Patents by Inventor Chun-Hsien Chen

Chun-Hsien Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210327818
    Abstract: A connecting structure includes a first dielectric layer disposed over a substrate and a conductive feature, a doped dielectric layer disposed over the first dielectric layer, a first metal portion disposed in the first dielectric layer and in contact with the conductive feature, and a doped metal portion disposed over the first metal portion. The first metal portion and the doped metal portion include a same noble metal material. The doped dielectric layer and the doped metal portion include same dopants.
    Type: Application
    Filed: February 9, 2021
    Publication date: October 21, 2021
    Inventors: Kuo-Ju Chen, Chun-Hsien Huang, Su-Hao Liu, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo
  • Patent number: 11153973
    Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: October 19, 2021
    Assignee: CYNTEC CO., LTD.
    Inventors: Kaipeng Chiang, Da-Jung Chen, Bau-Ru Lu, Chun Hsien Lu
  • Patent number: 11152383
    Abstract: A memory cell may include first and second storage transistors. A first capacitor includes a first capacitor active region disposed within a substrate and a capacitor plate comprised of a first floating gate portion of a floating gate. A second capacitor includes a second capacitor active region disposed within the substrate and a capacitor plate comprised of a second floating gate portion of the floating gate. The first storage transistor includes source/drain regions disposed within a bit line write region and a first gate electrode comprised of a third floating gate portion of the floating gate. The second storage transistor includes source/drain regions disposed within a bit line read region and a second gate electrode comprised of a fourth floating gate portion of the floating gate. The bit line read and write regions are offset from one another by a non-zero distance.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: October 19, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Hsien Chen, Chun-Yao Ko, Felix Ying-Kit Tsui
  • Patent number: 11152262
    Abstract: A method includes etching a gate structure to form a trench extending into the gate structure, wherein sidewalls of the trench comprise a metal oxide material, applying a sidewall treatment process to the sidewalls of the trench, wherein the metal oxide material has been removed as a result of applying the sidewall treatment process and filling the trench with a first dielectric material to form a dielectric region, wherein the dielectric region is in contact with the sidewall of the gate structure.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: October 19, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Yi Lee, Ting-Gang Chen, Chieh-Ping Wang, Hong-Hsien Ke, Chia-Hui Lin, Tai-Chun Huang
  • Publication number: 20210318415
    Abstract: A virtual reality positioning device including a casing, a plurality of lenses, and a plurality of optical positioning components is provided. The casing has a plurality of holes. The lenses are installed in the holes, respectively, where a field angle of each of the lenses is greater than or equal to 120 degrees and less than or equal to 160 degrees, and the lenses include convex lenses or Fresnel lenses. The optical positioning components are installed in the casing and aligned to the lenses, respectively. In addition, a virtual reality positioning system and manufacturing method of a virtual reality positioning device are provided.
    Type: Application
    Filed: April 1, 2021
    Publication date: October 14, 2021
    Applicants: Acer Incorporated, STARVR CORPORATION
    Inventors: Li Lin, Ker-Wei Lin, Chun-Ta Chen, Chun-Yu Chen, Hao-Ming Chang, Chun-Hsien Chen, Shih-Ting Huang, Hui-Yen Wang
  • Patent number: 11139234
    Abstract: A package carrier includes a substrate, at least one interposer disposed in at least one opening of the substrate, a conductive structure layer, a first build-up structure, and a second build-up structure. The interposer includes a glass substrate, at least one conductive via, at least one first pad, and at least one second pad. The conductive via passes through the glass substrate, and the first and the second pads are disposed respectively on an upper surface and a lower surface of the glass substrate opposite to each other and are connected to opposite ends of the conductive via. The conductive structure layer is disposed on the substrate and is structurally and electrically connected to the first and the second pads. The first and the second build-up structures are disposed respectively on the first and the second surfaces of the substrate and are electrically connected to the conductive structure layer.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: October 5, 2021
    Assignee: Unimicron Technology Corp.
