Abstract: A burn-in socket for testing an integral circuit package includes a base defining a cavity, an adapter received in the cavity of the base, an alignment plate secured to the adapter, and a cover movable mounted to the base. The alignment plate is detachable assembled to the adapter so as to the burn-in socket can apply to different IC package when the alignment plate is replaced with another.

Abstract: A multi-channel display driver circuit incorporating modified D/A converters has a plurality of digital comparators connected to a number generator. Each digital comparator has an output, a digital data input and a reference input. The reference inputs of all digital comparators are connected to the number generator and the outputs are respectively connected to corresponding data channels of a display. By the proposed technique, each digital comparator obtains a unique non-sequence reference signal, and then compares it with the input digital data signal. Since the non-sequential signals are input to the reference input of the digital comparator, the overshoot distortion, the harmonic distortion and the electromagnetic interference problems are prevented. Therefore, the precise imaging can be obtained with this signal modulation technique in small circuit size.

Abstract: A burn-in socket for electrical connecting with package having solder balls, includes a base and a number of contacts received in the base. Each contact has a spring section movable in the base, a contact section extending upwardly from the spring section and a retention section extending downwardly from the spring section. The contact section includes three tips at a top end thereof for contacting with the solder balls of the package thereby supporting the solder balls.

Abstract: An electrical connector includes a frame (2) is a substantially rectangular configuration and including a front portion and rear portion (22), a cover (3) moveably disposed on the frame and including a supporting portion (31) with a plurality of holes (311) defined therein, a lever (4) having a shaft portion (42) disposed on the rear portion of the frame to drive the cover to move from a first position to a second position, a base (1) disposed within the frame and under the cover and an elastic mechanism received between the base and the cover. The cover further defines a groove (33) which is used for receiving the elastic mechanism when the cover is in the second position.

Abstract: A frame (1) for engaging with a connector (2) includes a first pair of opposite retaining walls (13), a second pair of opposite retaining walls (12) and an opening (11). The opening (11) is surrounded by the first and the second retaining walls. The frame is detachable from the connector and at least one pair of the first and second pairs (13, 12) of opposite retaining walls are fixed on the lateral sides of the electrical connector. Wherein at least one retaining wall which is fixed to the electrical connector, defines a cutout (120, 130), and the cutout (120, 130) is disposed on middle portion of the retaining wall and communicates with the opening (11).

Abstract: An electrical contact (1) includes an upper extending portion (11), a lower extending portion (12) and a bridge portion (13). The upper extending portion includes a first contact portion (111), a C-shaped connecting portion (1121) connecting with the first contact portion and a tail portion (1122) extending downwardly from a free end of the C-shaped connecting portion. The lower extending portion includes a second contact portion (121), a vertical portion (1222) and an inclined portion (1221) connecting with the second contact portion and the vertical portion. The bridge portion is integrally formed between the tail portion and the vertical portion. One of the upper extending portion and the lower extending portion rotates around the bridge portion.

Abstract: A burn-in socket for testing an integral circuit package includes a base defining a cavity, an adapter received in the cavity of the base, an alignment plate secured to the adapter, and a cover movable mounted to the base. The alignment plate is detachable assembled to the adapter so as to the burn-in socket can apply to different IC package when the alignment plate is replaced with another.

Abstract: A socket connector assembly for holding a semiconductor package comprises a socket connector and an actuator assembled to the socket connector. The actuator comprises a housing defining an opening on a bottom face thereof; a cam portion retained to the housing and being able to rotate; and a floating module. The floating module is movably mounted to the housing and defines a topmost position and a lowermost position relative to the housing. The floating moves between the topmost position and the lowermost position during a rotation of the cam portion. The floating module has an engaging portion to contact with the semiconductor package when the floating module is at the lowermost position.

Abstract: The present invention relates to a contact for electronic devices. The contact includes an upper contact, a lower contact, which includes a contact portion, a lower contact coupled to the upper contact, and a spring fitted over a predetermined area between the upper contact and lower contact. The lower contact includes a second supporting portion, two elastic parts extending from the second supporting portion and provided with opposite to each other. A channel is defined by the two elastic parts of the lower contact, and provides a space to allow movement of the contact portion of the upper contact therein, when the upper contact is coupled to the lower contact. When the upper contact is coupled to the lower contact, the contact portion of the upper contact is insert into the channel defined by the two elastic parts of the lower contact. Thereby, the contact portion is in close contact with the retaining portion, and so an efficient and a short transmitted between two contacts is established.

Abstract: A contact device (5) for interconnecting two electronic devices comprises: an upper contact pin (51) having a contacting portion (511) extending upward for connecting one electronic device, and a mating portion (513) of a substantial plate-type structure extending downward and defining a planar mating surface (5132); an lower contact pin (52) having a contacting portion (521) extending downward for connecting the other electronic device, and a mating portion (523) of a substantial plate-type structure extending upward and defining a planar mating surface (5232); a coil spring (53) fitted between the upper contact pin and lower contact pin. The mating portions (513, 523) of the upper and the lower contact pins are substantial coplanar with each other, and the mating surfaces (5132, 5232) of the upper and the lower contact pins contact with each other.

