Abstract: A method of processing a semiconductor substrate is provided. The semiconductor substrate may be placed on a spin chuck with a plurality of holding members, each holding member including a pin having a sloped portion to provide a gap between an upper edge of the substrate and the pin. Thereafter, one or more treatment fluids may be dispensed over the substrate.

Abstract: A shaft assembly that pivotally couples a first module body to a second module body includes two double shaft hinges and a main cover plate. One end of each double shaft hinge pivotally couples to the first module body, and another end pivotally couples to the second module body. The first module body is pivotable about a first axis with respect to the second module body via the double shaft hinges, and the second module body is pivotable about a second axis with respect to the first module body via the double shaft hinges. The first axis parallels the second axis, and the first axis is closer to the first module body than the second axis to the first module body. The main cover plate is located between the two double shaft hinges, and two ends of the main cover plate are respectively connected to the two double shaft hinges.