Patents by Inventor Chun-Ho Daniel Lee

Chun-Ho Daniel Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6433648
    Abstract: A structure and a method for reducing the mutual inductance between two adjacent transmission lines according to the invention. In the invention, an inverse U-shaped transmission line is located on one side of a transmission line. The corner of a first side of the inverse U-shaped transmission line is bond finger for signal input; the corner of a second side of the inverse U-shaped transmission line is connected to via for signal output. To prevent antenna effect, corners of the inverse U-shaped transmission line are mitered. Furthermore, using computer simulation software, the lengths of the first and second sides of the inverse U-shaped transmission line and the pitches between the first and second sides and the selected transmission line can be adjusted to effectively reduce the mutual inductance therebetween. As a result, cross-talk caused by the mutual inductance can also be eliminated.
    Type: Grant
    Filed: April 4, 2000
    Date of Patent: August 13, 2002
    Assignee: Via Technologies, Inc.
    Inventor: Chun-Ho Daniel Lee
  • Patent number: 6380818
    Abstract: A structure for reducing the mutual inductance between two adjacent transmission lines on a substrate according to the invention includes a loop-shaped transmission line, at least one transmission line located on each side of the loop-shaped transmission line. One end of the loop-shaped transmission line is connected to bond wire and a diagonal end is connected to a signal output on the substrate. The loop-shaped transmission line has a short side equal to ½ of the wavelength of an input signal. With such structure, even though the clock frequency of a used CPU is several hundred MHz, the mutual inductance and cross-talk caused by the mutual inductance can be effectively reduced.
    Type: Grant
    Filed: April 4, 2000
    Date of Patent: April 30, 2002
    Assignee: Via Technologies, Inc.
    Inventor: Chun-Ho Daniel Lee