Patents by Inventor Chun-Heng Lin

Chun-Heng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12197366
    Abstract: A USB IC, an operation method thereof, and a USB device are provided. The USB IC is disposed in the USB device and includes a sideband use interface circuit coupled to a sideband use pin of a USB connector of the USB device, and a control circuit. The control circuit is coupled to the sideband use interface circuit and reports a first adapter configuration to a USB host via the sideband use interface circuit so that the USB host enumerates the USB device. The control circuit observes a behavior of the USB host to the USB device after the USB device is enumerated. The control circuit determines whether the first adapter configuration is suitable for a connection manager of the USB host according to the behavior. If not, the control circuit reports a second adapter configuration to the USB host so that the USB host re-enumerates the USB device.
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: January 14, 2025
    Assignee: VIA LABS, INC.
    Inventors: Chun-Heng Lin, Terrance Shiyang Shih, Chin-Sung Hsu
  • Publication number: 20240020438
    Abstract: This invention provides a shoe upper design model generating method, system and non-transitory computer readable storage media, including steps of providing a 2D mapping boundary, providing a 3D upper, performing a flattening algorithm on the 3D upper with respect to the 2D mapping boundary, constructing a 2D upper boundary, creating an upper design drawing on the 2D upper boundary, intersecting the 2D upper boundary and the 2D mapping boundary to form a 2D upper design area and mapping grids in the 2D upper design area onto grids in the 3D upper, thereby obtaining an upper design model containing the mapping relation between the 2D upper design area and the 3D upper. Accordingly, the upper pattern making time and cost can be saved, and the distortion and deformation in the process of 2D-3D conversion can be reduced, thus the completed 2D upper design drawing can be used in production process directly.
    Type: Application
    Filed: April 20, 2023
    Publication date: January 18, 2024
    Inventors: Wei-Hsiang TSAI, CHIN-YU CHEN, CHUN-HENG LIN, CHIH-PENG CHEN, FONG-YI SYU
  • Publication number: 20230169026
    Abstract: A USB IC, an operation method thereof, and a USB device are provided. The USB IC is disposed in the USB device and includes a sideband use interface circuit coupled to a sideband use pin of a USB connector of the USB device, and a control circuit. The control circuit is coupled to the sideband use interface circuit and reports a first adapter configuration to a USB host via the sideband use interface circuit so that the USB host enumerates the USB device. The control circuit observes a behavior of the USB host to the USB device after the USB device is enumerated. The control circuit determines whether the first adapter configuration is suitable for a connection manager of the USB host according to the behavior. If not, the control circuit reports a second adapter configuration to the USB host so that the USB host re-enumerates the USB device.
    Type: Application
    Filed: November 21, 2022
    Publication date: June 1, 2023
    Applicant: VIA LABS, INC.
    Inventors: Chun-Heng Lin, Terrance Shiyang Shih, Chin-Sung Hsu
  • Patent number: 10095333
    Abstract: A touch apparatus including a first substrate, a first translucent electrode, a second substrate, an electrochromic layer, a reflective film, and a touch sensing structure is provided. The first substrate has a first inner surface and a first outer surface opposite to each other. The first translucent electrode is disposed on the first inner surface. The second substrate is disposed opposite to the first substrate. The electrochromic layer is located between the first inner surface of the first substrate and the second substrate. The reflective film is disposed on the second substrate. The touch sensing structure is disposed on the first outer surface of the first substrate.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: October 9, 2018
    Assignee: UNIDISPLAY INC.
    Inventors: Wei-Chieh Wang, Meng-Chia Chan, Sheng-Hsien Lin, Chun-Heng Lin
  • Publication number: 20180050641
    Abstract: A rear-view mirror installed in a transport vehicle is provided. The rear-view mirror includes a first substrate, a second substrate, an electrochromic material layer, a light-transmitting electrode, a reflective layer, and a transparent conductive layer. The second substrate is opposite to the first substrate. The electrochromic material layer is disposed between the first substrate and the second substrate. The light-transmitting electrode is disposed between the first substrate and the electrochromic material layer. The electrochromic material layer is disposed between the first substrate and the reflective layer. The transparent conductive layer is disposed between the electrochromic material layer and the reflective layer. In addition, a driving auxiliary apparatus is also provided.
