Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.

Abstract: A blood pressure device includes a first blood pressure measuring device, a second blood pressure measuring device, and a controller. The first blood pressure measuring device is to be worn on a first position of a wrist so as to obtain a first blood pressure information of the first position. The second blood pressure measuring device is to be worn on a second position of the wrist so as to obtain a second blood pressure information of the second position. The controller is electrically coupled to the first blood pressure measuring device and the second blood pressure measuring device so as to adjust tightness between the expanders and the user's skin, respectively. The controller receives, processes, and calculates a pulse transit time between the first blood pressure information and the second blood pressure information, and the controller obtains at least one blood pressure value based on the pulse transit time.

Abstract: Electrostatic discharge (ESD) structures are provided. An ESD structure includes a semiconductor substrate, a first epitaxy region with a first type of conductivity over the semiconductor substrate, a second epitaxy region with a second type of conductivity over the semiconductor substrate, and a plurality of semiconductor layers. The semiconductor layers are stacked over the semiconductor substrate and between the first and second epitaxy regions. A first conductive feature is formed over the first epitaxy region and outside an oxide diffusion region. A second conductive feature is formed over the second epitaxy region and outside the oxide diffusion region. A third conductive feature is formed over the first epitaxy region and within the oxide diffusion region. A fourth conductive feature is formed over the second epitaxy region and within the oxide diffusion region. The oxide diffusion region is disposed between the first and second conductive features.

Abstract: A universal series bus (USB) connector including a base, a first terminal set, and a second terminal set and a method of manufacturing the universal series bus connector are provided. The first terminal set includes a pair of first differential signal terminals and a pair of second differential signal terminals, and terminals of the pair of first differential signal terminals are adjacent to each other and terminals of the pair of second differential signal terminals are adjacent to each other. Two of terminals of the second terminal set are located at two opposite sides of the pair of first differential signal terminals, and another two of the terminals of the second terminal set are located at two opposite sides of the pair of second differential signal terminals.

Abstract: A circuit board assembly including a circuit board and a connector is provided. The circuit board has a plate body, at least one electrical connecting hole, and at least one pad, wherein the pad and the electrical connecting hole are disposed on the plate body, the electrical connecting hole is located in a range of the pad, and the electrical connecting hole penetrates through the pad. The connector has at least one pin, wherein the connector is assembled to the circuit board, the pin is soldered onto the pad, and the pin covers the electrical connecting hole located in the range of the pad. A storage device is also disclosed.

Abstract: A circuit board assembly including a circuit board and a connector is provided. The circuit board has a plate body, at least one electrical connecting hole, and at least one pad, wherein the pad and the electrical connecting hole are disposed on the plate body, the electrical connecting hole is located in a range of the pad, and the electrical connecting hole penetrates through the pad. The connector has at least one pin, wherein the connector is assembled to the circuit board, the pin is soldered onto the pad, and the pin covers the electrical connecting hole located in the range of the pad. A storage device is also disclosed.

Abstract: A universal series bus (USB) connector including a base, a first terminal set, and a second terminal set and a method of manufacturing the universal series bus connector are provided. The first terminal set includes a pair of first differential signal terminals and a pair of second differential signal terminals, and terminals of the pair of first differential signal terminals are adjacent to each other and terminals of the pair of second differential signal terminals are adjacent to each other. Two of terminals of the second terminal set are located at two opposite sides of the pair of first differential signal terminals, and another two of the terminals of the second terminal set are located at two opposite sides of the pair of second differential signal terminals.

Abstract: A universal series bus (USB) connector including a base, a first terminal set, and a second terminal set and a method of manufacturing the universal series bus connector are provided. The first terminal set includes a pair of first differential signal terminals and a pair of second differential signal terminals, and terminals of the pair of first differential signal terminals are adjacent to each other and terminals of the pair of second differential signal terminals are adjacent to each other. Two of terminals of the second terminal set are located at two opposite sides of the pair of first differential signal terminals, and another two of the terminals of the second terminal set are located at two opposite sides of the pair of second differential signal terminals.

Abstract: A system in package (SIP) structure, an electroplating module thereof and a memory storage device are provided. The SIP structure includes a first layout layer, a second layout layer and a rewritable non-volatile memory module. The first layout layer includes a first pad and a wire. The first pad is close to a first side of the first layout layer, and the first pad is configured to couple to a ground voltage. One terminal of the wire is coupled to the first pad, and another terminal of the wire is coupled to an opening of the SIP structure, wherein the opening is located at a second side of the first layout layer opposite to the first side, and the opening is configured to couple to an external voltage.

Abstract: A system in package (SIP) structure, an electroplating module thereof and a memory storage device are provided. The SIP structure includes a first layout layer, a second layout layer and a rewritable non-volatile memory module. The first layout layer includes a first pad and a wire. The first pad is close to a first side of the first layout layer, and the first pad is configured to couple to a ground voltage. One terminal of the wire is coupled to the first pad, and another terminal of the wire is coupled to an opening of the SIP structure, wherein the opening is located at a second side of the first layout layer opposite to the first side, and the opening is configured to couple to an external voltage.

