Abstract: A grid array (GA) package for holding a die therein, the die accessing its operational power from a printed circuit board through the GA package, the GA package comprises a substrate with a die cavity. A first conductive layer is provided on a top surface of the substrate, a ring is provided surrounding the die cavity whereby the die electrically connects the first conductive layer via the ring. A second conductive layer is provided on a bottom surface of the substrate. A plurality of vias are provided within the substrate to connect the first conductive layer with the second conductive layer. A plurality of solder balls are provided on the bottom surface of the second conductive layer to connect the second conductive layer with the printed circuit board. Individual solder ball is horizontally closer to the die cavity in comparison with at least one associated via.