Patents by Inventor Chun-Feng Nien

Chun-Feng Nien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of reducing micro-scratches during tungsten CMP
    Patent number: 6548409
    Abstract: A method of reducing micro-scratches during tungsten CMP. Tungsten CMP with a standard tungsten slurry is first provided on the exposed surfaces of a tungsten plug and a IMD layer on a semiconductor substrate. The tungsten CMP with an oxide slurry is then provided on the polished surfaces of the tungsten plugs and the IMD layer.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: April 15, 2003
    Assignee: Silicon Integrated Systems Corp.
    Inventors: Shyh-Dar Lee, Chun-Feng Nien