Abstract: A device is provided. The device is configured to measure the air speed near an air outlet of an air curtain. The air curtain is mounted near an open of a wafer box. Receiving grooves are defined in the wafer box. Each receiving groove is configured to receive a wafer. The device includes one or more fixing members and one or more air speed measuring members. Each fixing members is received and held in one receiving groove. Each air speed measuring member is arranged on one fixing member. Each air speed measuring member includes one or more sensors. Each sensor extends outside the wafer box and is positioned below the air curtain. Each sensor is configured to measure the air speed near the air outlet of the air curtain. A related wafer box is also provided.

Abstract: The present disclosure is directed to a system and method to identify and track parts of a semiconductor processing chamber, as well as the status of the parts, and store status information in a centralized location as status changes over time.

Abstract: A system for storing wafer is provided. The system includes a wafer box, an installing member, a detection tube, a control unit, and a detection unit. The wafer box includes an outlet connector and an inlet connector extending a wall of the wafer box. The installing member covers the wafer box to form a sealed receiving room. Two ends of the detection tube are coupled to the outlet connector and the inlet connector. The control unit are configured to output a first control signal to the detection unit. The detection unit includes a first sensor arranged in the detection tube. The first sensor is configured to detect a property of gas to obtain data of an environment where the wafer is stored upon the first control signal. A related system for monitoring pollution of wafer is also provided.

Abstract: A device is provided. The device is arranged in a wafer box and is configured to simulate to measure physical properties of a surface of a wafer in the wafer box during an air filling and exchanging operation on the wafer box when the wafer box is closed. The device includes one or more simulating members and one or more sensors. Each simulating members is arranged in one receiving groove. The physical properties of a surface of each simulating member received in the one receiving groove matches with the physical properties of the surface of the wafer received in the one receiving groove. At least one of the one or more sensors is arranged on a corresponding simulating member, each sensor is configured to measure the physical properties of a surface of a corresponding simulating member. A related wafer box is also provided.

Abstract: Certain embodiments provide a method and non-transitory computer readable medium having instructions that, when executed by a processor of a processing system, cause the processing system to perform a method for improving operation of a semiconductor processing system. The method of part life estimation generally includes obtaining a chamber part having a first surface portion and second surface portion. A data matrix in the first portion of the chamber part is read. The data matrix has raised features. The first portion of the chamber part is cleaned. Wear on the raised features is evaluated. The part is discarded in response to the wear on the raised feature.

Abstract: Certain embodiments provide a method and non-transitory computer readable medium comprising instructions that, when executed by a processor of a processing system, cause the processing system to perform a method for improving operation of a semiconductor processing system. The method of part life estimation generally includes obtaining a chamber part having a first surface portion and second surface portion. A data matrix in the first portion of the chamber part is read. The data matrix has raised features. The first portion of the chamber part is cleaned. Wear on the raised features is evaluated. The part is discarded in response to the wear on the raised feature.

Abstract: The present disclosure relates to systems and methods for semiconductor tool part tracking and kit verification. Data relating to part identification and performance are encoded to a unique code that is encoded into machine-readable form, such as a data matrix. A multi-dimensional array (MDA) of the data matrices of a group of parts is a ‘golden MDA’. When assembled into a kit, the parts are scanned and compared to the golden MDA. If there's a match, a kit unique code is used to generate a kit data matrix. The part data matrix codes are provided to a database to determine if a part combination will cause a coupling effect, based on part usage history.

Abstract: The present disclosure is directed to a system and method to identify and track parts of a semiconductor processing chamber, as well as the status of the parts, and store status information in a centralized location as status changes over time.

Abstract: A semiconductor manufacturing system includes an operating terminal, a first controller, and a plurality of second controllers. The operating terminal controls a main controller. Each of the plurality of second controllers is electrically connected to the first controller. In an initial or default state, the operating terminal controls the first controller as a main controller, and when the first controller fails, the operating terminal controls one of the plurality of the second controllers as a main controller, the others of the plurality of second controllers being controlled by the main controller.

Abstract: A front opening unified pod (FOUP) loading and air filling system comprises a FOUP loading device and an air filling device. The FOUP loading device is configured to load and unload a FOUP, and comprises a substrate and a controller. The substrate comprises a frame, a bearing platform installed on the frame, and a cavity under the bearing platform. The bearing platform is configured to support the FOUP. The controller and the air filling device are accommodated in the cavity. The air filling device is connected to the FOUP.

Abstract: A wafer supporting system includes a supporting pedestal. The supporting pedestal includes a main supporting body and a hollow frame surrounding the supporting pedestal. The main supporting body includes a top surface and a bottom surface opposite to the top surface, the top surface defined a plurality of vent grooves and a plurality of holding grooves. The main supporting body includes a plurality of holding channels extending through from the bottom surface to the holding grooves and a plurality of first through holes pass through from the top surface to the bottom surface, each holding groove is surrounded by a plurality of first through holes; an inner side surface of the hollow frame and a side wall of the supporting pedestal form a gap, and a plurality of exhaust cylinders are arranged in the annular gap and each exhaust cylinder is communicated with each vent groove.

