Patents by Inventor Chun Hoe GU

Chun Hoe GU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer marking method
    Patent number: 10304778
    Abstract: Disclosed is a wafer marking method using a laser for marking a wafer having processing tape attached thereto. The disclosed laser marking method comprises the steps of: penetrating a 532-nm wavelength laser beam through the processing tape attached to one side of the wafer; and performing marking on the one side of the wafer by moving the 532-nm wavelength laser beam at a predetermined velocity, wherein the 532-nm wavelength laser beam has a frequency of 8 kHz to 40 kHz, and an output power of 0.8 W to 2 W.
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: May 28, 2019
    Assignee: EO TECHNICS CO., LTD
    Inventors: Chun Hoe Gu, Soo Young Kim, Sung Beom Jung
  • WAFER MARKING METHOD
    Publication number: 20170200680
    Abstract: Disclosed is a wafer marking method using a laser for marking a wafer having processing tape attached thereto. The disclosed laser marking method comprises the steps of: penetrating a 532-nm wavelength laser beam through the processing tape attached to one side of the wafer; and performing marking on the one side of the wafer by moving the 532-nm wavelength laser beam at a predetermined velocity, wherein the 532-nm wavelength laser beam has a frequency of 8 kHz to 40 kHz, and an output power of 0.8 W to 2 W.
    Type: Application
    Filed: August 11, 2014
    Publication date: July 13, 2017
    Applicant: EO TECHNICS CO., LTD.
    Inventors: Chun Hoe GU, Soo Young KIM, Sung Beom JUNG