Abstract: A light source module includes a light guide plate, a first light source, multiple first optical microstructures, and multiple second optical microstructures. The first light source is disposed on a side of a first light incident surface of the light guide plate. The first and second optical microstructures are disposed on a bottom surface of the light guide plate, and respectively located in a first and a second zone. A first light receiving surface of each first optical microstructure facing the first light source has a first edge connecting the bottom surface, and a perpendicular bisector of the first edge passes through the first light source. The first zone does not overlap the second zone. A second light receiving surface of each second optical microstructure has a second edge connecting the bottom surface, and a perpendicular bisector of the second edge does not pass through the first light source.

Abstract: A device includes a plurality of photodiode regions within a semiconductor substrate, a plurality of transistors, a plurality of deep trench isolation (DTI) structures, and a plurality of isolation structures. The transistors are over a front-side surface of the semiconductor substrate. The DTI structures extend a first depth from a backside surface of the semiconductor substrate into the semiconductor substrate. The isolation structures extend a second depth from the backside surface of the semiconductor substrate into the semiconductor substrate. The second depth is less than the first depth. From a plan view, each of the plurality of isolation structures has a triangular profile at the backside surface of the semiconductor substrate.

Abstract: A method for performing data access management of a memory device in predetermined communications architecture to enhance sudden power off recovery (SPOR) of page-group-based redundant array of independent disks (RAID) protection with aid of suspendible serial number and associated apparatus are provided. The method may include: utilizing the memory controller to write preceding data and metadata thereof into at least one set of preceding pages in a first active block to make the metadata carry at least one preceding serial number; writing dummy data and other metadata into at least one set of dummy pages in the first active block to make the other metadata carry at least one suspended serial number which is equal to a last serial number among the at least one preceding serial number; and utilizing the memory controller to write subsequent data and metadata thereof to make it carry at least one subsequent serial number.

Abstract: A semiconductor device includes a first wafer and a second wafer. The semiconductor device includes a seal ring structure comprising a first metal structure in a body of the first wafer, a second metal structure in the body of the first wafer, a third metal structure in a body of the second wafer, and a metal bonding structure including a first set of metal elements coupling the first metal structure and the third metal structure through an interface between the first wafer and the second wafer, and a second set of metal elements coupling the second metal structure and the third metal structure through the interface between the first wafer and the second wafer.

Abstract: A semiconductor device according to the present disclosure includes a semiconductor layer, a plurality of metal isolation features disposed in the semiconductor layer, wherein certain of the metal isolation features extend through the substrate to provide for full isolation between adjacent photodetectors and certain of the metal isolation features extend partially through the semiconductor layer to provide partially isolation between adjacent photodetectors.

Abstract: A light source module includes a light source and a reflective element. The light source has a light emitting surface. The reflective element is disposed on a transmission path of an illumination light beam emitted from the light source. The illumination light beam reflected by the reflective element is irradiated on a target plane. The reflective element includes a first reflective surface and a second reflective surface. The first reflective surface is disposed towards the light emitting surface of the light source, and is a plane. The second reflective surface bendably extends from the first reflective surface.

Abstract: An optical biometer includes a light-source module, a light-splitting module, a reference-arm, a sensing-arm and a sensing module. The light-source module emits incident-light. The light-splitting module, disposed corresponding to light-source module, divides the incident-light into reference light and sensing light. The reference-arm, disposed corresponding to light-splitting module, generates a first reflected-light according to the reference light. The sensing-arm, disposed corresponding to the light-splitting module, emits the sensing light to the eye and receives a second reflected-light from the eye. The sensing module generates a sensing result according to the first reflected-light and second reflected-light. In a first mode, the sensing light is emitted to a first position of the eye. In a second mode, the sensing light is emitted to a second position of the eye.

Abstract: A method for performing mapping table management of a memory device in a predetermined communications architecture with aid of table analysis and associated apparatus are provided. The method may include: utilizing the memory controller to receive a first command from a host device through a transmission interface circuit of the memory controller; and in response to the first command, loading a local logical-to-physical (L2P) address mapping table from a non-volatile (NV) memory into a volatile memory within the memory controller to be a temporary L2P address mapping table, changing multiple L2P table entries in the temporary L2P address mapping table to be multiple updated L2P table entries in a group-by-group manner, rather than an entry-by-entry manner, and updating the local L2P address mapping table in the NV memory according to the multiple updated L2P table entries of the temporary L2P address mapping table.

