Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes an array substrate, which includes a substrate, a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer. The substrate has a substrate surface. The first conductive layer is located on the substrate surface. The first insulating layer is located on the first conductive layer. The second conductive layer is located on the first insulating layer and includes a first sputtering layer, a second sputtering layer, and a third sputtering layer. The second insulating layer is located on the second conductive layer. The second sputtering layer is located between the first and third sputtering layers, and includes a first metal element. The first sputtering layer includes the first metal element and a second metal element. The third sputtering layer includes the first metal element and a third metal element.

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes an array substrate, which includes a substrate, a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer. The substrate has a substrate surface. The first conductive layer is located on the substrate surface. The first insulating layer is located on the first conductive layer. The second conductive layer is located on the first insulating layer and includes a first sputtering layer, a second sputtering layer, and a third sputtering layer. The second insulating layer is located on the second conductive layer. The second sputtering layer is located between the first and third sputtering layers, and includes a first metal element. The first sputtering layer includes the first metal element and a second metal element. The third sputtering layer includes the first metal element and a third metal element.

Abstract: A manufacturing method of a microelectromechanical system (MEMS) package structure includes providing a base, wherein the base comprises a recess; disposing a chip in the recess, wherein the chip has an active surface; disposing a MEMS device on the active surface in the recess, wherein the MEMS device is covered by a first cover, the first cover comprises a cavity, and the MEMS device is in the cavity; disposing a sealant at a peripheral gap between the chip and the first cover so as to seal the cavity; disposing a glass frit on a second cover or the base; disposing the second cover on the base, wherein the second cover covers the recess, and the glass frit is disposed between the base and the second cover; and heating the glass frit so as to seal the recess.

Abstract: A microelectromechanical system (MEMS) device includes a substrate and at least one MEMS unit disposed on the substrate. The MEMS unit includes at least one first electrode, at least one second electrode, at least one landing element, and a hinge layer. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The landing element is disposed on the substrate. The hinge layer includes a hinge portion and at least one cantilever portion. The hinge portion is connected to the second electrode. The cantilever portion is connected to the hinge portion. The cantilever portion has a first opening and at least one spring disposed in the first opening and connected to at least one side of the first opening. When a voltage difference exists between the first electrode and the second electrode, the hinge portion is distorted and the spring thus touches the landing element.

Abstract: A manufacturing method of a microelectromechanical system (MEMS) package structure includes providing a base, wherein the base comprises a recess; disposing a chip in the recess, wherein the chip has an active surface; disposing a MEMS device on the active surface in the recess, wherein the MEMS device is covered by a first cover, the first cover comprises a cavity, and the MEMS device is in the cavity; disposing a sealant at a peripheral gap between the chip and the first cover so as to seal the cavity; disposing a glass frit on a second cover or the base; disposing the second cover on the base, wherein the second cover covers the recess, and the glass frit is disposed between the base and the second cover; and heating the glass frit so as to seal the recess.

Abstract: A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided.

Abstract: A MEMS package structure is disclosed. The MEMS package structure includes a first glass substrate on a micro-electromechanical systems (MEMS) structure, a sealant adhered between the first glass substrate and the MEMS structure; and a first moisture barrier on the sidewalls of the first glass substrate, the sealant, and the MEMS structure.

Abstract: A microelectromechanical system (MEMS) device includes a substrate and at least one MEMS unit disposed on the substrate. The MEMS unit includes at least one first electrode, at least one second electrode, at least one landing element, and a hinge layer. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The landing element is disposed on the substrate. The hinge layer includes a hinge portion and at least one cantilever portion. The hinge portion is connected to the second electrode. The cantilever portion is connected to the hinge portion. The cantilever portion has a first opening and at least one spring disposed in the first opening and connected to at least one side of the first opening. When a voltage difference exists between the first electrode and the second electrode, the hinge portion is distorted and the spring thus touches the landing element.

Abstract: A MEMS package structure is disclosed. The MEMS package structure includes a first glass substrate on a micro-electromechanical systems (MEMS) structure, a sealant adhered between the first glass substrate and the MEMS structure; and a first moisture barrier on the sidewalls of the first glass substrate, the sealant, and the MEMS structure.

