate; forming one or more metallization layers over the front surface of the substrate, wherein forming a first metallization layer comprises forming a first conductive layer over the front surface of the substrate; removing the first conductive layer from a first region of the substrate; forming a second conductive layer over the front surface of the substrate; and removing portions of the second conductive layer from the first region and a second region of the substrate, wherein the first metallization layer in the first region comprises the second conductive layer and the first metallization layer in the second region comprises the first conductive layer and the second conductive layer.

Abstract: The present relates to a remote control method and a remote control system capable of switching different pointing modes. The remote control method includes a first wireless transmission module transmitting a first wireless signal with a first pointing mode code to an electronic device, a second wireless transmission module transmitting a second wireless signal with a second pointing mode code to the electronic device, and the electronic device performing movement of an icon at a first pointing mode or at a second pointing mode according to the received first pointing mode code or the received second pointing mode code and pointing mode relation information.

Abstract: An image processing method including the following steps is provided. First, a two-dimensional original image is received. Next, a plurality of depth values corresponding to the two-dimensional original image are received. Afterwards, a two-dimensional shifting image is obtained according to the depth values and a standard value. A plurality of shifting values exist between the two-dimensional shifting image and the two-dimensional original image, and the shifting values are determined by a plurality of differences between the depth values and the standard value. Thereafter, a three-dimensional image is produced according to the two-dimensional original image and the two-dimensional shifting image.

Abstract: A 3D image display system includes a display equipment and a shutter glasses. The display equipment includes an LCD module. The LCD module has a linear polarizing unit and is able to generate an image light from the linear polarizing unit. The shutter glasses include two liquid crystal optical units, at least one linear polarizing unit, and at least one polarizing optical element. The linear polarizing unit is disposed between the polarizing optical element and the liquid crystal optical units. The image light passes through the polarizing optical element, the linear polarizing unit, and one of the liquid crystal optical units in sequence. When the image light passes through one of the liquid crystal optical units, the other liquid crystal optical unit blocks the image light.

Abstract: A method and device for adjusting communications power are used for detecting a communications condition between a connection port and a connection target, and a communications-supporting power of the connection port that includes at least one of a transmitting power and a receiving power is adjusted according to a detected communications condition. Therefore, accuracy of data transmission and reception is ensured, and power used for data transmission and reception is reduced.

Abstract: A radio frequency(RF) printed circuit board (PCB) includes an RF circuit for generating high frequency signals. The RF PCB is connected to an EMC measuring device when measuring the EMC thereof. The measuring device includes a probe pin and a shielding barrel surrounding the probe pin. The shielding barrel includes an end surface at a distal end thereof. The RF PCB further includes a test node connected to the RF circuit and a ground node surrounding the test node. The test node contacts the probe pin and outputs the high frequency signals when measuring the EMC of the RF PCB. The ground node corresponds to the end surface and contacts the end surface while the probe pin contacts the test node.

Abstract: In one embodiment, a method implemented by a processor, comprising receiving voltage values corresponding to a battery system, receiving charge values corresponding to charge flowing through the battery system, and determining a state of charge based on specified anchoring points of a charge integration, the anchoring points based on the received voltage and time.

Abstract: In one embodiment, a battery management system comprising a first circuit comprising a first plurality of circuit elements arranged in series, the first plurality of circuit elements comprising: a direct current (DC) voltage source, and first plural switching devices, each of the first plural switching devices connected to, and operably switched by, a first detection device associated with a battery module to cause a voltage difference responsive to detection of an event corresponding to operation of the battery module.

Abstract: A signal to noise power ratio estimation system for multi-carrier communication includes a phase rotator, a power estimator, a channel gain calculator, an average and selection device, a combination and calculation device and a decibel (dB) transformation device. The signal to noise power ratio estimation system makes use of a transmit parameter signaling or pilot subcarriers to blindly assist in the signal to noise power ratio estimation to accordingly gain an estimated signal to noise power ratio accurately, and thus a communication system can be calibrated to a preferred condition.

Abstract: The present relates to a remote control method and a remote control system capable of switching different pointing modes. The remote control method includes a detecting unit of a remote control detecting a relative position between a first module and a second module of the remote control so as to generate a detecting signal, transmitting a pointing mode code to an electronic device according to the detecting signal by wireless communication technology, and the electronic device performing movement of an icon according to the pointing mode code and pointing mode relation information.

