Abstract: The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.

Abstract: A power management circuit includes an inverter circuit and a latch circuit. The inverter circuit is configured to receive a first control signal from an inverter input terminal and generate a second control signal at an inverter output terminal. The first control signal carries power status information of a first supply voltage. The latch circuit has a latch supply terminal, a first latch input terminal and a second latch input terminal. The latch supply terminal is coupled to a second supply voltage becoming ready before the first supply voltage. The first latch input terminal and the second latch input terminal are coupled to the inverter output terminal and the inverter input terminal respectively. The latch circuit is configured to generate a third control signal according to respective signal levels of the first control signal and the second control signal, and accordingly perform power control of an integrated circuit.

Abstract: A power management circuit includes an inverter circuit and a latch circuit. The inverter circuit is configured to receive a first control signal from an inverter input terminal and generate a second control signal at an inverter output terminal. The first control signal carries power status information of a first supply voltage. The latch circuit has a latch supply terminal, a first latch input terminal and a second latch input terminal. The latch supply terminal is coupled to a second supply voltage becoming ready before the first supply voltage. The first latch input terminal and the second latch input terminal are coupled to the inverter output terminal and the inverter input terminal respectively. The latch circuit is configured to generate a third control signal according to respective signal levels of the first control signal and the second control signal, and accordingly perform power control of an integrated circuit.

Abstract: A power management circuit includes an inverter circuit and a latch circuit. The inverter circuit is configured to receive a first control signal from an inverter input terminal and generate a second control signal at an inverter output terminal. The first control signal carries power status information of a first supply voltage. The latch circuit has a latch supply terminal, a first latch input terminal and a second latch input terminal. The latch supply terminal is coupled to a second supply voltage becoming ready before the first supply voltage. The first latch input terminal and the second latch input terminal are coupled to the inverter output terminal and the inverter input terminal respectively. The latch circuit is configured to generate a third control signal according to respective signal levels of the first control signal and the second control signal, and accordingly perform power control of an integrated circuit.

Abstract: A level shifter includes a latch circuit, an input stage, a driver stage and a control circuit. The latch circuit is configured to generate an output signal according to a signal level at a first drive node and a signal level at a second drive node. The input stage is configured to receive an input signal to adjust a signal level at a connection node. The driver stage is configured to drive the first drive node by coupling the connection node to the first drive node according to a set of control signals. The control circuit is coupled to the input stage and the driver stage. The control circuit is configured to control the driver stage to couple the connection node to the first drive node by adjusting a signal level of each control signal in the set of control signals during a level transition of the input signal.

Abstract: Methods of inhibiting cancer cell growth using HDAC10 inhibitors are provided. Methods of treating cancer in a subject using HDAC10 inhibitors are also provided. In certain embodiments, at least one second inhibitor selected from an autophagy inhibitor, an AMPK inhibitor, and methyl pyruvate is also used in the methods. Dose packs comprising HDAC10 inhibitors and at least one second inhibitor are provided. Methods of identifying HDAC10 inhibitors are also provided.

Abstract: An I/O pad ESD protection circuit is composed of a SCR circuit, a first diode, a second diode, and an anti-latch-up circuit. The SCR circuit has a first connection terminal and a second connection terminal, respectively coupled to the I/O pad and the ground voltage, so as to discharge the electrostatic charges. The anti-latch-up circuit has two terminals, which are respectively coupled to the voltage source and the ground voltage, and another connection terminal, used to send an anti-latch-up signal to the SCR for changing the activating rate. The latch-up phenomenon is avoided.

Abstract: Methods of inhibiting cancer cell growth using HDAC10 inhibitors are provided. Methods of treating cancer in a subject using HDAC10 inhibitors are also provided. In certain embodiments, at least one second inhibitor selected from an autophagy inhibitor, an AMPK inhibitor, and methyl pyruvate is also used in the methods. Dose packs comprising HDAC10 inhibitors and at least one second inhibitor are provided. Methods of identifying HDAC10 inhibitors are also provided.

Abstract: An ESD protection device for a pad includes an adjusting circuit, a snapback element and a control circuit. The adjusting circuit includes a silicon controlled rectifier (SCR) coupled to the pad. The SCR includes a first diode. The snapback element is coupled to a first N pole of the first diode when a second diode is not used, and is coupled to a second N pole of the second diode when the second diode is used. The control circuit is coupled to the first N pole. In a normal operation mode, the control circuit provides a first voltage to the first N pole so that the first N pole collects a plurality of charges and the SCR is turned off. In an ESD mode, the control circuit does not provide the first voltage to the first N pole so that the first N pole does not collect the charges.

Abstract: An ESD protection circuit connected between an input pad and an internal circuit is disclosed. The ESD protection circuit includes a main ESD protection device, a first resistor and a secondary device. The main ESD protection device is connected to the input pad for clamping a voltage of the input pad. The first resistor has a first end connected to the input pad and a second end connected to the internal circuit. The secondary device is connected to the second end of the first resistor and the main ESD protection device for clamping a voltage of the internal circuit. During an ESD event, the secondary device is turned on first to receive an ESD current and accordingly provides a trigger current to turn on the main ESD protection device.