Abstract: A universal series bus (USB) connector including a base, a first terminal set, and a second terminal set and a method of manufacturing the universal series bus connector are provided. The first terminal set includes a pair of first differential signal terminals and a pair of second differential signal terminals, and terminals of the pair of first differential signal terminals are adjacent to each other and terminals of the pair of second differential signal terminals are adjacent to each other. Two of terminals of the second terminal set are located at two opposite sides of the pair of first differential signal terminals, and another two of the terminals of the second terminal set are located at two opposite sides of the pair of second differential signal terminals.

Abstract: A universal series bus (USB) connector including a base, a first terminal set, and a second terminal set and a method of manufacturing the universal series bus connector are provided. The first terminal set includes a pair of first differential signal terminals and a pair of second differential signal terminals, and terminals of the pair of first differential signal terminals are adjacent to each other and terminals of the pair of second differential signal terminals are adjacent to each other. Two of terminals of the second terminal set are located at two opposite sides of the pair of first differential signal terminals, and another two of the terminals of the second terminal set are located at two opposite sides of the pair of second differential signal terminals.

Abstract: A pad structure for disposing an electronic component on a printed circuit board is provided. The pad structure includes a first pad and a plurality of second pads. The first pad is configured to couple to a terminal of the electronic component. Each of the second pads is configured to couple to another terminal of the electronic component. The first pad and the second pads are electrically independent to each other, and the second pads are electrically independent to each other. Besides, a printed circuit board and a memory storage device using the pad structure are also provided.

Abstract: A universal series bus (USB) connector including a base, a first terminal set, and a second terminal set and a method of manufacturing the universal series bus connector are provided. The first terminal set includes a pair of first differential signal terminals and a pair of second differential signal terminals, and terminals of the pair of first differential signal terminals are adjacent to each other and terminals of the pair of second differential signal terminals are adjacent to each other. Two of terminals of the second terminal set are located at two opposite sides of the pair of first differential signal terminals, and another two of the terminals of the second terminal set are located at two opposite sides of the pair of second differential signal terminals.

Abstract: A storage apparatus including a circuit board, a control circuit element, a terminal module and a storage circuit element is provided. The circuit board includes a first surface, a second surface, a connect part, openings, metal contacts and metal units. The openings pass through the circuit board from the first surface to the second surface and the metal contacts are exposed on the first surface. The terminal module is disposed on the first surface and has elastic terminals and each of the elastic terminals has a first contact part and a second contact part. The first contact parts respectively contact with the metal contacts and the second contact parts respectively pass through the openings to protrude from the second surface. The metal units are disposed on the second surface and located between the openings and the connect part. Accordingly, the volume of the storage apparatus can be reduced.

Abstract: A storage apparatus including a circuit board, a control circuit element, a terminal module and a storage circuit element is provided. The circuit board includes a first surface, a second surface, a connect part, openings, metal contacts and metal units. The openings pass through the circuit board from the first surface to the second surface and the metal contacts are exposed on the first surface. The terminal module is disposed on the first surface and has elastic terminals and each of the elastic terminals has a first contact part and a second contact part. The first contact parts respectively contact with the metal contacts and the second contact parts respectively pass through the openings to protrude from the second surface. The metal units are disposed on the second surface and located between the openings and the connect part. Accordingly, the volume of the storage apparatus can be reduced.

Abstract: A storage apparatus including a circuit board, a control circuit element, a terminal module and a storage circuit element is provided. The circuit board includes a first surface, a second surface, a connect part, openings, metal contacts and metal units. The openings pass through the circuit board from the first surface to the second surface and the metal contacts are exposed on the first surface. The terminal module is disposed on the first surface and has elastic terminals and each of the elastic terminals has a first contact part and a second contact part. The first contact parts respectively contact with the metal contacts and the second contact parts respectively pass through the openings to protrude from the second surface. The metal units are disposed on the second surface and located between the openings and the connect part. Accordingly, the volume of the storage apparatus can be reduced.

Abstract: A seawater desalination device includes a seawater reservoir having a bottom wall and adapted for holding seawater, an evaporator adapted for evaporating the seawater held in the seawater reservoir into water vapor, osmosis membrane modules installed in the seawater reservoir and spaced above the bottom wall of the seawater reservoir, each osmosis membrane having membranes for the passing of the water vapor evaporated by the evaporator and a water vapor accumulation chamber surrounded by the membranes and a suction pipe connected to the water vapor accumulation chamber, and a pump unit having a pipe connected to the suction pipe of each osmosis membrane module and adapted for drawing water vapor out of the water vapor accumulation chamber of each osmosis membrane module.