Patents by Inventor Chun-Hao Hung

Chun-Hao Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11963368
    Abstract: A memory includes: a dielectric fin formed over a substrate; and a pair of memory cells disposed along respective sidewalls of the dielectric fin, each of the pair of memory cells comprising: a first conductor layer; a selector layer; a resistive material layer; and a second conductor layer, wherein the first conductor layer, selector layer, resistive material layer, and second conductor layer each includes upper and lower boundaries, and at least one of the upper and lower boundaries is tilted away from one of the sidewalls of the dielectric fin by an angle.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Chieh Mo, Shih-Chi Kuo, Tsai-Hao Hung
  • Patent number: 11923396
    Abstract: An integrated circuit includes a photodetector. The photodetector includes one or more dielectric structures positioned in a trench in a semiconductor substrate. The photodetector includes a photosensitive material positioned in the trench and covering the one or more dielectric structures. A dielectric layer covers the photosensitive material. The photosensitive material has an index of refraction that is greater than the indices of refraction of the dielectric structures and the dielectric layer.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Wei Hsu, Tsai-Hao Hung, Chung-Yu Lin, Ying-Hsun Chen
  • Publication number: 20220143102
    Abstract: The invention found that first, the feasibility of transfer of tumor resistance and other healthy longevity characters through transplantation of bone marrow mononuclear cells (BMMNC) or hematopoietic stem cells (HSC)/hematopoietic stem and progenitor cells (HSPC) consisting of genetically engineered EKLF gene encoding the hematopoietic transcription factor EKLF. Secondly, the present invention demonstrates expression of EKLF in the long-term hematopoietic stem cells (LT-HSC), and thus EKLF as a target of regulation of hematopoiesis.
    Type: Application
    Filed: January 28, 2022
    Publication date: May 12, 2022
    Inventors: Che-Kun James SHEN, Yu-Chiau SHYU, Chun-Hao HUNG
  • Patent number: 11266697
    Abstract: The invention found that first, the feasibility of transfer of tumor resistance and other healthy longevity characters through transplantation of bone marrow mononuclear cells (BMMNC) or hematopoietic stem cells (HSC)/hematopoietic stem and progenitor cells (HSPC) consisting of genetically engineered EKLF gene encoding the hematopoietic transcription factor EKLF. Secondly, the present invention demonstrates expression of EKLF in the long-term hematopoietic stem cells (LT-HSC), and thus EKLF as a target of regulation of hematopoiesis.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: March 8, 2022
    Assignee: ACADEMIA SINICA
    Inventors: Che-Kun James Shen, Yu-Chiau Shyu, Chun-Hao Hung
  • Publication number: 20190282625
    Abstract: The invention found that first, the feasibility of transfer of tumor resistance and other healthy longevity characters through transplantation of bone marrow mononuclear cells (BMMNC) or hematopoietic stem cells (HSC)/hematopoietic stem and progenitor cells (HSPC) consisting of genetically engineered EKLF gene encoding the hematopoietic transcription factor EKLF. Secondly, the present invention demonstrates expression of EKLF in the long-term hematopoietic stem cells (LT-HSC), and thus EKLF as a target of regulation of hematopoiesis.
    Type: Application
    Filed: September 13, 2017
    Publication date: September 19, 2019
    Applicant: Academia Sinica
    Inventors: Che-Kun James SHEN, Yu-Chiau SHYU, Chun-Hao HUNG
  • Patent number: 8087940
    Abstract: A coaxial electric connector includes primarily a dielectric shell and a housing unit which is in an arc shape. The dielectric shell is formed by extrusion formation based on the housing unit and defines an annular space, with a predetermined wall being formed with two fixing sections to define the arc according to the housing unit. Besides, a bottom of the dielectric shell is a dielectric base and an interior of the dielectric shell contains additionally a conductor, a position of which is fixed by the dielectric base. A conductor pin on the conductor, whereas, is extended outward from the dielectric base. Through wrapping of the dielectric shell, the housing unit increases roundness of the entire housing and decreases scratching on a surface of metal part, which occurs when manufacturing the products, thereby improving a yield rate and a service life of the products.
    Type: Grant
    Filed: November 3, 2010
    Date of Patent: January 3, 2012
    Assignee: ABC Taiwan Electronics Corp.
    Inventors: Yeh-Shing Lee, Chun-Hao Hung
  • Publication number: 20110097612
    Abstract: A secondary battery end cap assembly is extruded integrally, is provided on a cap plate and corresponds to a first perforation and a second perforation of the cap plate. The first perforation corresponds to a gas seal part of the end cap assembly and a side of the gas seal part is extended with a safety valve corresponding to the second perforation to release gas pressure, preventing the battery from being overly recharged that an interior of the battery is too hot and pressure increases, allowing the battery to explode to cause danger. The safety valve is made by a non-metallic material. Hence, a secondary battery end cap assembly is extruded integrally to effectively reduce manufacturing time and improve production efficiency. Furthermore, as the safety valve is penetrated and embedded by extruding a non-metallic material, gas tightness is enhanced without being unriveted and welding problems.
    Type: Application
    Filed: October 28, 2009
    Publication date: April 28, 2011
    Inventors: Yeh-Shing LEE, Chun-Hao Hung, Jung-Chiang Tien