Patents by Inventor Chun H. Fan

Chun H. Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing enhanced thermal dissipation integrated circuit package
    Publication number: 20040046241
    Abstract: The present invention relates to an integrated circuit packages having a thermally conductive element thermally coupled to a heat sink and semiconductor die, and a method of manufacturing said integrated circuit package.
    Type: Application
    Filed: August 11, 2003
    Publication date: March 11, 2004
    Inventors: Edward G. Combs, Neil Robert McLellan, Chun H. Fan