Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; and an external electrode including a connection portion disposed on the third or fourth surface and a band portion extending from the connection portion to portions of the first and second surfaces, wherein the external electrode includes a sputtered layer disposed in the connection portion and contacting the first or second internal electrode and including Cu, an oxide layer disposed on the sputtered layer and including a Cu oxide, and a conductive polymer layer disposed in the band portion and including a polymer material.

Abstract: A multilayer electronic component may have moisture resistance reliability by disposing a sealing portion between a plating portion and a body and controlling a component or shape of the sealing portion.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; and external electrodes disposed on the body, wherein the external electrodes include a lower electrode layer including copper (Cu) and glass, an intermediate electrode layer including copper (Cu) and disposed on the lower electrode layer, and an upper electrode layer including silver (Ag) and glass and disposed on the intermediate electrode layer, and an area fraction occupied by a pore in the intermediate electrode layer is smaller than an area fraction occupied by a pore in the lower electrode layer.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer, an external electrode disposed on the body and connected to the internal electrode, and a region containing Ni, Al and Cu. The internal electrode includes Ni, and the external electrode contains Al and Cu.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed in a first direction, and including first and second surfaces opposing each other in the first direction, the third and fourth surfaces connected to the first and second surfaces and connected to each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; an insulating layer disposed on the first, second, fifth and sixth surfaces and including at least one of Al2O3 and BN; an external electrode disposed on the body, wherein each of the first and second surfaces is concave into the body.

Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.

Abstract: A dielectric composition and a multilayer capacitor including the same are provided. The dielectric composition includes a BaTiO3-base main component, a first subcomponent including an Nb component and a Gd component, a second subcomponent including an Mg component, and a third subcomponent including a Ba component and a Ca component. The first subcomponent is included in an amount of 4 moles or less per 100 moles of the main component. In the first subcomponent, a molar content of Nb and a molar content of Gd satisfy 0.33?Nb/Gd, and in the third subcomponent, a molar content of Ba and a molar content of Ca satisfy 0.2?Ca/(Ba+Ca).

Abstract: A multilayer electronic component includes: a body including dielectric layers; side margin portions disposed on side surfaces of the body, respectively; and external electrodes disposed on end surfaces of the body, respectively. The body includes a capacitance forming portion including internal electrodes disposed alternately with the dielectric layers and cover portions disposed on upper and lower surfaces of the capacitance forming portion, respectively. Ga2/Ga1 is 0.8 or more and less than 1.0 and Ga2/Gc1 is 0.8 or more and less than 1.0. a1 is a central portion of the capacitance forming portion, a2 is a boundary portion between the capacitance forming portion and the cover portion in the capacitance forming portion, and c1 is a boundary portion between the capacitance forming portion and the cover portion in the cover portion. Ga1, Ga2, and Gc1 are average sizes of dielectric grains at a1, a2, and c1, respectively.

Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.

Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are provided and a plurality of internal electrodes are stacked with the dielectric layer interposed therebetween and external electrodes disposed outside the body and connected to the plurality of internal electrodes. The body includes a high resistance portion disposed in at least one region between the dielectric layer and the internal electrode and inside the dielectric layer and having electric resistance higher than electric resistance of the internal electrode, and the high resistance portion and the plurality of internal electrodes include the same metal component and the same metal oxide component.

Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including an active portion having dielectric layers and first and second internal electrodes and first and second cover portions disposed on opposite surfaces of the active portion in a stacking direction, respectively; wherein when a region of the cover portion in contact with the first or second internal electrode is an inner region of the cover portion and a region of the active portion in contact with the inner region of the cover portion is an outer region of the active portion, 1.00<XA/XB?1.04 in which XA/XB is a ratio of a molar ratio (XA) of barium (Ba) to titanium (Ti) in the inner region of the cover portion to a molar ratio (XB) of barium (Ba) to titanium (Ti) in the outer region of the active portion.

Abstract: A dielectric material includes a main component represented by (Ba1-xCax)(Ti1-y(Zr, Sn, Hf)y)O3 (0?x?1 and 0?y?0.5); a first subcomponent including at least one of elements among Y, Dy, Ho, Er, Gd, Ce, Nd, Nb, Sm, Tb, Eu, Tm, La, Lu, and Yb; a second subcomponent including Si and/or Al; and a third subcomponent including Ba and/or Ca.

Abstract: A dielectric composition and a multilayer capacitor including the same are provided. The dielectric composition includes a BaTiO3-base main component, a first subcomponent including an Nb component and a Gd component, a second subcomponent including an Mg component, and a third subcomponent including a Ba component and a Ca component. The first subcomponent is included in an amount of 4 moles or less per 100 moles of the main component. In the first subcomponent, a molar content of Nb and a molar content of Gd satisfy 0.33?Nb/Gd, and in the third subcomponent, a molar content of Ba and a molar content of Ca satisfy 0.2?Ca/(Ba+Ca).

Abstract: A multilayer electronic component includes: a body including dielectric layers; side margin portions disposed on side surfaces of the body, respectively; and external electrodes disposed on end surfaces of the body, respectively. The body includes a capacitance forming portion including internal electrodes disposed alternately with the dielectric layers and cover portions disposed on upper and lower surfaces of the capacitance forming portion, respectively. Ga2/Ga1 is 0.8 or more and less than 1.0 and Ga2/Gc1 is 0.8 or more and less than 1.0. a1 is a central portion of the capacitance forming portion, a2 is a boundary portion between the capacitance forming portion and the cover portion in the capacitance forming portion, and c1 is a boundary portion between the capacitance forming portion and the cover portion in the cover portion. Ga1, Ga2, and Gc1 are average sizes of dielectric grains at a1, a2, and c1, respectively.

Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are provided and a plurality of internal electrodes are stacked with the dielectric layer interposed therebetween and external electrodes disposed outside the body and connected to the plurality of internal electrodes. The body includes a high resistance portion disposed in at least one region between the dielectric layer and the internal electrode and inside the dielectric layer and having electric resistance higher than electric resistance of the internal electrode, and the high resistance portion and the plurality of internal electrodes include the same metal component and the same metal oxide component.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including an active portion having dielectric layers and first and second internal electrodes and first and second cover portions disposed on opposite surfaces of the active portion in a stacking direction, respectively; wherein when a region of the cover portion in contact with the first or second internal electrode is an inner region of the cover portion and a region of the active portion in contact with the inner region of the cover portion is an outer region of the active portion, 1.00<XA/XB<1.04 in which XA/XB is a ratio of a molar ratio (XA) of barium (Ba) to titanium (Ti) in the inner region of the cover portion to a molar ratio (XB) of barium (Ba) to titanium (Ti) in the outer region of the active portion.

Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.

Abstract: A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately disposed. Ceramic-metal compound layers are disposed on interfaces between the internal electrodes and the dielectric layers. Additionally, in some examples, spaces between adjacent internal electrodes are fully occupied by the dielectric layers and the dielectric layers contain a ceramic-metal compound containing metal particle. The ceramic-metal compound layer may have an embossing type configuration or a dendrite type configuration.

Abstract: A multilayer ceramic electronic component may include a ceramic body including an active part in which dielectric layers and internal electrodes are alternately disposed, an upper cover part disposed on the active part, and a lower cover part disposed below the active part, a buffer layer disposed in at least one of the upper and lower cover parts, and external electrodes disposed on end surfaces of the ceramic body. The buffer layer may contain a conductive metal in a content of 1 to 40 vol %.