Abstract: An interface apparatus and a method of writing an extended display identification data (EDID) are provided. The interface apparatus includes a data processing unit, a memory unit and a switching unit. The memory unit is coupled to a connector corresponding to the memory unit and the data processing unit via the switching unit. When the interface apparatus is being initialized, the data processing unit detects whether or not the EDID stored in the memory unit is correct. If the EDID stored in the memory unit is incorrect, the data processing unit rewrites the EDID to the memory unit.

Abstract: An incorrect-circuit deactivation device of a magnetic GFCI outlet includes an electromagnetic coil seat, a magneto-conductive core driven by the electromagnetic coil seat to displace, and two magnetic elements located on both sides of the magneto-conductive core. The magneto-conductive core is connected to a first electrical conductive end. The first electrical conductive end is positioned to face a second electrical conductive end. Electric power is supplied when the first electrical conductive end is brought into contact with the second electrical conductive end. The electromagnetic coil seat senses a reverse current to make the magneto-conductive core to displace toward one of the magnetic elements when there is a ground fault, thereby departing the first electrical conductive end from the second electrical conductive end to cut off the electric current.

Abstract: An LED lamp (Light Emitting Diode) manufacturing method is disclosed. The method includes the steps as following. First, a fluorescent powder and a translucent plastic are mixed to be a mixed material, and the ratio of the fluorescent powder and the translucent plastic is below 80:100. Second, the mixed material is applied to form a lamp shell by the injection molding technology. Third, at least one LED is arranged at the center of the bottom of the lamp shell.

Abstract: A liquid crystal display (LCD) panel includes a plurality of scan lines, a plurality of data lines, a plurality of common electrode lines, a plurality of pixel units, and at least one voltage regulating chip. The pixel units are coupled to the corresponding scan lines, the corresponding data lines, and the corresponding common electrode lines, respectively. The voltage regulating chip is coupled to a regulated voltage and the common electrode lines, so as to provide a regulated current to each of the common electrode lines based on the regulated voltage, respectively.

Abstract: A manufacturing method of a color filter including following steps is provided. First, a partition is formed on a substrate to form a plurality of pixel regions on the substrate. Next, a color pigment is provided along a continuous pigment-providing route, so as to form the color pigment on a sequence of pixel regions among the plurality of pixel regions and the partition. The method mentioned above can prevent the unfilled phenomenon of the pigment around the corners of the pixel region. Besides, a liquid crystal display panel having the color filter is also provided.

Abstract: An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal board body formed with a plurality of penetrating conductive through holes each comprising a plurality of nano wires and an oxidative block having nano apertures filled with the nano wires. The multi-chip stack package structure includes a first chip and an electronic component respectively disposed on the inner-layer heat-dissipating board to thereby facilitate heat dissipation in the multi-chip stack structure as well as increase the overall package rigidity.

Abstract: A customer premises equipment (CPE) receives data packets from a network service device via a primary service flow. When the CPE detects flood of packets in the data packets received via the primary service flow, the CPE determines a source Internet protocol (IP) address of the flood of packets. The CPE establishes a new service flow with the network service device. A source IP address of the new service flow is set to the source IP address of the flood of packets, and a transfer speed of the new service flow is less than that of the primary service flow. The CPE transfers the flood of packets from the primary service flow to the new service flow.

Abstract: A power tool is provided with a perforated material remover to remove perforated material from power tool cutting implements. The power tool also includes a rip guide which has a long guide edge and two attachment points to the shoe/base of the saw. The rip guide is attached to the base/shoe via a pair of L-shaped openings that accept L-shaped support arms of the rip guide. The rip guide can also be folded for compact storage. The power tool also includes dual bevel scales for quickly and easily setting the bevel angle on the power tool.

Abstract: A bendable patch panel structure installed on a chassis includes a patch panel and a fixing element. The patch panel includes a first panel, a second panel, a hinge pivotally coupled between ends of the first and second panels, and a connecting plate separately installed at other ends of the first panel and second panel and pivotally coupled to the chassis. After the first and second panels are bent and adjusted, a fixing element for the appropriate connection is selected according to the shape of the two unfolded metal plates of the hinge, such that the installer can adjust the bending condition of the patch panel in a time-saving, effort-saving, quick and easy manner.