Patents by Inventor Chun Hsiang Fu

Chun Hsiang Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128127
    Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, a metal gate adjacent to the isolation structure, a shallow trench isolation (STI around the fin-shaped structure, and a second isolation structure on the STI. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Kai Hsu, Ssu-l Fu, Chun-ya Chiu, Chi-Ting Wu, Chin-HUNG Chen, Yu-Hsiang Lin
  • Publication number: 20240088293
    Abstract: An n-type metal oxide semiconductor transistor includes a gate structure, two source/drain regions, two amorphous portions and a silicide. The gate structure is disposed on a substrate. The two source/drain regions are disposed in the substrate and respectively located at two sides of the gate structure, wherein at least one of the source/drain regions is formed with a dislocation. The two amorphous portions are respectively disposed in the two source/drain regions. The silicide is disposed on the two source/drain regions, wherein at least one portion of the silicide overlaps the two amorphous portions.
    Type: Application
    Filed: October 5, 2022
    Publication date: March 14, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Ya Chiu, Ssu-I Fu, Chin-Hung Chen, Jin-Yan Chiou, Wei-Chuan Tsai, Yu-Hsiang Lin
  • Patent number: 8137131
    Abstract: A connector assembly is provided including an HDMI connector having a housing and a plurality of electrical contacts extending through the housing. The contacts define a first terminal end extending out from the housing and configured to be connected to electrical traces of a printed circuit board, and a second terminal end disposed opposite the first terminal end. The second end of the contacts can extend from the housing, and thereby be exposed to the ambient environment. The assembly can include one or more support mounts capable of attaching to the housing and to the circuit board to stabilize the connector. A protective shell can surround the second end of the contacts, and can be connected to the housing and to the printed circuit board. A dust cover can cover the upper end of the protective shell.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: March 20, 2012
    Assignee: FCI
    Inventors: Po Win Wang, Chun Hsiang Fu
  • Publication number: 20100216338
    Abstract: A connector assembly is provided including an HDMI connector having a housing and a plurality of electrical contacts extending through the housing. The contacts define a first terminal end extending out from the housing and configured to be connected to electrical traces of a printed circuit board, and a second terminal end disposed opposite the first terminal end. The second end of the contacts can extend from the housing, and thereby be exposed to the ambient environment. The assembly can include one or more support mounts capable of attaching to the housing and to the circuit board to stabilize the connector. A protective shell can surround the second end of the contacts, and can be connected to the housing and to the printed circuit board. A dust cover can cover the upper end of the protective shell.
    Type: Application
    Filed: May 6, 2008
    Publication date: August 26, 2010
    Applicant: FCI
    Inventors: Po Win Wang, Chun Hsiang Fu