Abstract: A light modulating Backplane with multi-layer pixel electrodes is disclosed. The light modulating backplane includes a multiple pixel control circuits and multiple pixel electrodes. The pixel electrodes include a first pixel electrode layer coupled to a corresponding pixel control circuit and a second pixel electrode layer. A passivation layer covers the pixel electrodes. The first pixel electrode layer is formed using a first metal such as copper and the second pixel electrode layer is formed using a second metal such as aluminum.

Abstract: An elastomer is provided, which is a product of reacting C4-12 lactam, poly(C2-4 alkylene glycol), C4-12 diacid, and multi-ester aliphatic monomer. The C4-12 lactam and the poly(C2-4 alkylene glycol) have a weight ratio of 20:80 to 80:20. The total weight of the C4-12 lactam and the poly(C2-4 alkylene glycol) and the weight of the C4-12 diacid have a ratio of 100:0.5 to 100:10. The total weight of the C4-12 lactam and the poly(C2-4 alkylene glycol) and the weight of the multi-ester aliphatic monomer have a ratio of 100:0.01 to 100:5.

Abstract: A semiconductor manufacturing system includes an operating terminal, a first controller, and a plurality of second controllers. The operating terminal controls a main controller. Each of the plurality of second controllers is electrically connected to the first controller. In an initial or default state, the operating terminal controls the first controller as a main controller, and when the first controller fails, the operating terminal controls one of the plurality of the second controllers as a main controller, the others of the plurality of second controllers being controlled by the main controller.

Abstract: A mobile communication device based on a virtual mobile infrastructure is provided, including: a display device for displaying a graphical user interface (GUI); a communication device for providing a network connection to a remote server; a storage device; and a controller for performing an input method switching method including the following operations during performing first application (APP) of remote server: displaying operation screen of first APP on GUI; receiving first notification indicating that remote input keyboard has enabled from remote server; in response, use local input keyboard of local input to cover remote input keyboard to enable a user uses local input method for inputting and to transmit user inputs to remote server to display user inputs on respective remote location; and receiving second notification indicating that remote input keyboard has disabled from remote server and in response, hide local input keyboard on operation screen.

Abstract: A front opening unified pod (FOUP) loading and air filling system comprises a FOUP loading device and an air filling device. The FOUP loading device is configured to load and unload a FOUP, and comprises a substrate and a controller. The substrate comprises a frame, a bearing platform installed on the frame, and a cavity under the bearing platform. The bearing platform is configured to support the FOUP. The controller and the air filling device are accommodated in the cavity. The air filling device is connected to the FOUP.

Abstract: A wafer supporting system includes a supporting pedestal. The supporting pedestal includes a main supporting body and a hollow frame surrounding the supporting pedestal. The main supporting body includes a top surface and a bottom surface opposite to the top surface, the top surface defined a plurality of vent grooves and a plurality of holding grooves. The main supporting body includes a plurality of holding channels extending through from the bottom surface to the holding grooves and a plurality of first through holes pass through from the top surface to the bottom surface, each holding groove is surrounded by a plurality of first through holes; an inner side surface of the hollow frame and a side wall of the supporting pedestal form a gap, and a plurality of exhaust cylinders are arranged in the annular gap and each exhaust cylinder is communicated with each vent groove.

Abstract: A reflective exposure apparatus includes a platform, an illuminating system, a photomask, a chip, and a reflecting convex mirror. The photomask is formed on the platform and faces the illuminating system. The chip is formed on the platform. The illuminating system and the reflecting curved mirror are formed on opposite sides of the platform. The platform can be moved relative to the illuminating system and the reflecting curved mirror.

Abstract: An air purifying device for an FOUP includes an air supply assembly. The air supply assembly includes an air supply tube and an airtight connecting unit connecting the tube to the FOUP in an airtight manner. The air tight connecting unit includes an elastic absorbing portion, a nozzle, and a driver. An initial position of the elastic absorbing portion is lower than a supporting surface of a load port before the FOUP is placed on the supporting surface. One end of the nozzle is fixedly inserted to the elastic absorbing portion, and another end of the nozzle is movably inserted to the air supply tube. The driver can drive the nozzle and the elastic absorbing portion to move upward to press against the FOUP when the FOUP is placed on the supporting surface, causing the elastic absorbing portion to be vertically deformed to maintain an airtight connection.