Abstract: An IC socket includes a socket body with a plurality of contacts disposed therein, a lid pivotably coupled to the socket body, a pushing member connected to the lid, and a heat sink fixed to said pushing member and being movable in a height direction relative to the lid. Because of being fixed to the pushing member, the heat sink can move with the pushing member and keep pressing on an IC chip in the case, for example, the changing of the thickness or position of the IC chip.

Abstract: An electrical connector includes a frame (2) is a substantially rectangular configuration and including a front portion and rear portion (22), a cover (3) moveably disposed on the frame and including a supporting portion (31) with a plurality of holes (311) defined therein, a lever (4) having a shaft portion (42) disposed on the rear portion of the frame to drive the cover to move from a first position to a second position, a base (1) disposed within the frame and under the cover and an elastic mechanism received between the base and the cover. The cover further defines a groove (33) which is used for receiving the elastic mechanism when the cover is in the second position.

Abstract: An electrical connector includes a frame (2) defining a substantially rectangular configuration and header and rear portions (22), a cover (3) moveably disposed on the frame and including a supporting surface (31) with a plurality of holes (311) defined therein, a lever (4) having a cam portion (42) disposed on the rear portion of the frame to drive the cover to move from a first position to a second position, a base (1) disposed within the frame and under the cover and an engaging member (6) retained in one side of the frame. The engaging member defines an engaging portion (63) at one end thereof which can engage with the lever when the lever arrives at a vertical position relative to the base.

Abstract: A contact includes a first contact pin, a second contact pin and a spring. The first contact pin comprises a wide portion for contacting and a narrow portion. The second contact pin comprises a holding portion and a guiding portion extending upwards from the holding portion. The guiding portion has a receiving space and a pair of channels, the narrow portion is received in the receiving space and has thereof a pair of projecting portions sliding in the channels. The spring is moveably seated on the holding portion and limited under the wide portion to allow the first contact pin to shift upwards and downwards therein.

Abstract: A socket connector assembly for holding a semiconductor package comprises a socket connector and an actuator assembled to the socket connector. The actuator comprises a housing defining an opening on a bottom face thereof; a cam portion retained to the housing and being able to rotate; and a floating module. The floating module is movably mounted to the housing and defines a topmost position and a lowermost position relative to the housing. The floating moves between the topmost position and the lowermost position during a rotation of the cam portion. The floating module has an engaging portion to contact with the semiconductor package when the floating module is at the lowermost position.

Abstract: A contact includes a first contact pin, a second contact pin and a spring. The first contact pin comprises a wide portion for contacting and a narrow portion. The second contact pin comprises a holding portion and a guiding portion extending upwards from the holding portion. The guiding portion has a receiving space and a pair of channels, the narrow portion is received in the receiving space and has thereof a pair of projecting portions sliding in the channels. The spring is moveably seated on the holding portion and limited under the wide portion to allow the first contact pin to shift upwards and downwards therein.

Abstract: A multi-channel display driver circuit incorporating modified D/A converters has a plurality of digital comparators connected to a number generator. Each digital comparator has an output, a digital data input and a reference input. The reference inputs of all digital comparators are connected to the number generator and the outputs are respectively connected to corresponding data channels of a display. By the proposed technique, each digital comparator obtains a unique non-sequence reference signal, and then compares it with the input digital data signal. Since the non-sequential signals are input to the reference input of the digital comparator, the overshoot distortion, the harmonic distortion and the electromagnetic interference problems are prevented. Therefore, the precise imaging can be obtained with this signal modulation technique in small circuit size.

Abstract: An electrical connector comprising: an insulative housing defining a top surface with a plurality contact terminals planted within the housing; a frame having an rectangle framework securely attaching to the housing defining sidewalls jointly formed a room for receiving an IC package therein, engaging hollows are defined at an pair of opposite corner of the framework and a chamber at a corner of the framework; a compliant biasing device positioned in the said chamber of the corner of framework for positioning the IC package; a thermal control element having alignment pins related to the engaging hollows, said thermal control element pushing the compliant biasing device sliding in the chamber so the compliant biasing device attaching on the IC package to ensure proper and reliable electrical interconnection.

Abstract: The present invention provides a delay apparatus for delaying an input signal by a predetermined delay amount, including: a plurality of delay units for respectively delaying the input signal by the predetermined delay amount, each delay unit having a plurality of delay cells for respectively delaying the input signal by a certain delay period; and a sub decoding unit for generating a plurality of sub control signals to each of the delay units according to a first control signal and a selecting signal, wherein only delay cell of all the delay units is outputted at a time according to the sub controls signals.

Abstract: An IC socket (2) includes a base (21), a cover (22) engaged upon the base and moveable along a front-to-back direction relative to the base, and a lever (23) for driving the cover to slide on the base. The lever includes a lateral rod (232) and a longitudinal rod (231) connected to the lateral rod, with the lateral rod defining an engagement section (233) adapted to engage the cover for urging the cover to move. The engagement section has a body of flexible material (234) thereon for preventing abrasion of a part of the cover associated with the engagement section and for eliminating damage caused by engagement abrasion.