Abstract: A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.

Abstract: A semiconductor device structure, along with methods of forming such, are described. The structure includes a first source/drain (S/D) region disposed over a substrate, a second S/D region disposed over the substrate, a dielectric wall disposed between the first and second S/D regions, a first conductive contact disposed over and electrically connected to the first S/D region, a second conductive contact disposed over and electrically connected to the second S/D region, and a first dielectric material in contact with the dielectric wall. The first dielectric material has a top surface located at a first level between a top surface of the first conductive contact and a bottom surface of the first conductive contact, and the first dielectric material extends from the first level to a second level located below the bottom surface of the first conductive contact.

Abstract: Semiconductor structures and methods for manufacturing the same are provided. The semiconductor structure includes channel structures vertically stacked over a substrate and a source/drain structure laterally attached to the channel structures in the first direction. The semiconductor structure also includes a dielectric wall structure laterally attached to the channel structures in the second direction. The second direction is different from the first direction. In addition, the dielectric wall structure includes a bottom portion and a cap layer formed over the bottom portion. The semiconductor structure also includes an isolation feature vertically overlapping the cap layer of the dielectric wall structure and a gate structure formed around the channel structures and covering a sidewall of the isolation feature.

Abstract: A semiconductor device includes a semiconductor substrate having a first lattice constant, a dopant blocking layer disposed over the semiconductor substrate, the dopant blocking layer having a second lattice constant different from the first lattice constant, and a buffer layer disposed over the dopant blocking layer, the buffer layer having a third lattice constant different from the second lattice constant. The semiconductor device also includes a plurality of channel members suspended over the buffer layer, an epitaxial feature abutting the channel members, and a gate structure wrapping each of the channel members.

Abstract: A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.

Abstract: A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.

Abstract: A transmissive optical encoder comprises a base, a first leadframe, a second leadframe, an optical emitter, a shielding portion, an optical receiver, and a lens. The base has a first housing and a second housing. The first leadframe and the second leadframe are respectively disposed in the first housing and the second housing. The optical emitter for emitting a light is disposed in the first housing and coupled to the first leadframe. The shielding portion is extended from the first leadframe being bent to cover the optical emitter and exposes the optical emitter by an opening formed thereon. The optical receiver for receiving the light is disposed in the second housing and coupled to the second leadframe. The lens is disposed on the first housing for rendering the light passing through the opening to the optical receiver.

Abstract: A photo interrupter is provided. The photo interrupter includes a housing and a light emitting/receiving unit. The housing defines a recess portion and has a first engaging portion disposed in the recess portion. The light emitting/receiving unit has a second engaging portion. When the light emitting/receiving unit is disposed in the recess portion, the first engaging portion engages with the second engaging portion.

Abstract: A small type photo-interrupter and a fabrication method of small type photo-interrupter. The fabrication method of small type photo-interrupter includes removing a portion of the surface of the substrate between the light-emitter and the light-sensor and forming an opaque sealing member on the place where the portion of the substrate is removed.

Abstract: A photo interrupter is provided. The photo interrupter includes a housing and a light emitting/receiving unit. The housing defines a recess portion and has a first engaging portion disposed in the recess portion. The light emitting/receiving unit has a second engaging portion. When the light emitting/receiving unit is disposed in the recess portion, the first engaging portion engages with the second engaging portion.

Abstract: The present invention is an LED lamp lens, on which orderly arranged surface plural protuberances. And with the differences of light perviousness, a particular luminous pattern of the LED lamp is displayed when the LED lamp is turned on.

Abstract: An optical sensing device is suitable for detecting information on an information plane. The optical sensing device includes a light source, an optical grating and an optical detector. The light source is suitable for providing a light beam along a first axis. The light beam is illuminated on the information plane and is converted into an optical signal exiting the information plane. The optical grating has at least a split. The optical detector is suitable for receiving the optical signal to generate the information. The optical signal passes through the split of the grating and reaches the optical detector along a second axis that is positioned at an angle with respect to the first axis.

Abstract: A transmissive optical encoder comprises a base, a first leadframe, a second leadframe, an optical emitter, a shielding portion, an optical receiver, and a lens. The base has a first housing and a second housing. The first leadframe and the second leadframe are respectively disposed in the first housing and the second housing. The optical emitter for emitting a light is disposed in the first housing and coupled to the first leadframe. The shielding portion is extended from the first leadframe being bent to cover the optical emitter and exposes the optical emitter by an opening formed thereon. The optical receiver for receiving the light is disposed in the second housing and coupled to the second leadframe. The lens is disposed on the first housing for rendering the light passing through the opening to the optical receiver.

Abstract: An infrared receiving module is disclosed. The infrared receiving module including a first strip element, a second strip element, an infrared receiver disposed on the second strip element, and a resin wrapping the first strip element and the second strip element. The first strip element has a receiving window. The infrared receiver on the second strip element is under the receiving window.

Abstract: The present invention is an LED lamp lens, on which orderly arranged surface plural protuberances. And with the differences of light perviousness, a particular luminous pattern of the LED lamp is displayed when the LED lamp is turned on.

Abstract: An infrared receiving module is disclosed. The infrared receiving module including a first strip element, a second strip element, an infrared receiver disposed on the second strip element, and a resin wrapping the first strip element and the second strip element. The first strip element has a receiving window. The infrared receiver on the second strip element is under the receiving window.