Abstract: A compound heat-dissipating device includes a conductive base and a heat-dissipating body. The conductive base has a first bottom surface, a first top surface, and a plurality of combining portions protruded from the first top surface. Each combining portion has a bottom end connected with the first bottom surface and a top end extended from the bottom end integrally. The top end has a cross-sectional area bigger than that of the bottom end. The heat-dissipating body has a second bottom surface and a second top surface. The second bottom surface has a pair of concave portions corresponding to a contour of the conductive base, and a plurality of combining grooves formed in the concave portion. The shape of the combining grooves is corresponding to that of the combining portions, and the combining portions are correspondingly combined with the combining grooves.

Abstract: A fluid spreader includes a first surface, wherein the first surface has at least one channel that continuously or discontinuously extends to an outer periphery of the first surface, allowing fluid to flow easily and thereby reducing the thickness of the fluid between the fluid spreader and another device or component.

Abstract: A heat-dissipating device suited for use with a liquid heat-transfer medium is proposed. It has a heat sink and an isolation layer. The isolation layer is disposed on a surface of the heat sink in contacts with the liquid heat-transfer medium. The isolation layer surrounds the liquid heat-transfer medium to prevent it from leaking.

Abstract: A heat dissipation device having a layer of a low melting point alloy coating and a method of fabrication are described. A low melting point alloy material is heated to above its melting point, and the melted alloy material is sprayed onto the heat sink to form a coating layer right on the heat sink for a close contact with a heat source. Manufacturing time is conserved, manufacturing operations are simpler, and thermal conduction is improved.