Patents by Inventor Chun-Hsien Lu

Chun-Hsien Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240355847
    Abstract: A CMOS image sensor includes a unit pixel array including a photodiode array, a color filter array, a micro-lens array, and a grid isolation structure laterally separating adjacent color filters. The grid isolation structure includes a first low-n grid, a second low-n grid underlying the first low-n grid, and a metal grid within the second low-n grid, the first low-n grid being narrower than the second low-n grid. The color filter array includes color filter matrixes, all color filter matrixes have the same arrangement pattern. Sizes of color filters in each color filter matrix vary depending on locations of the color filters in the color filter matrix. In an edge portion, a distance between a center of a color filter matrix and a center of a corresponding unit pixel matrix in plan view varies depending on a location of the unit pixel matrix in the CMOS image sensor.
    Type: Application
    Filed: April 20, 2023
    Publication date: October 24, 2024
    Inventors: Ming-Hsien YANG, Wei-Chih WENG, Chun-Wei CHIA, Chun-Hao CHOU, Tse Yu TU, Chien Nan TU, Chun-Liang LU, Kuo-Cheng LEE
  • Publication number: 20240274636
    Abstract: A pixel sensor array of an image sensor device described herein may include a deep trench isolation (DTI) structure that includes a plurality of DTI portions that extend into a substrate of the image sensor device. Two or more subsets of the plurality of DTI portions may extend around photodiodes of a pixel sensor of the pixel sensor array, and may extend into the substrate to different depths. The different depths enable the photocurrents generated by the photodiodes to be binned and used to generate unified photocurrent. In particular, the different depths enable photons to intermix in the photodiodes, which enables quadradic phase detection (QPD) binning for increased PDAF performance. The increased PDAF performance may include increased autofocus speed, increased high dynamic range, increased quantum efficiency (QE), and/or increased full well conversion (FWC), among other examples.
    Type: Application
    Filed: February 15, 2023
    Publication date: August 15, 2024
    Inventors: Ming-Hsien YANG, Chun-Hao CHOU, Kuo-Cheng LEE, Chien Nan TU, Chun-Wei CHIA, Tse-Yu TU, Ya-Min HUNG, Cheng-Hao CHIU, Chun-Liang LU
  • Publication number: 20240243124
    Abstract: A method for fabricating a semiconductor device includes the steps of first forming a first gate structure on a substrate and then forming a first epitaxial layer adjacent to the first gate structure. Preferably, a top surface of the first epitaxial layer includes a first curve, a second curve, and a third curve connecting the first curve and the second curve, in which the first curve and the second curve include curves concave downward while the third curve includes a curve concave upward.
    Type: Application
    Filed: February 15, 2023
    Publication date: July 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Wei Yang, Shih-Min Lu, Chi-Sheng Tseng, Yao-Jhan Wang, Chun-Hsien Lin
  • Patent number: 11809069
    Abstract: A coaxial laser light source apparatus includes at least one laser light source module, a beam homogenizer, and optical path adjusting elements. The laser light source module includes multiple laser light sources arranged along a first direction, and each of the laser light sources is configured to emit a laser light along a second direction. The first direction is substantially perpendicular to the second direction, and the laser lights have different properties. The laser lights travel along the second direction toward the beam homogenizer coaxially. The optical path adjusting elements are located between the laser light sources and the beam homogenizer, and the optical path adjusting elements are configured to adjust traveling directions of the laser lights.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: November 7, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chun-Hsien Lu, Yu-Nien Lin
  • Patent number: 11744009
    Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: August 29, 2023
    Assignee: CYNTEC CO., LTD.
    Inventors: Kaipeng Chiang, Da-Jung Chen, Bau-Ru Lu, Chun Hsien Lu
  • Patent number: 11703692
    Abstract: A laser light source depolarizer includes a laser light source, a light angle adjusting element, a birefringent crystal, and an integration rod. The laser light source is configured to emit a laser light. The light angle adjusting element is configured to change the diffusion angle of the laser light. The light angle adjusting element is disposed between the laser light source and the birefringent crystal. The birefringent crystal is disposed between the light angle adjusting element and the integration rod, and the birefringent crystal is configured to break the polarity of the laser light.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: July 18, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventor: Chun-Hsien Lu
  • Publication number: 20220382139
    Abstract: A coaxial laser light source apparatus includes at least one laser light source module, a beam homogenizer, and optical path adjusting elements. The laser light source module includes multiple laser light sources arranged along a first direction, and each of the laser light sources is configured to emit a laser light along a second direction. The first direction is substantially perpendicular to the second direction, and the laser lights have different properties. The laser lights travel along the second direction toward the beam homogenizer coaxially. The optical path adjusting elements are located between the laser light sources and the beam homogenizer, and the optical path adjusting elements are configured to adjust traveling directions of the laser lights.
    Type: Application
    Filed: November 8, 2021
    Publication date: December 1, 2022
    Inventors: Chun-Hsien LU, Yu-Nien LIN
  • Publication number: 20220382068
    Abstract: A laser light source depolarizer includes a laser light source, a light angle adjusting element, a birefringent crystal, and an integration rod. The laser light source is configured to emit a laser light. The light angle adjusting element is configured to change the diffusion angle of the laser light. The light angle adjusting element is disposed between the laser light source and the birefringent crystal. The birefringent crystal is disposed between the light angle adjusting element and the integration rod, and the birefringent crystal is configured to break the polarity of the laser light.
    Type: Application
    Filed: November 8, 2021
    Publication date: December 1, 2022
    Inventor: Chun-Hsien LU
  • Patent number: 11299744
    Abstract: The present disclosure relates to transgenic plants that over-express PP2CABA and methods of using such for enhancing osmotic stress tolerance.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: April 12, 2022
    Assignee: Academia Sinica
    Inventors: Su-May Yu, Chun-Hsien Lu, Tuan-Hua David Ho, Shuen-Fang Lo
  • Publication number: 20220007502
    Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.
