Abstract: A light source apparatus includes a light-emitting module and a control unit. The light-emitting module is for providing a light. The control unit switches the light emitted from the light-emitting module between a first light and a second light, wherein the circadian stimulus value (CS/P value) of the second light is less than CS/P value of the first light, and the color temperatures of the second light and the first light are substantially the same as each other.

Abstract: A semiconductor light source device is provided. The semiconductor light source device includes a light guide, at least one semiconductor light source set and at least one light transformation coupler. The light transformation coupler is disposed between the semiconductor light source set and the light guide for guiding the light emitted from the semiconductor light source set to the light guide. The light transformation coupler has an inclined surface and a curved surface. The inclined surface is a multi-level inclined surface with several slopes.

Abstract: An optical coupling module includes a silicon photonic substrate, and an optical waveguide module. The silicon photonic substrate has a first surface and a first grating on the first surface for diffracting the light which passes through the grating. The optical waveguide module is disposed on the silicon photonic substrate, wherein the optical waveguide module includes an optical waveguide having an end disposed in corresponding to the first grating of the silicon photonic substrate. Otherwise, the optical waveguide module has a reflective surface coupled to the end of the optical waveguide and adapted to reflect the light emerging from or incident into the grating to form an optical path between the silicon photonic substrate and the optical waveguide for transmitting the light.

Abstract: A modularized illuminating device includes a retaining base, a lighting module, and a light guide element. The retaining base includes an elastic positioning unit. The lighting module is removably disposed on the retaining base, and has a sliding groove and a retaining groove. The light guide element is disposed on the retaining base and faces to the lighting module. When the lighting module is installed to the retaining base along a plugging direction, the elastic positioning unit slides from the sliding groove to the retaining groove to retain the lighting module in the retaining base.

Abstract: An illuminating device includes a first light module and a second light module. The first light module emits a first light beam to a first illuminating area, and the second light module emits a second light beam to a second illuminating area. The first light module includes a first blue chip emitting a blue light with a main wave peak from 461 nm to 480 nm.

Abstract: A light source apparatus includes a light-emitting module and a control unit. The light-emitting module is for providing a light. The control unit switches the light emitted from the light-emitting module between a first light and a second light, wherein the circadian stimulus value (CS/P value) of the second light is less than CS/P value of the first light, and the color temperatures of the second light and the first light are substantially the same as each other.

Abstract: A modularized illuminating device includes a retaining base, a lighting module, and a light guide element. The retaining base includes an elastic positioning unit. The lighting module is removably disposed on the retaining base, and has a sliding groove and a retaining groove. The light guide element is disposed on the retaining base and faces to the lighting module. When the lighting module is installed to the retaining base along a plugging direction, the elastic positioning unit slides from the sliding groove to the retaining groove to retain the lighting module in the retaining base.

Abstract: An optical interactive panel includes a cladding layer, a first waveguide array, a second waveguide array, a first set of image sensor, and a second set of image sensor. The cladding layer has a first index of refraction. The first waveguide array has first waveguide channels formed on the cladding layer, wherein the first waveguide channels have a second index of refraction less than the first index of refraction, and extending at a first direction. The second waveguide array has second waveguide channels, formed on the cladding layer and extending at a second direction. The first set of image sensor detects a first set of light signals from the first waveguide channels to determine a first-direction location. The second set of image sensor detects a second set of light signals from the second waveguide channels to determine a second-direction location.

Abstract: An optical interactive panel includes a cladding layer, a first waveguide array, a second waveguide array, a first set of image sensor, and a second set of image sensor. The cladding layer has a first index of refraction. The first waveguide array has first waveguide channels formed on the cladding layer, wherein the first waveguide channels have a second index of refraction less than the first index of refraction, and extending at a first direction. The second waveguide array has second waveguide channels, formed on the cladding layer and extending at a second direction. The first set of image sensor detects a first set of light signals from the first waveguide channels to determine a first-direction location. The second set of image sensor detects a second set of light signals from the second waveguide channels to determine a second-direction location.

Abstract: An optical interconnection module includes at least one optoelectronic element, at least one substrate, and at least one optical coupling element. A plurality of matching elements is formed on one side of the optical coupling element opposite to the optoelectronic element and the substrate. A plurality of alignment elements is formed in the optoelectronic element and the substrate at positions corresponding to the matching elements. The matching elements and alignment elements are engaged with each other for alignment, such that the optoelectronic element, the substrate and the optical coupling element are directly aligned during assembly. Moreover, the optical coupling element is used to increase the optical coupling efficiency of the optoelectronic element and an optical waveguide formed on the substrate.