Abstract: An air purifying device for a front opening unified pod (FOUP) carrying silicon wafers includes an air supply assembly and an air discharging assembly. The air supply assembly can be triggered by a signal to supply purified air to the FOUP. The air discharging assembly discharges air from the FOUP when the air supply assembly begins to supply the FOUP with purified air and detects a humidity and a temperature of the discharged air. The detected humidity and the detected temperature correspond to a relative humidity of the discharged air. When the relative humidity is equal to a preset relative humidity, the air supply assembly is stopped and the air discharging assembly is stopped.

Abstract: A golf club head alloy includes by weight percent 6.5-7.5% of aluminum, 1.0-2.5% of iron, 0.05-0.2% of silicon, less than 0.15% of oxygen, less than 0.1% of carbon, less than 0.05% of nitrogen, the rest being titanium and inevitable impurities. Furthermore, the golf club head alloy has a density of 4.35-4.39 g/cm3. A method of producing a light golf club head includes: providing a sheet blank produced from the above aluminum club head alloy; annealing the sheet blank at 500-800° C. for 30-90 minutes and forming a striking plate; coupling the striking plate to a club head body to form a club head semi-product; and performing aging heat treatment on the club head semi-product at 400-700° C. for 30-240 minutes.

Abstract: A switch system is provided. The switch system comprises a first multiplexer and a baseboard management controller (BMC). The first multiplexer is coupled to a first electrically-erasable programmable read-only memory (EEPORM). The baseboard management controller transmits a first control signal to the first multiplexer by a first multiplexer control channel. Wherein, the first control signal controls the first multiplexer coupling to a first serial peripheral interface (SPI) bus. The baseboard management controller transmits a first system parameter to the first multiplexer by the fist SPI bus. The first multiplexer writes the first system parameter by a second serial peripheral interface bus to the first electrically-erasable programmable read-only memory.

Abstract: A semiconductor device includes a substrate and a device. The substrate has a first surface and a second surface opposite to each other. The substrate includes a first well region, and the first well region includes a first shallow implantation region adjacent to the first surface and a first deep implantation region adjacent to the second surface, in which a dopant concentration of the first deep implantation region at the second surface is substantially equal to 0. The device is disposed on the first surface of the substrate and adjoins the first shallow implantation region.

Abstract: A micro LED display module and a manufacturing method thereof are provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

Abstract: A micro LED display module having a light transmissive substrate and a manufacturing method thereof are provided. The light transmissive substrate has good transmissivity with respect to the visible band. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to pixel electrodes and the other is electrically connected to the light transmissive substrate. The trenches define a plurality of micro LED pixels arranged in an array. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

Abstract: A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed on the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed on the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

Abstract: A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, and the color layer is disposed on the light transmissive conductive layer.

Abstract: A binocular head-mounted device with interpupillary distance adjustment mechanisms is provided in the present invention, which comprises a visual frame, two display modules and two interpupillary distance adjustment mechanisms. The two display modules are disposed at a left side and a right side of the visual frame respectively. Each of the two interpupillary distance adjustment mechanisms is disposed on one of the display modules and on the visual frame and has a snap-fit portion and a positioning structure corresponding thereto. The positioning structure has a plurality of positioning recesses arranged horizontally in a first direction, and the plurality of positioning recesses can be snap-fitted with the snap-fit portion so that the display module is moved parallel to the first direction and then positioned.

Abstract: A binocular head-mounted device with interpupillary distance adjustment mechanisms is provided in the present invention, which comprises a visual frame, two display modules and two interpupillary distance adjustment mechanisms. The two display modules are disposed at a left side and a right side of the visual frame respectively. Each of the two interpupillary distance adjustment mechanisms is disposed on one of the display modules and on the visual frame and has a snap-fit portion and a positioning structure corresponding thereto. The positioning structure has a plurality of positioning recesses arranged horizontally in a first direction, and the plurality of positioning recesses can be snap-fitted with the snap-fit portion so that the display module is moved parallel to the first direction and then positioned.

Abstract: Systems and methods are disclosed for extending application functionality via conversational interfaces. In one implementation, a first communication is received from an interaction engine. The first communication is processed to identify an application that the communication is directed to, The first communication is provided to an application extension engine associated with the first application. A second communication is received from the application extension engine. The second communication is provided to the interaction engine.

Abstract: A semiconductor device includes a substrate and a device. The substrate has a first surface and a second surface opposite to each other. The substrate includes a first well region, and the first well region includes a first shallow implantation region adjacent to the first surface and a first deep implantation region adjacent to the second surface, in which a dopant concentration of the first deep implantation region at the second surface is substantially equal to 0. The device is disposed on the first surface of the substrate and adjoins the first shallow implantation region.