Patents by Inventor Chun-Hsien Fu

Chun-Hsien Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240123479
    Abstract: A recycling apparatus for a solar cell module includes a platform for supporting and positioning the solar cell module, and at least one milling device disposed on the platform and having a milling member configured to contact a back plate of the solar cell module, and a casing defining a chip-receiving space and having an air inlet and a suction port communicating with the chip-receiving space. A drive device is connected to the at least one milling device for driving the at least one milling device to move around and mill the solar cell module through the milling member.
    Type: Application
    Filed: October 28, 2021
    Publication date: April 18, 2024
    Applicant: NATIONAL UNIVERSITY OF TAINAN
    Inventors: Yao-Hsien FU, Hsueh-Pin TAI, Chia-Tsung HUNG, Cheng-Chen LIU, Chun-Chih HU, How-Wei KE
  • Patent number: 6159819
    Abstract: A method of fabricating of a capacitor with low voltage coefficient of capacitance is described. A silicon substrate with field oxide isolations is provided. A buried layer is formed by doping N-type impurities into the substrate as the bottom plate of the capacitor. A dielectric layer is formed by thermal oxidation for the capacitor, and then a polysilicon layer is formed by the low pressure chemical vapor deposition method. A thermal diffusion step is performed to dope phosphorus into the polysilicon layer. After formation of a polysilicide layer by the low pressure chemical vapor deposition method, arsenic ions are implanted into the polysilicon layer and the polysilicide layer. Finally the polysilicide layer and the polysilicon layer are partially etched in consequence, and the top plate of the capacitor is formed.
    Type: Grant
    Filed: January 5, 1998
    Date of Patent: December 12, 2000
    Assignee: United Microelectronics Corp.
    Inventors: Ching-Huei Tsai, Horn-Jaan Lin, Chun-Hsien Fu