Abstract: A Rugged portable device comprises: a base, a cover pivotally connected to the base, a first antenna unit, a second antenna unit, and a control unit. The first antenna unit and the second antenna unit are respectively disposed at an edge of the cover and an edge of the base, and the first antenna unit and the second antenna unit respectively have a near-field antenna and a far-field antenna. When the cover pivots relative to the base and is close to the base, the near-field antenna disposed at the cover and the near-field antenna disposed at the base generate a near-field communication (NFC) sensing signal and the near-field communication sensing signal is transmitted to the control unit. Therefore, the control unit sets up one of functions in the rugged portable device. For instance, the control unit switches off and/or switches on the far-field antenna or a peripheral unit (a keyboard or a camera).

Abstract: A lifting apparatus, ultraviolet irradiation apparatus for alignment, and substrate alignment method. The lifting apparatus comprises: a support plate, provided with multiple lifting rods passing therethrough, each lifting rod being provided with at least one through hole (13) through which a respective lifting rod passes and extends along a vertical direction; an air producing mechanism, in communication with each through hole (13); and a transmission mechanism, disposed at the lower end of the lifting rods.

Abstract: A lifting apparatus, ultraviolet irradiation apparatus for alignment, and substrate alignment method. The lifting apparatus comprises: a support plate, provided with multiple lifting rods passing therethrough, each lifting rod being provided with at least one through hole (13) through which a respective lifting rod passes and extends along a vertical direction; an air producing mechanism, in communication with each through hole (13); and a transmission mechanism, disposed at the lower end of the lifting rods.

Abstract: This application relates to an apparatus for attaching a polarized plate with check mark and a checking method therefor. The apparatus includes: a carrying platform, configured to carry a polarized plate, where the polarized plate has the check mark; a drawing unit, disposed at one side of the carrying platform and configured to draw the polarized plate out of the carrying platform; an image sensing and processing unit, disposed above the drawing unit and configured to photograph the mark of the polarized plate and to compare the mark with a mark of a polarized plate standard template to determine whether the marks conform to each other; a cleaning unit, disposed at one side of the drawing unit and configured to clean the polarized plate from the drawing unit; and an alignment unit, disposed at one side of the cleaning unit and configured to align the polarized plate from the cleaning unit with a display panel.

Abstract: The present application discloses a panel manufacturing device which includes a veneer cutting machine adapted to cutting a substrate, an alignment ultraviolet lighting machine adapted to performing ultraviolet irradiation alignment on the substrate sent by the veneer cutting machine, and an air knife erected at the discharge port of the veneer cutting machine, adapted to cleaning foreign matter on the substrate sent by the veneer cutting machine.

Abstract: This application relates to a polarizer attaching quality detection system and method. The system includes: an attaching unit, configured to attach a polarizer to a surface of a liquid crystal panel; a pressurization defoaming unit, configured to pressurize the polarizer attached by the attaching unit on the surface of the liquid crystal panel; an attaching quality detection unit, configured to detect whether the polarizer is closely attached to the surface of the liquid crystal panel; a reprocessing attaching machine unit, configured to: re-attach the polarizer to the surface of the liquid crystal panel when the polarizer is not closely attached to the surface of the liquid crystal panel; and a conveyor line, connected to the attaching unit, the pressurization defoaming unit, the attaching quality detection unit, and the reprocessing attaching machine unit, wherein the conveyor line is configured to convey the polarizer and the liquid crystal panel.

Abstract: This application provides a substrate baking apparatus and a baking operation method. The apparatus includes: a ring-shaped bearer body, used to cover a substrate; a cover plate, disposed on the ring-shaped bearer body, which, together with the cover plate, defines a sealed chamber, where a surface of the substrate is located inside the sealed chamber; an air intake unit and an exhaust discharge unit, respectively disposed on an intake end and a discharge end of the sealed chamber; and an exhaust regulation air-extraction system, disposed on an upper part of the cover plate, communicated with the sealed chamber, and used to regulate and discharge evaporated gases of a great number of volatiles of the substrate.

Abstract: A semiconductor device includes a substrate main body, a plurality of first bump pads, and redistribution layer (RDL). The first bump pads are disposed adjacent to a surface of the substrate main body, each of the first bump pads has a first profile from a top view, the first profile has a first width along a first direction and a second width along a second direction perpendicular to the first direction, and the first width of the first profile is greater than the second width of the first profile. The RDL is disposed adjacent to the surface of the substrate main body, and the RDL includes a first portion disposed between two first bump pads.

Abstract: A semiconductor device package ready for assembly includes: a semiconductor substrate; a first under-bump-metallurgy (UBM) layer disposed on the semiconductor substrate; a first conductive pillar disposed on the first UBM layer; and a second conductive pillar disposed on the first conductive pillar. A material of the first conductive pillar is different from a material of the second conductive pillar, and the material of the second conductive pillar includes an antioxidant.

Abstract: A semiconductor device package ready for assembly includes: a semiconductor substrate; a first under-bump-metallurgy (UBM) layer disposed on the semiconductor substrate; a first conductive pillar disposed on the first UBM layer; and a second conductive pillar disposed on the first conductive pillar. A material of the first conductive pillar is different from a material of the second conductive pillar, and the material of the second conductive pillar includes an antioxidant.

Abstract: A semiconductor device includes a substrate main body, a plurality of first bump pads, and redistribution layer (RDL). The first bump pads are disposed adjacent to a surface of the substrate main body, each of the first bump pads has a first profile from a top view, the first profile has a first width along a first direction and a second width along a second direction perpendicular to the first direction, and the first width of the first profile is greater than the second width of the first profile. The RDL is disposed adjacent to the surface of the substrate main body, and the RDL includes a first portion disposed between two first bump pads.

Abstract: A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure.

Abstract: A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure.

Abstract: A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure.

Abstract: A liquid crystal display (LCD) includes a first substrate, a second substrate, and a sealing member. The sealing member is sandwiched between the first and second substrates, and forms a perimeter encircling a display area of the LCD device. After delivery of at least one drop of liquid crystal, any excessive liquid crystal trapped within the perimeter is discharged through an opening broken in the sealing member. The opening is plugged to enclose an amount of liquid crystal within the perimeter.

Abstract: A liquid crystal display (LCD) device includes a first substrate, a second substrate, and a sealing member. The sealing member is sandwiched between the first and second substrates, and forms a perimeter encircling a display area of the LCD device. After delivery of at least one drop of liquid crystal, any excessive liquid crystal trapped within the perimeter is discharged through a discharge port in the sealing member. The discharge port is plugged with a sealant.

Abstract: A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure.

Abstract: A method of fabricating a plastic part having a three-dimensional image and visual effect. A plastic part having a three-dimensional graphical surface and a flat plane is formed. Subsequently, a thin film layer is formed on the plastic part to provide three-dimensional image and visual effect to the plastic part, where the three-dimensional graphical surface provides the three-dimensional image and the thin film layer provides the visual effect.

Abstract: A buffer amplifier for source driver is disclosed. The buffer amplifier has an N-channel differential amplifier and a P-channel differential amplifier as its input stages so as to achieve rail-to-rail input, and a class AB amplifier to push-pull the output stage so as to achieve rail-to-rail output. The output stage of the buffer amplifier is capable of larger charge/discharge, is faster, and has equal charge/discharge time. More importantly, the buffer amplifier has advantages such as lower power consumption, higher slew rate, and a more stable output.