Abstract: The present invention is related to a novel positive electrode active material for lithium-ion battery. The positive electrode active material is expressed by the following formula: Li1.2NixMn0.8-x-yZnyO2, wherein x and y satisfy 0<x?0.8 and 0<y?0.1. In addition, the present invention provides a method of manufacturing the positive electrode active material. The present invention further provides a lithium-ion battery which uses said positive electrode active material.

Abstract: A method for forming a semiconductor structure is provided. The method for forming the semiconductor structure includes forming a fin structure over a substrate in a first direction, forming a first gate stack, a second gate stack and a third gate stack across the fin structure, removing the first gate stack to form a trench, depositing a cutting structure in the trench, and forming a first contact plug between the cutting structure and the second gate stack and a second contact plug between the second gate stack and the third gate stack. The fin structure is cut into two segments by the trench. A first dimension of the first contact plug in the first direction is greater than a second dimension of the second contact plug in the first direction.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A display driving circuit includes a power detector, a plurality of control units and a plurality of buffer amplifiers. The power detector outputs a control signal according to a voltage level of a supply voltage. Each control unit determines the control unit to output either auxiliary display data or original display data according to the control signal. The plurality of buffer amplifiers buffer and transfer the auxiliary display data or original display data outputted from the plurality of control units to a plurality of data lines.

Abstract: A display module is provided. The display module comprises a display panel, a printed circuit board, and a flexible packaging unit. The display panel has a plurality of first signal pads and at least one first dummy pad. The printed circuit board has a plurality of second signal pads and at least one second dummy pad. In addition, the flexible packaging unit comprises a flexible carrier and a chip, wherein the flexible carrier has a plurality of signal lines and at least one electrostatic discharge protective line. The electrostatic discharge protective line is connected between the first dummy pad and the second dummy pad. Furthermore, the electrostatic discharge protective line has an electricity conducting pad, which is exposed on the surface of the flexible carrier. The chip is disposed on the flexible carrier and connected to the display panel and the printed circuit board through the signal lines.

Abstract: A display module is provided. The display module comprises a display panel, a printed circuit board, and a flexible packaging unit. The display panel has a plurality of first signal pads and at least one first dummy pad. The printed circuit board has a plurality of second signal pads and at least one second dummy pad. In addition, the flexible packaging unit comprises a flexible carrier and a chip, wherein the flexible carrier has a plurality of signal lines and at least one electrostatic discharge protective line. The electrostatic discharge protective line is connected between the first dummy pad and the second dummy pad. Furthermore, the electrostatic discharge protective line has an electricity conducting pad, which is exposed on the surface of the flexible carrier. The chip is disposed on the flexible carrier and connected to the display panel and the printed circuit board through the signal lines.