Abstract: A hybrid electro-optical circuit board including a plate, a light guiding hole and a light-guide device. The light guiding hole is formed in the plate to be connected to an upper surface and a lower surface of the plate. The light-guide device is formed on the lower surface and covers and contacts the light guiding hole. An optical signal is transmitted between the light-guide device and the upper surface of the plate via the light guiding hole. A metal layer is further formed on an inner wall of the light guiding hole, to reduce the roughness of the inner wall and reflects the optical signal by the reflection characteristics of metal. Further, the light guiding hole is filled with a transparent substance to transmit the optical signal and to stop foreign material from entering the light guiding hole.

Abstract: A hybrid electro-optical circuit board and a method for fabricating the same are provided. The hybrid electro-optical circuit board includes a plate, and a light guiding hole is formed in the plate for connecting an upper surface and a lower surface of the plate. A light-guide device is formed on the lower surface and covers the light guiding hole for transmitting an optical signal between the light-guide device and the upper surface of the plate via the light guiding hole. A metal layer is formed on an inner wall of the light guiding hole to reduce the roughness of the inner wall and reflects optical signal by the reflection characteristics of metal. Thus, the decay of the intensity of optical signal is reduced. A transparent substance is filled into the light guiding hole for transmitting the optical signal and stopping invaders from entering the light guiding hole.

Abstract: An optical interconnection module includes at least one optoelectronic element, at least one substrate, and at least one optical coupling element. A plurality of matching elements is formed on one side of the optical coupling element opposite to the optoelectronic element and the substrate. A plurality of alignment elements is formed in the optoelectronic element and the substrate at positions corresponding to the matching elements. The matching elements and alignment elements are engaged with each other for alignment, such that the optoelectronic element, the substrate and the optical coupling element are directly aligned during assembly. Moreover, the optical coupling element is used to increase the optical coupling efficiency of the optoelectronic element and an optical waveguide formed on the substrate.

Abstract: An optical transmitter module includes light-emitting devices with coaxial type packaging. Coplanar anode and cathode electrodes of one light-emitting device are mounted on a substrate so that heat generated from the light-emitting device can be effectively dissipated through the substrate. Furthermore, the direct electric connection between the light-emitting device and the substrate eliminates the requirement of wire boding for electric connection, increasing the performance of the optical transmitter module in high speed signal operation.

Abstract: An optical transmitter module includes light-emitting devices with coaxial type packaging. Coplanar anode and cathode electrodes of one light-emitting device are mounted on a substrate so that heat generated from the light-emitting device can be effectively dissipated through the substrate. Furthermore, the direct electric connection between the light-emitting device and the substrate eliminates the requirement of wire boding for electric connection, increasing the performance of the optical transmitter module in high speed signal operation.

Abstract: A receiver optical subassembly for transforming received optical signal into electrical signal includes at least a ceramic substrate, a photo receiver and a transimpedance amplifier. There are high-speed traces formed on the substrate. The positive and negative pads of the photo receiver are coplanar and connected to the traces without wire bonding so as to reduce the parasitic impedance effect and improve the high-speed performance of the optical subassembly. The transimpedance amplifier is electrically connected to the traces via flip chip, wire bonding or other methods. The photo receiver and the transimpedance amplifier are connected via the high-speed traces formed on the substrate.

Abstract: A three-dimensional scanning system, that scans a three-dimensional object and calculates a three-dimensional coordinate data from a surface of the object. The three-dimensional scanning system has a photoelectron detector, a rotational scanning device, a drive device, an image processing circuit, and an operational control device. The photoelectron detector projects a light plane onto the object and then receives a reflected light stripe. The rotational scanning device couples with the photoelectron detector that rotates on a fixed pivot and allows the light stripe to scan on the object's surface. The drive device couples to and operates the photoelectron detector and the rotational scanning device. The image processing circuit can grab the light stripe instantly. The operational control device couples with the rotational scanning device and the photoelectron detector.

Abstract: A three-dimensional scanning system, that scans a three-dimensional object and calculates a three-dimensional coordinate data from a surface of the object. The three-dimensional scanning system has a photoelectron detector, a rotational scanning device, a drive device, an image processing circuit, and an operational control device. The photoelectron detector projects a light plane onto the object and then receives a reflected light stripe. The rotational scanning device couples with the photoelectron detector that rotates on a fixed pivot and allows the light stripe to scan on the object's surface. The drive device couples to and operates the photoelectron detector and the rotational scanning device. The image processing circuit can grab the light stripe instantly. The operational control device couples with the rotational scanning device and the photoelectron detector.