Abstract: A foldable display device according to an exemplary embodiment includes a first body and a second body, and a hinge unit which is connected between the first body and the second body. The hinge unit includes a first joint which includes a first recess, a second joint which faces the first joint, a third joint disposed at one side of the first joint, a first leaf spring disposed in the first recess, and a first fastener fixed to the third joint through the first leaf spring and the first joint.

Abstract: A foldable display device includes a hinge, a support plate connected to opposite ends of the hinge and a display panel module disposed on the support plate. The hinge includes a rotation axis module having a rotation axis. A first slider is connected to the rotation axis and includes a first guide line. A second slider is connected to the support plate and includes a second guide line. A link arm includes a link arm body. The link arm body has a link arm rotation axis disposed at a first end of the link arm body and a link arm pin hole disposed at a second end of the link arm body. A link arm pin is configured to extend through the link arm pin hole, the first guide line and the second guide line.

Abstract: A mobile device includes a WLAN (Wireless Local Area Network) module, a WWAN (Wireless Wide Area Network) module, a first antenna element, a second antenna element, a third antenna element, a fourth antenna element, a first switch element, and a second switch element. The WLAN module has a first port, a second port, and a first control port. The WWAN module has a third port, a fourth port, a fifth port, and a sixth port. The first antenna element is coupled to the third port. The first switch element couples the second antenna element to the first port or the fourth port according to a first control signal. The second switch element couples the third antenna element to the second port or the fifth port according to a second control signal. The fourth antenna element is coupled to the sixth port.

Abstract: The present invention relates to a coral composite extract, a composition including the same and a method of producing the same. The coral composite extract includes at least two briarane-type diterpenoid compounds from corals of Briareum violaceum, B. excavatum and B. stechei, thereby being applied as an effective ingredient of a skin external use composition, a cosmetic composition and a medicinal composition.

Abstract: A system that simulates force feedback of a remote-control vehicle in a motion chair, which includes a plurality of cameras (110,120) mounted on the vehicle (100), an image stabilization module (430) in the vehicle (100), a video processing module (440) in the vehicle (100), an information splitter (514) in the motion chair (570), a motion processing unit (520) in the motion chair (570), a control unit (550) in the motion chair (570), a G-force calculation unit (560) in the motion chair (570) and a force feedback generation unit (540) in the motion chair (570). The motion processing unit (520) calculates six degrees of freedom of motions of the vehicle based on the image stabilization signals generated from the cameras (110,120). The force feedback generation unit (540) produces force feedback signals based on the six degrees of freedom of motions of the vehicle (100) and the G-force calculated by the G-force calculation unit (560).

Abstract: Semiconductor packages and methods for forming a semiconductor package are disclosed. The method includes providing a package substrate having first and second major surfaces. The package substrate includes a base substrate having a mold material and a plurality of interconnect structures including via contacts extending through the first to the second major surface of the package substrate. A die having conductive contacts on its first or second surface is provided. The conductive contacts of the die are electrically coupled to the interconnect structures. A cap is formed over the package substrate to encapsulate the die.

Abstract: A testing device for vehicles includes a pressure gauge, a multidirectional joint, a quick combination unit, and a deflation valve unit. The pressure gauge has a main body provided with a connecting portion. The multidirectional joint has at least three openings communicating with each other. The multidirectional joint is directly disposed on the connecting portion of the main body, enabling gas to flow into the pressure gauge through one of the openings. The quick combination unit and the deflation valve unit are disposed on the other two openings respectively. Because the multidirectional joint is directly disposed on the main body of the pressure gauge, the main body uses the connecting portion thereof to be combined with the multidirectional joint, so that the component cost and the manufacturing time are effectively reduced, the manufacturing cost is lowered, the production yield rate and the product quality are highly improved.

Abstract: Semiconductor packages and methods for forming a semiconductor package are disclosed. The method includes providing a package substrate having first and second major surfaces. The package substrate includes a base substrate having a mold material and a plurality of interconnect structures including via contacts extending through the first to the second major surface of the package substrate. A die having conductive contacts on its first or second surface is provided. The conductive contacts of the die are electrically coupled to the interconnect structures. A cap is formed over the package substrate to encapsulate the die.

Abstract: A method for providing a logic synthesis of a pipeline circuit is disclosed. The method includes: providing a circuit design of the pipeline circuit, wherein the circuit design includes a first logic module as a current stage, and based on an operation of the first logic module, generating a first time marked graph (TMG) that corresponds to a plurality of behavioral phases of the first logic module, wherein the first TMG includes a plurality of vertexes and a plurality of edges, wherein each vertex corresponds to one of the plurality of behavioral phases that occur in sequence and each edge is coupled between two respective vertexes thereby corresponding to a transition from one behavioral phase to another subsequently occurring behavioral phase.

