Patents by Inventor Chun Ho Yau

Chun Ho Yau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200157783
    Abstract: The invention relates to a wind-driven air-compressed energy-saving collecting and filtering device for field fresh water which includes a water collecting tank, a cooling pipe, a compression pipe and a wind wheel. The water collecting tank is provided with a pressure relief pipe, an outlet pipe and a plug. The outer side of the cooling pipe is provided with an ultraviolet sterilizer. The inner cavity of the cooling pipe is provided with a fin condenser. The upper end of the compression pipe is connected to an end cover, a second annular housing, a power generating coil disposed in the inner cavity of the second annular housing. The end cover is provided with a commutator. The inner cavity of the compression pipe is provided with a first rotating shaft, magnetic compression blades, and a limiting mesh plate. The wind wheel includes a bracket and Y-shaped blades.
    Type: Application
    Filed: January 3, 2019
    Publication date: May 21, 2020
    Inventor: Chun Ho YAU
  • Publication number: 20160204003
    Abstract: A method for plating a lead frame comprises the steps of plating the lead frame with at least one plating layer including silver and forming an asper-silver layer comprising nano-silver formations over the at least one plating layer including silver. The asper-silver layer is particularly beneficial for enhancing the adhesion of plastic molding compound to the lead frame.
    Type: Application
    Filed: January 8, 2015
    Publication date: July 14, 2016
    Inventors: Yiu Fai KWAN, Yu Lung LAM, Chun Ho YAU, Wing Lam AU
  • Publication number: 20100155260
    Abstract: Method of manufacturing a lead frame wherein a bare lead frame material is immersed in a salt solution. Gas bubbles are provided in the salt solution next to the bare lead frame material such that the bubbles contact a surface of the lead frame material and pop in proximity to the bare lead frame material causing chemical reactions on the surface of the lead frame, thereby forming a plurality of dimples of irregular sizes on the surface of the lead frame.
    Type: Application
    Filed: December 22, 2008
    Publication date: June 24, 2010
    Inventors: Yiu Fai Kwan, Tat Chi Chan, Chun Ho Yau
  • Patent number: 7691679
    Abstract: A process for producing a pre-plated leadframe that has enhanced adhesion by molding compound is provided, wherein a base leadframe material is first plated with multiple layers of metallic material. Thereafter, the plated base leadframe material is covered with a mask, so as to expose selected surfaces thereof at unmasked areas where enhanced adhesion of molding compound is desired. The said unmasked areas are plated with a layer of copper before removing the mask. Optionally, the layer of copper may further be oxidized to form a layer of specially controlled copper oxide.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: April 6, 2010
    Assignee: ASM Assembly Materials Ltd.
    Inventors: Yiu Fai Kwan, Tat Chi Chan, Chun Ho Yau, Chi Chung Lee
  • Publication number: 20080233683
    Abstract: A process for producing a pre-plated leadframe that has enhanced adhesion by molding compound is provided, wherein a base leadframe material is first plated with multiple layers of metallic material. Thereafter, the plated base leadframe material is covered with a mask, so as to expose selected surfaces thereof at unmasked areas where enhanced adhesion of molding compound is desired. The said unmasked areas are plated with a layer of copper before removing the mask. Optionally, the layer of copper may further be oxidized to form a layer of specially controlled copper oxide.
    Type: Application
    Filed: March 23, 2007
    Publication date: September 25, 2008
    Inventors: Yiu Fai Kwan, Tat Chi Chan, Chun Ho Yau, Chi Chung Lee