    Inventors: Wei-Ti Lin, Chun-Hsien Chien, Yu-Hua Chen
  • Patent number: 11132031
    Abstract: An electronic device including a first body, a second body, a hinge structure, an electronic assembly and a linkage mechanism is provided. The first body and the second body are pivoted to each other through the hinge structure. The electronic assembly is disposed on the first body. The linkage mechanism is disposed in the first body and connected between the hinge structure and the electronic assembly. When the second body is closed to the first body, the electronic assembly is hidden between the first body and the second body. When the second body is opened relative to the first body with an opening angle less than a predetermined angle, the hinge structure does not drive the linkage mechanism. When the second body is opened relative to the first body with the opening angle not less than the predetermined angle, the hinge structure drives the linkage mechanism and the linkage mechanism drives the electronic assembly to be opened relative to the first body.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: September 28, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Che-Hsien Lin, Che-Hsien Chu, Ko-Yen Lu, Chun-Chieh Chen, Chen-Ming Lee, Yi-Hung Chen, I-Chien Huang
  • Publication number: 20210296168
    Abstract: Generally, examples are provided relating to conductive features that include a barrier layer, and to methods thereof. In an embodiment, a metal layer is deposited in an opening through a dielectric layer(s) to a source/drain region. The metal layer is along the source/drain region and along a sidewall of the dielectric layer(s) that at least partially defines the opening. The metal layer is nitrided, which includes performing a multiple plasma process that includes at least one directional-dependent plasma process. A portion of the metal layer remains un-nitrided by the multiple plasma process. A silicide region is formed, which includes reacting the un-nitrided portion of the metal layer with a portion of the source/drain region. A conductive material is disposed in the opening on the nitrided portions of the metal layer.
    Type: Application
    Filed: June 4, 2021
    Publication date: September 23, 2021
    Inventors: Wei-Yip Loh, Chih-Wei Chang, Hong-Mao Lee, Chun-Hsien Huang, Yu-Ming Huang, Yan-Ming Tsai, Yu-Shiuan Wang, Hung-Hsu Chen, Yu-Kai Chen, Yu-Wen Cheng
  • Publication number: 20210286408
    Abstract: A foldable display including a first bracket, a second bracket, a rotating shaft connecting the first and the second brackets, at least one third bracket screwed to the rotating shaft, a fourth bracket movably coupled to the second and the third brackets, a flexible display disposed on the first and the fourth brackets, and a flexible supporting member disposed on the flexible display to be bent or flattened along with the flexible display is provided. The rotation of the rotating shaft drives the fourth bracket via the third bracket to move relative to the second bracket. The flexible supporting member is filled in a space composed of the fourth bracket, the second bracket, the first bracket, and the flexible display. A portable electronic device is also disclosed.
    Type: Application
    Filed: October 12, 2020
    Publication date: September 16, 2021
    Applicant: Acer Incorporated
    Inventors: Yen-Chou Chueh, Chun-Hsien Chen, Chi-Tai Ho, Chih-Heng Tsou, Chun-Hung Wen
  • Publication number: 20210280591
    Abstract: Various embodiments of the present disclosure are directed towards a memory cell including first and second storage transistors. A first capacitor includes a first capacitor active region disposed within a substrate and a capacitor plate comprised of a first floating gate portion of a floating gate. A second capacitor includes a second capacitor active region disposed within the substrate and a capacitor plate comprised of a second floating gate portion of the floating gate. The first storage transistor includes source/drain regions disposed within a bit line write region and a first gate electrode comprised of a third floating gate portion of the floating gate. The second storage transistor includes source/drain regions disposed within a bit line read region and a second gate electrode comprised of a fourth floating gate portion of the floating gate. The bit line read and write regions are offset from one another by a non-zero distance.
    Type: Application
    Filed: March 3, 2020
    Publication date: September 9, 2021
    Inventors: Shih-Hsien Chen, Chun-Yao Ko, Felix Ying-Kit Tsui
  • Publication number: 20210280592
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a first well region, second well region, and third well region disposed within a substrate. The second well region is laterally between the first and third well regions. An isolation structure is disposed within the substrate and laterally surrounds the first, second, and third well regions. A floating gate overlies the substrate and laterally extends from the first well region to the third well region. A dielectric structure is disposed under the floating gate. A bit line write region is disposed within the second well region and comprises source/drain regions disposed on opposite sides of the floating gate. A bit line read region is disposed within the second well region, is laterally offset from the bit line write region by a non-zero distance, and comprises source/drain regions disposed on the opposite sides of the floating gate.
