Abstract: An SRAM cell includes a first n-type channel (n-channel) layer engaged with a first gate layer to form a first device; a first p-type channel (p-channel) layer engaged with the first gate layer to form a second device, the first gate layer stacked between the first n-channel layer and the first p-channel layer along a first direction; a second n-channel layer engaged with a second gate layer to form a third device, the second gate layer coupled to a first word line and the second n-channel layer coupled to the first n-channel layer along a second direction perpendicular to the first direction; a third n-channel layer engaged with a third gate layer to form a fourth device, the third n-channel layer spaced from the second n-channel layer along a third direction perpendicular to the first direction and the second direction; a second p-channel layer engaged with the third gate layer to form a fifth device, the third gate layer stacked between the third n-channel layer and the second p-channel layer along the fir

Abstract: A device produces a dolly zoom effect with automatic focal length adjustment. The device uses a camera to capture an initial image including at least a foreground object and a background. The device includes a size tracking circuit to identify the size of the foreground object in the initial image. The device further includes a focal length control circuit. The focal length control circuit calculates an adjusted focal length of the camera to maintain the size of the foreground object in subsequently captured images.

Abstract: A method includes depositing a metal to form a gate layer for a first memory cell in a metallization layer of the semiconductor device. The method includes forming a plurality of semiconductor channels separated from the gate layer by a gate oxide layer. The method includes defining a plurality of gates from the gate layer. The method includes interconnecting the plurality of gates and the plurality of semiconductor channels to form a memory cell, wherein the interconnection comprises a plurality of mezzanine levels.

Abstract: A headset test device includes a supporting frame, a drive adjusting system, a head model mechanism and a sensing system. The supporting frame includes a transverse adjusting supporter assembly and a vertical adjusting supporter assembly. The drive adjusting system includes a first motor and a second motor. The transverse adjusting supporter assembly and the vertical adjusting supporter assembly are connected with and are driven by the first motor and the second motor, respectively. The head model mechanism includes a parietal region driven by the second motor to vertically move, and two aural regions driven by the first motor to move close to or away from each other for increasing or reducing a distance between the two aural regions. Each of the two aural regions is equipped with an artificial ear. The sensing system includes a force sensing unit, a pressure sensing unit and a temperature sensing unit.

Abstract: An in-ear earphone has a shell including an upper shell and a lower shell cooperating with the upper shell to define a resonance space for receiving a loudspeaker. A plurality of damping objects are made of different elastic and compressible materials. A group of first adjusting elements are capable of being replaceablely assembled to the lower shell for receiving external sound signals. Each first adjusting element defines a receiving fillister and a sound hole connected with the receiving fillister. Each first adjusting element has one damping object disposed in the receiving fillister and further disposed between the sound hole and the resonance space. A group of second adjusting elements are capable of being replaceablely assembled to the upper shell for transmitting the sound signals out. Each second adjusting element defines a receiving cavity for receiving one of the damping objects therein and makes it face to the resonance space.

Abstract: An earphone includes a basket defining a through hole. A leading wire board fixed underneath the basket has a pair of solder foils on a bottom surface thereof. A magnet unit is located in the basket with the through hole adjacent to a side edge of the magnet unit. A diaphragm is arranged on the basket and over the magnet unit. A voice coil is fixed to a bottom of the diaphragm and surrounding the magnet unit. The voice coil has two leading wires. Each leading wire passes through the through hole of the basket and further bends to solder with the corresponding solder foils of the leading wire board.

Abstract: An in-ear earphone has a shell including an upper shell and a lower shell cooperating with the upper shell to define a resonance space for receiving a loudspeaker. A plurality of damping objects are made of different elastic and compressible materials. A group of first adjusting elements are capable of being replaceablely assembled to the lower shell for receiving external sound signals. Each first adjusting element defines a receiving fillister and a sound hole connected with the receiving fillister. Each first adjusting element has one damping object disposed in the receiving fillister and further disposed between the sound hole and the resonance space. A group of second adjusting elements are capable of being replaceablely assembled to the upper shell for transmitting the sound signals out. Each second adjusting element defines a receiving cavity for receiving one of the damping objects therein and makes it face to the resonance space.

Abstract: An earphone includes a basket defining a through hole. A leading wire board fixed underneath the basket has a pair of solder foils on a bottom surface thereof. A magnet unit is located in the basket with the through hole adjacent to a side edge of the magnet unit. A diaphragm is arranged on the basket and over the magnet unit. A voice coil is fixed to a bottom of the diaphragm and surrounding the magnet unit. The voice coil has two leading wires. Each leading wire passes through the through hole of the basket and further bends to solder with the corresponding solder foils of the leading wire board.