Patents by Inventor Chun Ho Choi
Chun Ho Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240118196Abstract: In the case of a gas in which several gases are mixed, a type and concentration of the gas may be incorrectly measured when measured using only an optical band-pass filter. The invention of the present application is directed to providing a technology in which a plurality of broadband band-pass filters having overlapping regions are provided to calculate a magnitude of absorption for each wavelength band for light passing through each broadband band-pass filter, thereby identifying the presence of a gas of interest and the presence of a gas other than the gas of interest.Type: ApplicationFiled: September 8, 2023Publication date: April 11, 2024Inventors: Cheol Woo NAM, Byung Yul MOON, Eung Yul KIM, Jae Hwan KIM, Chun Ho SHIN, Kwang Hun PARK, Myun Gu CHOI, Chang Hwang CHOI, Yong Geol KIM, Jae Min JEON
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Patent number: 11950476Abstract: A display device includes a substrate; a transistor disposed on the substrate; a first insulating layer disposed on the transistor; and a first pixel electrode and a second pixel electrode disposed on the first insulating layer to be adjacent to each other. The first insulating layer includes a first opening between the first pixel electrode and the second pixel electrode.Type: GrantFiled: April 17, 2020Date of Patent: April 2, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Jun Ho Choi, Chun Gi You, Seong Kweon Heo, Eun Young You, Hyun Jin Hong
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Publication number: 20240080320Abstract: A server according to an embodiment includes a processor configured to receive a friend add request for a target account from a user terminal accessed with a user account; based on one of the user account and the target account being a protected account, transmit an approval request for the friend add request to a protector account connected to the protected account; and based on receiving a reply to the approval request from the protector terminal, add the target account to a friend list of the user account.Type: ApplicationFiled: April 27, 2023Publication date: March 7, 2024Inventors: You Jin KIM, Jung Woo CHOI, Jenog Ryeol CHOI, Joong Seon KIM, Hong Chan YUN, Ju Ho CHUNG, Do Hyun YOUN, Hyung Min KIM, Hyun Ok CHOI, Chun Ho KIM, Soo Beom KIM, Min Jeong KIM, Chang Oh HEO, Eun Soo HEO
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Publication number: 20080245022Abstract: The present invention relates to a truss framework system for slabs constructed of iron-bar framework having an improved construction property and construction molds, and the truss framework system for slabs using the mold assembly of the present invention comprises a framework of a two or three dimensional shape, comprised of at least two lower and upper main iron-bars maintaining the interval there-between corresponding to a thickness of the slab to be constructed, and lattice iron-bars for maintaining the interval and reinforcing the main iron-bars; a mold assembly including a panel formed with a plurality of insert holes spaced with predetermined interval and positioned below the framework, a wedge portion formed with a slit having an extension portion adjoining the lowest point and a narrow portion extending from the lowest point to the highest point and communicating with the extension portion, and arranged at the respective position of the insert holes of the panel, a sliding plate having a contactingType: ApplicationFiled: January 25, 2006Publication date: October 9, 2008Inventors: Chong-hak Choi, Chun-ho Choi, Oon-sik Sin
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Patent number: 7278193Abstract: A device is provided for coupling (i) a PCB sheet, which includes a first PCB and a space formed after removing a defective PCB from the PCB sheet, with (ii) a replacement second PCB received in the space and has a connecting part spaced from a periphery of the space by a channel. The device includes a PCB securing plate adapted to support the PCB sheet. PCB securing pins project from an upper surface of the PCB securing plate to be inserted into pin receiving holes of the first and second PCBs for positioning the PCBs. PCB securing tapes are integrally attached on the PCB securing plate for securing the PCB sheet and the second PCB to the PCB securing plate. An adhesive is adapted to be filled into the channel to couple, when cured, the PCB sheet and the second PCB together.Type: GrantFiled: January 21, 2005Date of Patent: October 9, 2007Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Bong Kyu Choi, Chun Ho Choi
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Patent number: 7234217Abstract: A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2? is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2?, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2? is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.Type: GrantFiled: January 21, 2005Date of Patent: June 26, 2007Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Bong Kyu Choi, Chun Ho Choi
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Patent number: 7103966Abstract: A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2? is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2?, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2? is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.Type: GrantFiled: January 21, 2005Date of Patent: September 12, 2006Assignee: Samsung Electro-Mechanics Co., LTDInventors: Bong Kyu Choi, Chun Ho Choi
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Patent number: 7017248Abstract: A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2? is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2?, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2? is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.Type: GrantFiled: June 24, 2002Date of Patent: March 28, 2006Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Bong Kyu Choi, Chun Ho Choi
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Patent number: 6574862Abstract: In a method for coupling a PCB sheet, if a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet is removed from continuously arranged circuit patterns of a first PCB sheet. After removal of the defective circuit pattern sheet, the first PCB sheet is position-located by a position locator. Then, the space which is formed by removing, the defective circuit pattern sheet is filled with a second PCB sheet on which a good quality circuit pattern is printed. Then, the first PCB sheet and the second PCB sheet are coupled together by using an adhesive.Type: GrantFiled: February 22, 2000Date of Patent: June 10, 2003Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Bong Kyu Choi, Chun Ho Choi
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Publication number: 20020152609Abstract: A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2′ is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2′, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2′ is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.Type: ApplicationFiled: June 24, 2002Publication date: October 24, 2002Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Bong Kyu Choi, Chun Ho Choi