Abstract: Disclosed is a thermal conduction-electrical conduction isolated circuit board with a ceramic substrate and a power transistor embedded, mainly comprising: a dielectric material layer, a heat-dissipating ceramic block, a securing portion, a stepped metal electrode layer, a power transistor, and a dielectric material packaging, wherein a via hole is formed in the dielectric material layer, the heat-dissipating ceramic block is correspondingly embedded in the via hole, the heat-dissipating ceramic block has a thermal conductivity higher than that of the dielectric material layer and a thickness less than that of the dielectric material layer, the stepped metal electrode layer conducts electricity and heat for the power transistor, the dielectric material packaging is configured to partially expose the source connecting pin, drain connecting pin, and gate connecting pin of the encapsulated stepped metal electrode layer.

Abstract: A method of blow molding an article having at least one layer of thermoplastic material. The method comprises the steps of heating a mold having an inner surface with two or more areas of different surface textures to a first temperature of greater than 55° C. and subsequently feeding a parison into the mold. The parison is then blown against the inner surface of the mold to form an article. The temperature of the mold is subsequently lowered to a second temperature of between 20° C. to about 55° C. and the temperature cycle time (tct) of the mold is less than 250 seconds. Using the two phase heating and cooling process in combination with a mold featuring different surface textures provides a finished article with different visual effects.

Abstract: A method of blow molding a glossy article having at least one layer of thermoplastic material. The method comprises the steps of feeding a parison of said thermoplastic material into a mold having an inner surface with at least a portion of SPI finish standard selected from the group consisting of A-1, A-2, A-3, B-1, B-2 and B-3 mold and a first temperature of greater than 55° C.; blowing the parison against the inner surface of the mold to form the article; and subsequently lowering the temperature of the mold to a second temperature of between 10° C. to 55° C. before release of the molded article. The cycle time of the mold (tct) is less than 250 seconds.

Abstract: A method of blow molding an article having at least one layer of thermoplastic material. The method comprises the steps of heating a mold having an inner surface with two or more areas of different surface textures to a first temperature of greater than 55° C. and subsequently feeding a parison into the mold. The parison is then blown against the inner surface of the mold to form an article. The temperature of the mold is subsequently lowered to a second temperature of between 20° C. to about 55° C. and the temperature cycle time (tct) of the mold is less than 250 seconds. Using the two phase heating and cooling process in combination with a mold featuring different surface textures provides a finished article with different visual effects.

Abstract: A method of blow molding a glossy article having at least one layer of thermoplastic material. The method comprises the steps of feeding a parison of said thermoplastic material into a mold having an inner surface with at least a portion of SPI finish standard selected from the group consisting of A-1, A-2, A-3, B-1, B-2 and B-3 mold and a first temperature of greater than 55° C.; blowing the parison against the inner surface of the mold to form the article; and subsequently lowering the temperature of the mold to a second temperature of between 10° C. to 55° C. before release of the molded article. The cycle time of the mold (tct) is less than 250 seconds.