Abstract: A packaged semiconductor device is provided, which includes a substrate comprising a contact pad; a passivation layer disposed on the substrate, where the passivation layer covers part of the contact pad; an under bump metallization (UBM) layer disposed on the substrate, where the UBM layer is coupled to the contact pad; a conductive bump disposed on the UBM layer, where the conductive bump comprises a column connecting the UBM layer and a cap disposed on top of the column; and a solder ball encapsulating the conductive bump. The cap includes a bottom area larger than a cross-sectional area of the column, and a bottom of the cap is distant from an upper surface of the passivation layer by a space.

Abstract: A hair clip includes an arcuate main body having a recess defined in a side thereof and an arcuate decorative piece securely mounted in the recess. A bottom wall which defines the recess includes two slots defined in each of two ends thereof. The decorative piece has two hooks respectively formed on two ends of a first side thereof and a pattern formed on a second side thereof. The hooks extend through the associated slots and respectively, securely engage with two ends of the bottom wall defining the recess.