    Type: Application
    Filed: January 6, 2017
    Publication date: February 22, 2018
    Applicant: UNIDISPLAY INC.
    Inventors: Shih-Yao Lin, Ming-Yuan Hsu, Meng-Chia Chan, Chun-Heng Lin, Sheng-Hsien Lin
  • Patent number: 9817788
    Abstract: A hub device and corresponding method include a first chip having at least a first upstream port and a plurality of first downstream ports, a second chip, having at least a second upstream port and at least one second downstream port; and an external memory device, storing firmware data corresponding to the first chip and the second chip. One one of the first downstream ports of the first chip is coupled to the second upstream port of the second chip to form a tiered hub, and the first chip and the second chip are sequentially enabled and the first chip and the second chip sequentially load the corresponding firmware data.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: November 14, 2017
    Assignee: VIA TECHNOLOGIES, INC.
    Inventors: Chih-Long Ho, Yi-Te Chen, Wen-Hao Cheng, Kuo-Yu Wu, Chun-Heng Lin, Po-Ming Huang
  • Publication number: 20170160846
    Abstract: A touch apparatus including a first substrate, a first translucent electrode, a second substrate, an electrochromic layer, a reflective film, and a touch sensing structure is provided. The first substrate has a first inner surface and a first outer surface opposite to each other. The first translucent electrode is disposed on the first inner surface. The second substrate is disposed opposite to the first substrate. The electrochromic layer is located between the first inner surface of the first substrate and the second substrate. The reflective film is disposed on the second substrate. The touch sensing structure is disposed on the first outer surface of the first substrate.
    Type: Application
    Filed: February 3, 2016
    Publication date: June 8, 2017
    Inventors: Wei-Chieh Wang, Meng-Chia Chan, Sheng-Hsien Lin, Chun-Heng Lin
  • Publication number: 20160275040
    Abstract: A hub device and corresponding method include a first chip having at least a first upstream port and a plurality of first downstream ports, a second chip, having at least a second upstream port and at least one second downstream port; and an external memory device, storing firmware data corresponding to the first chip and the second chip. One one of the first downstream ports of the first chip is coupled to the second upstream port of the second chip to form a tiered hub, and the first chip and the second chip are sequentially enabled and the first chip and the second chip sequentially load the corresponding firmware data.
    Type: Application
    Filed: May 27, 2016
    Publication date: September 22, 2016
    Inventors: Chih-Long HO, Yi-Te CHEN, Wen-Hao CHENG, Kuo-Yu WU, Chun-Heng LIN, Po-Ming HUANG
  • Patent number: 9350407
    Abstract: An interface chip capable of accurate link detection. The interface chip mounted on a first electronic device has a link layer and a physical layer. The link layer outputs data to be transformed and transmitted to a second electronic device by the physical layer. The data transmitted from the second electronic device is received and transformed by the physical layer and then conveyed to the link layer. The link layer includes a state machine, which performs a state modification on the first electronic device to rescue the second electronic device from a trapped state for confirming a link between the first and second electronic devices, wherein data output by the link layer and transformed and transmitted to the second electronic device by the physical layer is changed according to the state modification.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: May 24, 2016
    Assignee: VIA TECHNOLOGIES, INC.
    Inventors: Shih-Hao Chen, Chun-Heng Lin
  • Patent number: 9226394
    Abstract: A touch-sensing substrate including a substrate, a patterned conductive layer and a patterned insulating layer is provided. The substrate has a plurality of first striped regions and a plurality of second striped regions. The first striped regions are intersected with the second striped regions to define a plurality of sensing-pad disposition regions. The patterned conductive layer includes a plurality of sensing pads disposed in the sensing-pad disposition regions. The patterned insulating layer is disposed on the first striped regions and the second striped regions. The patterned insulating layer and the patterned conductive layer are spliced to form a patterned light-shielding layer. The patterned light-shielding layer has a plurality of enclosed notches arranged in array, wherein parts of the enclosed notches are surrounded by the patterned conductive layer, and other parts of the enclosed notches are surrounded by the patterned conductive layer and the patterned insulating layer.
    Type: Grant
    Filed: July 19, 2013
    Date of Patent: December 29, 2015
    Assignee: UNIDISPLAY INC.
