Abstract: There is provided a system and method of examination of a semiconductor specimen. The method includes obtaining a group of defect candidates associated with respective inspection locations represented in an inspection coordinate system; using a trained machine learning (ML) model to provide, for each defect candidate, a probability of the defect candidate being a defect of interest (DOI), and ranking the group of defect candidates to an ordered list according to respective probabilities thereof, in response to a part of the ordered list of defect candidates being reviewed by a review tool in accordance with an order thereof, receiving a predefined number of DOIs associated with respective review locations represented in a review coordinate system; and calculating an offset between the review coordinate system and the inspection coordinate system based on respective inspection and review locations associated with the predefined number of DOIs.

Abstract: A system that may include a movable support module for supporting an object and a controller, wherein the controller is configured to: receive an estimated location of a movable support module that supports an object and temperature information about an actual or estimated temperature of at least a portion of the object support module; and calculate movable support module location information, in response to (a) the estimated location of the movable support module, (b) the temperature information, and (c) a mapping between (i) values of the temperature information, (ii) estimated locations of the movable support module, and (iii) location errors of the movable support module.

Abstract: A system that may include a chamber, a motorized system, a chuck, a controller, multiple temperature sensors and a cooling module; wherein the chuck is configured to support an object that is positioned within the chamber; wherein the motorized system is configured to move the chuck in relation to the chamber; wherein the multiple temperature sensors are configured to sense multiple temperatures of at least one point within the chamber; wherein the cooling module is configured to cool a unit of the motorized system; and wherein the controller is configured to control the cooling module in response to the multiple temperatures.

Abstract: A system that may include a chamber, a motorized system, a chuck, a controller, multiple temperature sensors and a cooling module; wherein the chuck is configured to support an object that is positioned within the chamber; wherein the motorized system is configured to move the chuck in relation to the chamber; wherein the multiple temperature sensors are configured to sense multiple temperatures of at least one point within the chamber; wherein the cooling module is configured to cool a unit of the motorized system; and wherein the controller is configured to control the cooling module in response to the multiple temperatures.

Abstract: A system that may include a movable support module for supporting an object and a controller, wherein the controller is configured to: receive an estimated location of a movable support module that supports an object and temperature information about an actual or estimated temperature of at least a portion of the object support module; and calculate movable support module location information, in response to (a) the estimated location of the movable support module, (b) the temperature information, and (c) a mapping between (i) values of the temperature information, (ii) estimated locations of the movable support module, and (iii) location errors of the movable support module