    Type: Application
    Filed: September 17, 2021
    Publication date: January 6, 2022
    Inventors: KAIPENG CHIANG, DA-JUNG CHEN, BAU-RU LU, CHUN HSIEN LU
  • Patent number: 11153973
    Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: October 19, 2021
    Assignee: CYNTEC CO., LTD.
    Inventors: Kaipeng Chiang, Da-Jung Chen, Bau-Ru Lu, Chun Hsien Lu
  • Patent number: 11134570
    Abstract: An electronic module includes: a lead frame having at least one metal strip and a plurality of metal leads, wherein a magnetic body encapsulates a portion of each of the at least one metal strip with two ends of each of the at least one metal strip not covered by the magnetic body; and a substrate disposed on the lead frame, wherein the substrate is electrically connected to the plurality of metal leads and the at least one metal strip.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: September 28, 2021
    Assignee: CYNTEC CO., LTD.
    Inventors: Chun Hsien Lu, Bau-Ru Lu, Kaipeng Chiang
  • Patent number: 11024702
    Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein electronic devices and conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the electronic devices, and the magnetic device is disposed over and electrically connected to the conductive pillars, wherein at least one recess or groove can be formed on the bottom surface of the conductive pillar, such as copper pillar, to help the venting of the soldering material as well as to increase the soldering area.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: June 1, 2021
    Assignee: CYNTEC CO., LTD.
    Inventors: Bau-Ru Lu, Jianhong Zeng, Chun Hsien Lu
  • Patent number: 11017934
    Abstract: The present invention discloses an electronic module. The electronic module comprises: a substrate, having a top surface and a bottom surface; a plurality of coils on the top surface of the substrate, wherein each coil comprises a corresponding first end and a corresponding second end; and a molding body, disposed on the substrate to encapsulate said coils, wherein said corresponding first end and said corresponding second end of each coil are electrically coupled to a corresponding first electrode and a corresponding second electrode of the electronic module.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: May 25, 2021
    Assignee: CYNTEC CO., LTD.
    Inventors: Bau-Ru Lu, Chun Hsien Lu, Da-Jung Chen
  • Publication number: 20210105898
    Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.
    Type: Application
    Filed: October 4, 2019
    Publication date: April 8, 2021
    Inventors: KAIPENG CHIANG, DA-JUNG CHEN, BAU-RU LU, CHUN HSIEN LU
  • Publication number: 20200286980
    Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein electronic devices and conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the electronic devices, and the magnetic device is disposed over and electrically connected to the conductive pillars, wherein at least one recess or groove can be formed on the bottom surface of the conductive pillar, such as copper pillar, to help the venting of the soldering material as well as to increase the soldering area.
    Type: Application
    Filed: November 21, 2019
    Publication date: September 10, 2020
    Inventors: Bau-Ru Lu, Jianhong Zeng, Chun Hsien Lu
  • Patent number: 10551551
    Abstract: A light guide plate includes a light guide layer and a first microstructure layer. The light guide layer has a light exit surface, a back surface, and a light incidence surface interconnecting the light exit surface and the back surface. The first microstructure layer is disposed on the back surface, and includes a plurality of first microstructures spaced apart from one another. Each first microstructure has a polygonal planar base, and two first inclined faces and two second inclined faces which extend from the planar base, and which are proximal and distal to the light incidence surface, respectively. Each first inclined face intersects the respective second inclined face at a respective first ridge. Each first ridge cooperates with the planar base to form a first angle that ranges from 5 to 70 degrees.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: February 4, 2020
    Assignee: OPTIVISION TECHNOLOGY INC.
    Inventors: Li-Jen Hsu, Chun-Hsien Lu, Huan-Hsiang Li, Tsung-Hsien Wu
  • Publication number: 20190235150
    Abstract: A light guide plate includes a light guide layer and a first microstructure layer. The light guide layer has a light exit surface, a back surface, and a light incidence surface interconnecting the light exit surface and the back surface. The first microstructure layer is disposed on the back surface, and includes a plurality of first microstructures spaced apart from one another. Each first microstructure has a polygonal planar base, and two first inclined faces and two second inclined faces which extend from the planar base, and which are proximal and distal to the light incidence surface, respectively. Each first inclined face intersects the respective second inclined face at a respective first ridge. Each first ridge cooperates with the planar base to form a first angle that ranges from 5 to 70 degrees.
    Type: Application
    Filed: October 30, 2018
    Publication date: August 1, 2019
    Inventors: Li-Jen HSU, Chun-Hsien LU, Huan-Hsiang LI, Tsung-Hsien WU
  • Patent number: 10367330
    Abstract: A diffuser includes a first substrate and a gel layer. The first substrate has a first refractive index n1. The gel layer includes a body and at least one microstructure. The body is disposed on the first substrate. The microstructure is disposed on the body, wherein the dimension of the microstructure is smaller than that of the body. The body is located between the microstructure and the first substrate. The gel layer has a second refractive index n2, and n1>n2.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: July 30, 2019
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Keh-Su Chang, Chun-Hsien Lu, Yen-I Chou, Chi Chen
  • Publication number: 20190204380
    Abstract: An embodiment includes a first lead guide, a second lead guide, and a handler. The first lead guide includes a first insulating housing and a first conductive contact having a face and a recessed face. The second lead guide includes a second insulating housing and a second conductive contact. The first and second lead guides are fastened to the handler.
    Type: Application
    Filed: January 24, 2018
    Publication date: July 4, 2019
    Inventors: Chi-Tsung LEE, Ching-Han CHANG, Chun-Hsien LU