    Type: Application
    Filed: October 13, 2020
    Publication date: September 9, 2021
    Inventors: Shih-Hsien Chen, Chun-Yao Ko, Felix Ying-Kit Tsui
  • Publication number: 20210282277
    Abstract: A circuit carrier board includes a first substrate and a second substrate bonding to the first substrate. The first substrate includes a first circuit layer connecting to a plurality of conductive structure. The conductive structures connect to electronic elements. The second substrate contacts the first circuit layer. The second substrate includes a plurality of stacked dielectric layers, and a plurality of second circuit layers are disposed in the dielectric layers. The bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and the topmost layer of the second circuit layers is electrically connected to the first circuit layer. The conductive structure includes a pad and a conductive via. The pad electrically connects to the first circuit layer. A linewidth of the first circuit layer is smaller than a linewidth of the second circuit layer. A manufacturing method of the circuit carrier board is also provided.
    Type: Application
    Filed: May 10, 2021
    Publication date: September 9, 2021
    Applicant: Unimicron Technology Corp.
    Inventors: Wei-Ti Lin, Chun-Hsien Chien, Fu-Yang Chen
  • Patent number: 11105990
    Abstract: The present invention is to provide an optical transceiver module comprising a housing, a substrate, an optical receiving device and a plurality of optical transmitting devices. The substrate is disposed in the housing. The optical receiving device is disposed on the substrate. The plurality of optical transmitting devices are connected to the substrate, and there is a tilt angle between the optical transmitting devices and the substrate.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: August 31, 2021
    Assignee: USENLIGHT CORPORATION
    Inventors: Chun-Yang Chang, Yun-Cheng Huang, Wen-Hsien Li, Cheng-Hung Lu, Ming-Ju Chen, Chang-Cherng Wu
  • Patent number: 11099152
    Abstract: The present disclosure provides a bio-field effect transistor (BioFET) device and methods of fabricating a BioFET and a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a gate structure disposed on a first surface of a substrate and an interface layer formed on a second surface of the substrate. The substrate is thinned from the second surface to expose a channel region before forming the interface layer.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: August 24, 2021
    Inventors: Yi-Shao Liu, Chun-Ren Cheng, Ching-Ray Chen, Yi-Hsien Chang, Fei-Lung Lai, Chun-Wen Cheng
  • Publication number: 20210240230
    Abstract: An electronic device includes a first body, a second body pivoted to the first body and a magnetic force mechanism. The first body includes a driving portion. The second body includes a casing, a flexible display and a supporting mechanism movably disposed in the casing. The flexible display is attached to the supporting mechanism. The magnetic force mechanism is disposed in the casing, wherein a portion of the magnetic force mechanism is exposed from the casing and abuts against the driving portion. The magnetic force mechanism is magnetically coupled to the supporting mechanism, wherein the magnetic force mechanism generates a magnetic attraction force or a magnetic repulsion force to the supporting mechanism by the second body rotating relative to the first body.
    Type: Application
    Filed: April 22, 2021
    Publication date: August 5, 2021
    Applicant: Acer Incorporated
    Inventors: Chun-Hung Wen, Wei-Chih Wang, Chi-Tai Ho, Yu-Cheng Shih, Hui-Ping Sun, Chun-Hsien Chen, Kuan-Lin Chen, Chih-Heng Tsou, Yen-Chou Chueh
  • Publication number: 20210217485
    Abstract: A method of establishing a coronary artery disease (CAD) prediction model for CAD screening includes establishing a data set in a computer equipment; entering the data set and corresponding future CAD condition of asymptomatic individuals into a machine learning component; selecting a plurality of robust variables from the clinical data and the cardiovascular markers of the cardiovascular markers panel by using feature selection methods; establishing the CAD prediction model by using machine learning methods; uploading new clinical data and new results of the cardiovascular markers to the cloud-based platform when any asymptomatic individuals undergo the health examination, and performing calculation and analysis by the CAD prediction model; and notifying the asymptomatic individuals of having a high risk of encountering a CAD event or not in a certain period of follow-up time.