Abstract: An ESD protection circuit is adapted for an integrated circuit with a first power source and a second power source. The ESD protection circuit comprises a first silicon controlled rectifier (SCR), and in some embodiments a second silicon controlled rectifier, and a parasitic diode. The silicon rectifiers as well as the parasitic diode can all be formed using a single well formed in a substrate. Further, the ESD protection circuit can be used in systems that have multiple power sources regardless of the difference in voltage between the power sources.

Abstract: An ESD protection circuit includes a substrate, diode device, first snapback device, ring structure, second snapback device and a control circuit. The diode device is formed in the substrate. The first snapback device is formed in the substrate and includes a first heavy ion-doped region, a first gate and a second heavy ion-doped region. The first heavy ion-doped region is coupled to the diode device. The first gate is coupled to the second heavy ion-doped region. The ring structure is formed in the substrate and includes a third heavy ion-doped region located. The second gate is formed on the substrate between the second heavy ion-doped region and the third heavy ion-doped region to generate a second snapback device. The control circuit is connected to the third heavy ion-doped region for preventing the turn-on of a parasitic SCR formed in the substrate in a normal operation.

Abstract: In an ESD protection structure and method utilizing substrate triggering for a high-voltage tolerant pad on a substrate, an ESD protection device has a source connected to the pad and a gate and a drain both connected to a ground, and a substrate-triggering control circuit is used to keep the substrate at a low voltage during a normal operation, and pumping the substrate to a high voltage during an ESD event for the ESD protection device to be triggered much easier. The substrate-triggering control circuit is implemented with an active device, thereby reducing the chip size for the circuit and the loading effect on the pad.

Abstract: An ESD protection circuit includes a substrate, diode device, first snapback device, ring structure, second snapback device and a control circuit. The diode device is formed in the substrate. The first snapback device is formed in the substrate and includes a first heavy ion-doped region, a first gate and a second heavy ion-doped region. The first heavy ion-doped region is coupled to the diode device. The first gate is coupled to the second heavy ion-doped region. The ring structure is formed in the substrate and includes a third heavy ion-doped region located. The second gate is formed on the substrate between the second heavy ion-doped region and the third heavy ion-doped region to generate a second snapback device. The control circuit is connected to the third heavy ion-doped region for preventing the turn-on of a parasitic SCR formed in the substrate in a normal operation.

Abstract: An ESD protection circuit connected between an input pad and an internal circuit is disclosed. The ESD protection circuit includes a main ESD protection device, a first resistor and a secondary device. The main ESD protection device is connected to the input pad for clamping a voltage of the input pad. The first resistor has a first end connected to the input pad and a second end connected to the internal circuit. The secondary device is connected to the second end of the first resistor and the main ESD protection device for clamping a voltage of the internal circuit. During an ESD event, the secondary device is turned on first to receive an ESD current and accordingly provides a trigger current to turn on the main ESD protection device.

Abstract: An ESD protection device for a pad includes an adjusting circuit, a snapback element and a control circuit. The adjusting circuit includes a silicon controlled rectifier (SCR) coupled to the pad. The SCR includes a first diode. The snapback element is coupled to a first N pole of the first diode when a second diode is not used, and is coupled to a second N pole] of the second diode when the second diode is used. The control circuit is coupled to the first N pole. In a normal operation mode, the control circuit provides a first voltage to the first N pole so that the first N pole collects a plurality of charges and the SCR is turned off. In an ESD mode, the control circuit does not provide the first voltage to the first N pole so that the first N pole does not collect the charges.

Abstract: An electrostatic discharge (ESD) protection circuit coupled to an input pad comprises a diode formed in a substrate and coupled to the input pad; a P deep well formed in the substrate; an N well formed in the P deep well; a first P+ doped region in the N well; and an NMOS transistor formed on the substrate, comprising a gate, a source and a drain, wherein the drain is formed in the N well and coupled to a Vcc, and the source is formed in the P deep well; and a second P+ doped region formed in the P deep well. The ESD protection circuit uses a smaller area than the conventional ESD protection circuit.

Abstract: In an ESD protection structure and method utilizing substrate triggering for a high-voltage tolerant pad on a substrate, an ESD protection device has a source connected to the pad and a gate and a drain both connected to a ground, and a substrate-triggering control circuit is used to keep the substrate at a low voltage during a normal operation, and pumping the substrate to a high voltage during an ESD event for the ESD protection device to be triggered much easier. The substrate-triggering control circuit is implemented with an active device, thereby reducing the chip size for the circuit and the loading effect on the pad.

Abstract: A device for connection between supply buses in mixed power integrated circuits includes a diode in series with a transistor with an active p-ring in a semiconductor substrate. The active p-ring surrounds the source and drain of the transistor with a conductive region having the same conductivity type as the semiconductor substrate. A control circuit coupled to the p-ring applies a bias voltage in response to an ESD event affecting the first and second conductors. The bias voltage tends to inject carriers into the semiconductor substrate which enables discharge of the short voltage pulse via a parasitic SCR in the substrate from the anode of the diode to the source of the transistor.

Abstract: In an ESD protection structure and method utilizing substrate triggering for a high-voltage tolerant pad on a substrate, an ESD protection device has a source connected to the pad and a gate and a drain both connected to a ground, and a substrate-triggering control circuit is used to keep the substrate at a low voltage during a normal operation, and pumping the substrate to a high voltage during an ESD event for the ESD protection device to be triggered much easier. The substrate-triggering control circuit is implemented with an active device, thereby reducing the chip size for the circuit and the loading effect on the pad.