    Inventors: Yi-Ming Tsai, Chun-Heng Lin, Wea-Li Tien, Sheng-Hsien Lin, Yueh-Ju Tsai, Wei-Jie Wang
  • Patent number: 8769317
    Abstract: A USB hub and a method thereof. The USB hub supplies power to a USB device, is connected between the USB device and a USB host under a working power state, and comprises an upstream port, a downstream port, a power port, and a controller. The upstream port is coupled to the USB host. The downstream port is coupled to the USB device. The power port is coupled to a power source. The controller is coupled to the upstream port, the downstream port, and the power port, and determines whether the USB host has left the working power state, and determines whether the USB device is electrically chargeable, when the USB host has left the working power state. The downstream port provides power to the USB device from the power source when the USB device is electrically chargeable.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: July 1, 2014
    Assignee: Via Technologies, Inc.
    Inventors: Terrance Shih, Chin-Sung Hsu, Chun-Heng Lin
  • Publication number: 20140022743
    Abstract: A touch-sensing substrate including a substrate, a patterned conductive layer and a patterned insulating layer is provided. The substrate has a plurality of first striped regions and a plurality of second striped regions. The first striped regions are intersected with the second striped regions to define a plurality of sensing-pad disposition regions. The patterned conductive layer includes a plurality of sensing pads disposed in the sensing-pad disposition regions. The patterned insulating layer is disposed on the first striped regions and the second striped regions. The patterned insulating layer and the patterned conductive layer are spliced to form a patterned light-shielding layer. The patterned light-shielding layer has a plurality of enclosed notches arranged in array, wherein parts of the enclosed notches are surrounded by the patterned conductive layer, and other parts of the enclosed notches are surrounded by the patterned conductive layer and the patterned insulating layer.
    Type: Application
    Filed: July 19, 2013
    Publication date: January 23, 2014
    Applicant: UNIDISPLAY INC.
    Inventors: Yi-Ming Tsai, Chun-Heng Lin, Wea-Li Tien, Sheng-Hsien Lin, Yueh-Ju Tsai, Wei-Jie Wang
  • Publication number: 20140019658
    Abstract: A hub device includes a first chip, a second chip and an external memory device. The first chip includes at least a first upstream port and multiple first downstream ports. The second chip includes at least a second upstream port and multiple second downstream ports. The external memory device stores firmware data corresponding to the first chip and the second chip. One of the first downstream ports of the first chip is coupled to the second upstream port of the second chip to form a tiered hub. The first chip and the second chip are sequentially enabled and the first chip and the second chip sequentially load the corresponding firmware data.
    Type: Application
    Filed: July 11, 2013
    Publication date: January 16, 2014
    Inventors: Chih-Long HO, Yi-Te CHEN, Wen-Hao CHENG, Kuo-Yu WU, Chun-Heng LIN, Po-Ming HUANG
  • Publication number: 20130191653
    Abstract: A USB hub and a method thereof. The USB hub supplies power to a USB device, is connected between the USB device and a USB host under a working power state, and comprises an upstream port, a downstream port, a power port, and a controller. The upstream port is coupled to the USB host. The downstream port is coupled to the USB device. The power port is coupled to a power source. The controller is coupled to the upstream port, the downstream port, and the power port, and determines whether the USB host has left the working power state, and determines whether the USB device is electrically chargeable, when the USB host has left the working power state. The downstream port provides power to the USB device from the power source when the USB device is electrically chargeable.
    Type: Application
    Filed: January 20, 2012
    Publication date: July 25, 2013
    Applicant: VIA TECHNOLOGIES, INC.
    Inventors: Terrance SHIH, Chin-Sung HSU, Chun-Heng LIN
  • Publication number: 20060201994
    Abstract: A bonding mechanism for a heat conduction tube and heat dissipation plate is disclosed. The bonding mechanism comprises an installation platform, an elevating device, and a height-adjusting device. The installation platform allows the heat dissipation plates to be placed flatly on the surface of the platform and the height adjusting device is for the control of the height of the heat conduction tube. A plurality of heat dissipation plates can be mounted in sequence with a fixed gap onto the heat conduction tube. The bonding mechanism provides a low noise and low vibration and facilitating adjustment of bonding gap of the heat dissipation plates.
    Type: Application
    Filed: March 11, 2005
    Publication date: September 14, 2006
    Inventors: Chun-Heng Lin, Zhi-Mieng Dai