    Type: Application
    Filed: April 1, 2021
    Publication date: July 15, 2021
    Applicants: CHANG GUNG MEMORIAL HOSPITAL, LINKOU, Chang Gung University, CATHAY GENERAL HOSPITAL
    Inventors: Jang-Jih Lu, Chun-Hsien Chen, Hsin-Yao Wang, Yi-Hsin Chan, Wei-Shang Shih
  • Patent number: 11041778
    Abstract: A configurable leak detection system comprising a leak detection device and at least a leak detection covering comprising a leak detection region having a first and second electrode and at least an attachable region is provided. The first and second electrodes are disposed spaced apart and fixed in firm contact with the covering. The system is attached onto liquid cooling systems, bases, and/or fluid conduits. When liquid is leaked onto the covering, the liquid is absorbed therein, until the dampened region extends over some point on each of the first and second electrodes. An electrical current is conducted, providing a low resistance path therebetween. An impedance change is detected, an alert means is generated, and the leak detection device is reset. More than one configurable leak detection system is attached onto systems, bases and/or fluid conduits via the at least an attachable region, and then electrically coupled together.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: June 22, 2021
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chu yi Kuo, Wen hong Chen, Chun hsien Chen
  • Patent number: 11042037
    Abstract: An earphone including a base, a cover, a rotating plate, a speaker, a displacement transducer and a follower is provided. The cover is disposed on the base. The rotating plate is rotatably disposed between the base and the cover. The speaker is disposed between the base and the cover. The displacement transducer is fixed to the base and located between the base and the cover. The rotating plate is coupled to the follower, and the follower is coupled to displacement transducer. A head-mounted display is further provided.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: June 22, 2021
    Assignee: Acer Incorporated
    Inventors: Chun-Hung Wen, Chun-Hsien Chen
  • Patent number: 11023004
    Abstract: A head-mounted display includes a head belt, a frame, a first locking element, a display assembly and a second locking element. The frame is connected to the head belt. The first locking element is disposed at the peripheral of the frame and includes a first locking portion and an unlocking portion adjacent to each other. The second locking element is disposed at the peripheral of the display assembly and includes a second locking portion. The display assembly is fixed to the frame by means of the second locking portion of the second locking element being locked to the first locking portion of the first locking element. The second locking portion is aligned with the unlocking portion, and the locking relation between the second locking portion of the second locking element and the first locking portion of the first locking element is released by the operation of the unlocking portion.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: June 1, 2021
    Assignees: STARVR CORPORATION, Acer Incorporated
    Inventors: Chun-Hung Wen, Chun-Hsien Chen, Chi-Tai Ho, Kuan-Lin Chen
  • Patent number: 11023015
    Abstract: An electronic device includes a first body, a second body pivoted to the first body and a magnetic force mechanism. The first body includes a driving portion. The second body includes a casing, a flexible display and a supporting mechanism movably disposed in the casing. The flexible display is attached to the supporting mechanism. The magnetic force mechanism includes a sliding rod slidably disposed at the casing, a first magnet, a second magnet and a third magnet. The first magnet is disposed at the sliding rod and faces the supporting mechanism. The second magnet and the third magnet are disposed at the supporting mechanism and face the sliding rod. The sliding rod has a driven end exposed from the casing and abuts against the driving portion. The first magnet is aligned with the second magnet or is aligned with the third magnet.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: June 1, 2021
    Assignee: Acer Incorporated
    Inventors: Chun-Hung Wen, Wei-Chih Wang, Chi-Tai Ho, Yu-Cheng Shih, Hui-Ping Sun, Chun-Hsien Chen, Kuan-Lin Chen, Chih-Heng Tsou, Yen-Chou Chueh