Patents by Inventor Chun-hsiang YEH

Chun-hsiang YEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11133200
    Abstract: A method of processing a semiconductor substrate is provided. The semiconductor substrate may be placed on a spin chuck with a plurality of holding members, each holding member including a pin having a sloped portion to provide a gap between an upper edge of the substrate and the pin. Thereafter, one or more treatment fluids may be dispensed over the substrate.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: September 28, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Liang Tai, Chun-Hsiang Fan, Kuo-Bin Huang, Ming-Hsi Yeh
  • Publication number: 20210232182
    Abstract: A shaft assembly that pivotally couples a first module body to a second module body includes two double shaft hinges and a main cover plate. One end of each double shaft hinge pivotally couples to the first module body, and another end pivotally couples to the second module body. The first module body is pivotable about a first axis with respect to the second module body via the double shaft hinges, and the second module body is pivotable about a second axis with respect to the first module body via the double shaft hinges. The first axis parallels the second axis, and the first axis is closer to the first module body than the second axis to the first module body. The main cover plate is located between the two double shaft hinges, and two ends of the main cover plate are respectively connected to the two double shaft hinges.
    Type: Application
    Filed: May 14, 2020
    Publication date: July 29, 2021
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Chi Zen PENG, Chun-hsiang YEH, Jian-Ming PENG, Chih-yu CHEN