Abstract: The utility patent discloses an astronomical telescope which comprises a telescope body, and a navigation support for mounting a navigation device is arranged on the telescope body. According to the utility model, as the navigation support for mounting the navigation device is arranged on the telescope body, when in use, the navigation device such as a mobile phone and the like may be mounted on the navigation support and is made coincident in orientation with the telescope body, thus the celestial bodies that the users want to observe may be conveniently positioned using the navigation device, thereby facilitating the use.

Abstract: The present invention relates to a method for treating pain in a subject in need thereof, comprising administering an effective amount of a nucleic acid to the subject, wherein the nucleic acid comprises a PTEN nucleotide sequence of SEQ ID NO: 1. The present invention also provides a method for screening pharmaceutical compositions having an anti-pain effect, wherein the pharmaceutical compositions can stimulate the upregulation of PTEN.

Abstract: Devices and methods for forming a device are disclosed. The device includes a contact region disposed over a last interconnect level of the device. The device includes a final passivation layer having at least an opening which at least partially exposes a top surface of the contact region and a buffer layer disposed at least over a first exposed portion of the top surface of the contact region. When an electrically conductive interconnection couples to the contact region, the buffer layer absorbs a portion of a force exerted to form an interconnection between the electrically conductive interconnection and the contact region.

Abstract: Semiconductor packages and methods for forming a semiconductor package are disclosed. The method includes providing a package substrate having first and second major surfaces. The package substrate includes a base substrate having a mold material and a plurality of interconnect structures including via contacts extending through the first to the second major surface of the package substrate. A die having conductive contacts on its first or second surface is provided. The conductive contacts of the die are electrically coupled to the interconnect structures. A cap is formed over the package substrate to encapsulate the die.

Abstract: A restricted region transform method and a restricted region transform device are disclosed. The method includes following steps: reading out bare board information of a printed circuit board and layout information of a plurality of components, wherein the layout information of the plurality of components corresponds to a plurality of physical restricted regions; setting a first region according to edge information in the bare board information; setting a plurality of second regions according to projections of the plurality of physical restricted regions on a surface of the printed circuit board; selecting every two second regions, which overlap each other, among the plurality of second regions, and the selected second regions constituting a restriction conflict set; and selectively amending the second regions in the restriction conflict set to remove one or more overlaps from the second regions in the restriction conflict set.

Abstract: A method for providing a logic synthesis of a pipeline circuit is disclosed. The method includes: providing a circuit design of the pipeline circuit, wherein the circuit design includes a first logic module as a current stage, and based on an operation of the first logic module, generating a first time marked graph (TMG) that corresponds to a plurality of behavioral phases of the first logic module, wherein the first TMG includes a plurality of vertexes and edges, wherein each vertex corresponds to one of the plurality of behavioral phases that occur in sequence and each edge is coupled between two respective vertexes thereby corresponding to a transition from one behavioral phase to another subsequently occurring behavioral phase.

Abstract: Semiconductor packages and methods for forming a semiconductor package are disclosed. The method includes providing a package substrate having first and second major surfaces. The package substrate includes a base substrate having a mold material and a plurality of interconnect structures including via contacts extending through the first to the second major surface of the package substrate. A die having conductive contacts on its first or second surface is provided. The conductive contacts of the die are electrically coupled to the interconnect structures. A cap is formed over the package substrate to encapsulate the die.

Abstract: The utility patent discloses an astronomical telescope which comprises a telescope body, and a navigation support for mounting a navigation device is arranged on the telescope body. According to the utility model, as the navigation support for mounting the navigation device is arranged on the telescope body, when in use, the navigation device such as a mobile phone and the like may be mounted on the navigation support and is made coincident in orientation with the telescope body, thus the celestial bodies that the users want to observe may be conveniently positioned using the navigation device, thereby facilitating the use.

Abstract: A surrounding member with covering structure, an electronic device having the surrounding member, and a method of assembling a surrounding member are disclosed. A case of the electronic device includes a through hole. The surrounding member includes a first fastener, a second fastener, and a supporter. The first fastener passes through the through hole and is attached to the case. The second fastener and the supporter cover a lateral wall of the case. Therefore, the surrounding member can be assembled to the case even without using an adhesive and the surrounding member will not detach from the case easily. Moreover, because the surrounding member is attached to the case by passing through the though hole and cover the lateral wall of the case, the surrounding member is also adopt for an electronic device with narrow frame.