Abstract: A method for predicting a source of semiconductor part deviation is disclosed. The method includes the steps of selecting at least one chart including part parameters and associating with each of the part parameters at least one fabrication process, which are stored in recipes, scanning the selected charts for deviations in the part parameters, wherein the deviations are determined by monitoring a trend of recent values of the part parameters, indicating the charts containing the part parameters wherein the part parameter values are determined as being outside of at least one trend tolerance value associated with the parameter, identifying, in each of the indicated charts at least one process associated with each of the part parameter deviations outside the at least one tread tolerance value, and determining a source of the parameter deviation by correlating each of the identified at least one processes.