Abstract: A reflective exposure apparatus includes a platform, an illuminating system, a photomask, a chip, and a reflecting convex mirror. The photomask is formed on the platform and faces the illuminating system. The chip is formed on the platform. The illuminating system and the reflecting curved mirror are formed on opposite sides of the platform. The platform can be moved relative to the illuminating system and the reflecting curved mirror.

Abstract: An air purifying device for an FOUP includes an air supply assembly. The air supply assembly includes an air supply tube and an airtight connecting unit connecting the tube to the FOUP in an airtight manner. The air tight connecting unit includes an elastic absorbing portion, a nozzle, and a driver. An initial position of the elastic absorbing portion is lower than a supporting surface of a load port before the FOUP is placed on the supporting surface. One end of the nozzle is fixedly inserted to the elastic absorbing portion, and another end of the nozzle is movably inserted to the air supply tube. The driver can drive the nozzle and the elastic absorbing portion to move upward to press against the FOUP when the FOUP is placed on the supporting surface, causing the elastic absorbing portion to be vertically deformed to maintain an airtight connection.

Abstract: An air purifying device for a front opening unified pod (FOUP) carrying silicon wafers includes an air supply assembly and an air discharging assembly. The air supply assembly can be triggered by a signal to supply purified air to the FOUP. The air discharging assembly discharges air from the FOUP when the air supply assembly begins to supply the FOUP with purified air and detects a humidity and a temperature of the discharged air. The detected humidity and the detected temperature correspond to a relative humidity of the discharged air. When the relative humidity is equal to a preset relative humidity, the air supply assembly is stopped and the air discharging assembly is stopped.

Abstract: A shunting device used to transport workpieces comprises a plurality of rotating shafts parallel to one another and arranged in arrays, a plurality of first omnidirectional wheels, and a plurality of second omnidirectional wheels. The first omnidirectional wheels and the second omnidirectional wheels are each wrapped around a corresponding one of the rotating shafts in a matrix. The first omnidirectional wheels and the second omnidirectional wheels are alternatively arranged along the corresponding one of the plurality of rotating shafts and a second direction perpendicular to the plurality of rotating shafts. A plurality of first driven rollers of the first omnidirectional wheels and a plurality of second driven rollers of the second omnidirectional wheels are mirror-symmetrical along at least one of a third direction parallel to the plurality of rotating shafts and the second direction.

Abstract: An energy-saving hydraulic system includes an exerting hydraulic device, a buffering receptacle arranged at one side of the exerting hydraulic device, an impetus hydraulic device connecting to the exerting hydraulic device, and a recovering hydraulic device. The exerting hydraulic device has a loading receptacle selectively disposed at a first high position and a first low position. The impetus hydraulic device has a transferring receptacle selectively disposed at a second high position, a recovering position, and a second low position. The second low position is lower than the buffering receptacle. The recovering hydraulic device connects the exerting hydraulic device and the impetus hydraulic device, and includes a sustaining portion. When the impetus hydraulic device is lowering to the second low position, it contacts the sustaining portion of the recovering hydraulic device to push working liquid to flow back the exerting hydraulic device from the recovering hydraulic device.

Abstract: A touch input device includes a touch pad and a switch. The touch pad has a floating side. The switch is positioned on the touch pad. The floating side is permitted to move down to enable the switch to generate input commands when a pressure is exerted on the floating side.

Abstract: A touch input device includes a touch pad and a switch. The touch pad has a floating side. The switch is positioned on the touch pad. The floating side is permitted to move down to enable the switch to generate input commands when a pressure is exerted on the floating side.

Abstract: A charge pump includes a level shifter and a charge exchange control switching circuit. The level shifter can enhance the levels of a first and second clock signals, and output a first and a second control signal corresponding to the enhanced signals. Based on the first and second control signals, the charge exchange control switching circuit amplifies an input voltage and generates a corresponding amplified output voltage.

Abstract: A landform monitoring system includes a pressure sensing device mounted on a mounting frame, and including a housing unit configured with an accommodating space and having first and second openings in fluid communication with the accommodating space. A pressure sensor is attached to the housing unit, and seals the first opening. A flexible sheet is attached to the housing unit and seals the second opening. A fluid medium is filled fully in the accommodating space. When the sheet deforms as a result of an external pressure acting thereon, a pressure corresponding to the deformation of the sheet is transmitted to the pressure sensor via the fluid medium such that the pressure sensor generates a pressure sensing signal corresponding to the external pressure.