Abstract: A method of making a semiconductor structure includes forming a pixel array region on a substrate. The method further includes forming a first seal ring region on the substrate, wherein the first seal ring region surrounds the pixel array region, and the first seal ring region includes a first seal ring. The method further includes forming a first isolation feature in the first seal ring region, wherein forming the first isolation feature includes filling a first opening with a dielectric material, wherein the first isolation feature is a continuous structure surrounding the pixel array region. The method further includes forming a second isolation feature between the first isolation feature and the pixel array region, wherein forming the second isolation feature includes filling a second opening with the dielectric material.

Abstract: An engineered textile includes a plurality of yarn strands with a subset extending in a substantially parallel and spaced arrangement and a bonding material extending across the plurality of yarn strands. The bonding material encapsulates a portion of each yarn strand to bond adjacent ones of the plurality of yarn strands together.

Abstract: A pixel sensor may include a layer stack to reduce and/or block the effects of plasma and etching on a photodiode and/or other lower-level layers. The layer stack may include a first oxide layer, a layer having a band gap that is approximately less than 8.8 electron-Volts (eV), and a second oxide layer. The layer stack may reduce and/or prevent the penetration and absorption of ultraviolet photons resulting from the plasma and etching processes, which may otherwise cause the formation of electron-hole pairs in the substrate in which the photodiode is included.

Abstract: A semiconductor image sensing structure includes a substrate having a first region and a second region, a metal grid in the first region, and a hybrid metal shield in the second region. The hybrid metal shield includes a first metallization layer, a second metallization layer disposed over the first metallization layer, a third metallization layer disposed over the second metallization layer, and a fourth metallization layer disposed over the third metallization layer. An included angle of the second metallization layer is between approximately 40° and approximately 60°.

Abstract: A method of manufacturing a transistor structure includes forming a plurality of trenches in a substrate, lining the plurality of trenches with a dielectric material, forming first and second substrate regions at opposite sides of the plurality of trenches, and filling the plurality of trenches with a conductive material. The plurality of trenches includes first and second trenches aligned between the first and second substrate regions, and filling the plurality of trenches with the conductive material includes the conductive material extending continuously between the first and second trenches.

Abstract: A semiconductor device includes a first wafer comprising a first portion of a seal ring structure within a body of the first wafer. The semiconductor device includes a second wafer comprising a second portion of the seal ring structure within a body of the second wafer. The second wafer is affixed to the first wafer such that the second portion of the seal ring structure is on the first portion of the seal ring structure. The semiconductor device includes a trench structure comprising a first trench in the first wafer and a second trench in the second wafer, where the first trench and the second trench are on a same side of the seal ring structure.

Abstract: A wafer stacking process is provided in the present invention, including steps of forming a silicon oxide layer on a sacrificial carrier, bonding the silicon oxide layer with a dielectric layer on a front side of a silicon substrate, performing a thinning process on the back side of the silicon substrate to expose TSVs therewithin, bonding the back side of the silicon substrate with another silicon substrate, repeating the thinning process and the process of bonding another silicon substrate above so as to form a wafer stacking structure, and performing a removing process to completely remove the sacrificial carrier.

Abstract: A method and an apparatus of displaying component video signals. Firstly, a component video signal is received, and a vertical synchronous signal and a horizontal synchronous signal are separated from the component video signal. Thereafter, the format of the component video signal is determined by analyzing the vertical synchronous signal and the horizontal synchronous signal, and a video processing route corresponding to the format of the component video signal is chosen to generate visual output from the component video signal. Thus the visual output is displayed.

Abstract: A projection display apparatus and method of preventing from inadvertently inputting command thereof are provided for preventing users from inadvertently inputting the command to shut down a discharge lamp of the projection display apparatus. The method comprises the following steps: preparing to enter a determination mode when a projection display apparatus receives a activation signal; displaying the predetermined delay time on a screen of the projection display apparatus and down counting such delay time; determining whether a confirmation signal is received during the delay time; and shutting down the discharge lamp when the project display apparatus receives the confirmation signal. If the projection display apparatus fails to receive the confirmation signal or receive other signals during the delay time, the projection display apparatus will return to the normal display mode.

Abstract: A method for searching television channel is provided. An initial frequency and a frequency search interval are set. Thereafter, using the initial frequency as the starting point, television signals are scanned to find any television channel within a designated frequency bandwidth. The channel ID is resolved from the channel frequency based on a specific broadcasting system on each detecting of the channel signals. The channel frequency and frequency ID of any television channel thus found are also stored. In this invention, the television channel is searched by frequency instead of a channel table as in a conventional method.

Abstract: A method and an apparatus of displaying component video signals. Firstly, a component video signal is received, and a vertical synchronous signal and a horizontal synchronous signal are separated from the component video signal. Thereafter, the format of the component video signal is determined by analyzing the vertical synchronous signal and the horizontal synchronous signal, and a video processing route corresponding to the format of the component video signal is chosen to generate visual output from the component video signal. Thus the visual output is displayed.