Abstract: A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided.

Abstract: A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid.

Abstract: A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid.

Abstract: A display device including an active device array substrate having an active surface, an opposite substrate, a first alignment unit, a second alignment unit, a liquid crystal layer and a sealant is provided. The opposite substrate disposed above the active device array substrate has a light transmissive surface, wherein the active surface and the light transmissive surface face each other. The first alignment unit is disposed on the active device array substrate and located on the active surface. The second alignment unit is disposed on the opposite substrate and located on the light transmissive surface, wherein the first alignment unit aligns with the second alignment unit. The liquid crystal layer is disposed between the first and the second alignment units. The sealant directly connects the active surface and the light transmissive surface, and surrounds peripherals of the liquid crystal layer, the first alignment unit, and the second alignment unit.

Abstract: A liquid crystal on silicon (LCOS) display panel and an electronic device using the same are provided. The electronic device comprises the LCOS display panel and a circuit board. The LCOS display panel comprises a silicon substrate, a transparent substrate and a liquid crystal layer. The transparent substrate has a base plate and a mask layer. The circuit board is electrically connected to the display panel. The transparent substrate is disposed opposite to the silicon substrate, and the liquid crystal layer is positioned between the silicon substrate and the transparent substrate. The base plate has a first surface and a second surface opposite to the first surface that faces the silicon substrate. The mask layer is disposed on the second surface and has at least one opening to form at least one light-transmitting region and one light-blocking region, and the light-transmitting region is a displaying region of the transparent substrate.

Abstract: A manufacturing method of a display device is provided. Firstly, an active device array substrate having an active surface is provided. Next, a first patterned photoresist layer is formed on the active surface. Then, a first alignment layer is obliquely vapor-deposited on the active surface and the first patterned photoresist layer, wherein the active surface comprises at least a first undeposited area located beside an edge of the first patterned photoresist layer. A first alignment unit is formed by removing the first patterned photoresist layer and a portion of the first alignment layer located thereon. A sealant is directly formed on the active surface of the active device array substrate and surrounds the first alignment unit. An opposite substrate having a light transmissive surface is provided. After that, the active device array substrate and the opposite substrate are assembled. A display device is also provided.

Abstract: An optical engine including a light source, a polarizing beam splitter (PBS), a multi-focus lens, and a light valve is provided. The light source is capable of emitting an illumination beam. The PBS is disposed on the light path of the illumination beam. The multi-focus lens is disposed on the light path of the illumination beam between the light source and the PBS, and has a plurality of refractive portions. The refractive portions have different effective focal lengths from one another. The PBS allows at least a part of the illumination beam with a first polarization direction to travel to the light valve. The light valve is capable of reflecting the part of the illumination beam and converting the part of the illumination beam into an image beam with a second polarization direction. The image beam from the light valve travels to the PBS.

Abstract: A liquid crystal on silicon (LCOS) display panel and an electronic device using the same are provided. The electronic device comprises the LCOS display panel and a circuit board. The LCOS display panel comprises a silicon substrate, a transparent substrate and a liquid crystal layer. The transparent substrate has a base plate and a mask layer. The circuit board is electrically connected to the display panel. The transparent substrate is disposed opposite to the silicon substrate, and the liquid crystal layer is positioned between the silicon substrate and the transparent substrate. The mask layer is disposed on the base plate and has at least one opening to form at least one light-transmitting region and one light-blocking region, and the light-transmitting region is a displaying region of the transparent substrate.

Abstract: A liquid crystal on silicon (LCOS) display panel and an electronic device using the same are provided. The electronic device comprises the LCOS display panel and a circuit board. The LCOS display panel comprises a silicon substrate, a transparent substrate and a liquid crystal layer. The transparent substrate has a base plate and a mask layer. The circuit board is electrically connected to the display panel. The transparent substrate is disposed opposite to the silicon substrate, and the liquid crystal layer is positioned between the silicon substrate and the transparent substrate. The base plate has a first surface and a second surface opposite to the first surface that faces the silicon substrate. The mask layer is disposed on the second surface and has at least one opening to form at least one light-transmitting region and one light-blocking region, and the light-transmitting region is a displaying region of the transparent substrate.